TECHNOVISION, INC. Product Lineup

The "TV-150/TV-200/TV-300" is a standard type of vacuum mount that attaches wafers to dicing tape in a vacuum environment. By performing the attachment process inside a vacuum chamber, it suppresses the retention of air bubbles, which can be problematic in atmospheric attachment, and achieves uniform and highly reproducible attachment quality across the entire wafer surface. It is a compact, versatile model that can accommodate a wide range of processes. TV-150: 150mm (6 inches) TV-200: 200mm (8 inches) TV-300: 300mm (12 inches)

The "TV-200H/TV-300H" is a heated vacuum mount that combines a vacuum adhesion method with a heating function. By heating the adhesion stage, it stabilizes the properties of the adhesive tape, and through the synergistic effect with vacuum adhesion, it achieves a more uniform and reproducible mounting quality. This model is suitable for processes where temperature conditions affect adhesion quality and for applications where process variation needs to be minimized. 【Supported Wafer Sizes】 TV-200H: 200mm (8 inches) TV-300H: 300mm (12 inches)

The "TV-200T" is a vacuum mount designed to accommodate wafers with step or special shapes on the outer edge, such as TAIKO(R) wafers and thin wafers. By adopting a bonding method using a top membrane, it achieves "radial bonding," which uniformly applies tape from the center of the wafer outward. This helps to suppress stress concentration and uneven bonding on the outer edge specific to TAIKO(R) wafers, providing stable mounting quality. 【Compatible Wafer Size】 TV-200T: 200mm (8 inches) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.

The "TV-200TH" is a vacuum mount that combines a membrane bonding method compatible with TAIKO(R) wafers and a heating function. By applying radial bonding in a vacuum environment, it suppresses stress concentration on the unique outer edge steps and thin sections of TAIKO(R) wafers, and by stabilizing the properties of the adhesive tape with a heated chuck, it achieves high bonding uniformity and reproducibility. This is the top model designed for processes with high difficulty, such as thin wafers and high-value-added devices. 【Compatible wafer size】 TV-200TH: 200mm (8 inches) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.

The wafer mount / tape mount is a tape application device that instantly adheres "wafers," "dicing frames," and various films/tapes without bubbles. It allows for the easy application of uniform tape to wafers, which is considered important in the dicing process. TechnoVision's wafer mount offers a wide range of equipment options tailored to various purposes, from research and development to semi-production applications. The manual type wafer mount is available in three work sizes: - 300mm (12 inches) - 200mm (8 inches) - 150mm (6 inches) (Free demo units are also available for loan.) Additionally, there are devices with specifications tailored for specific applications, such as dicing and back grinding. The application targets are not limited to wafers; the device can accommodate various workpieces such as packages, glass, ceramics, and more. Custom solutions can also be flexibly provided to meet users' special specifications.

A semi-automatic tabletop type small tape applicator compatible with 12 inches (300mm) tape. It is the optimal tape applicator that can accommodate the diverse conditions of tape application and lamination. This device responds to customers who wish to "automate the crucial application process" even with a manual device, and further "set application conditions and quantitatively manage application quality!" Even inexperienced operators can perform application tasks with stable quality, similar to that of skilled workers.

The PFM-9008 is a manual wafer mount for pre-cut tape. While expensive specialized equipment was previously required for applying pre-cut tape, this can now be done with a simple manual machine. It is ideal for R&D and small quantity applications.

The operator will only handle the setting and removal of the work, and all subsequent tasks will be fully automated. This will contribute to the stability of the tape/film application process and improve yield.

The FM-664 series has been developed as a device that can accommodate both pre-cut tape and normal tape. Two types of wafer sizes are available: ■ FM-6648: Up to 8 inches ■ FM-6643: Up to 12 inches This device can instantly attach various tapes to silicon wafers and dicing frames without bubbles. It has been developed to support both pre-cut tape and normal tape. It can be used not only as a dedicated device for pre-cut tape or normal tape but also as a versatile device that can handle the applications listed below.

The "Tape Mount Handbook" is a technical document from Techno Vision, which develops and sells semiconductor manufacturing equipment, cleaning equipment, and post-process assembly equipment. This document includes an overview of the "Tape Application Process in the Dicing Process," as well as solutions to issues and details about the equipment. [Contents (partial)] ■ Overview ■ Tape Application ■ In the case of manual application ■ If you are already using a tape mount ■ Techno Vision manufactured mount *For more details, please refer to the PDF document or feel free to contact us.