大日商事 List of Products and Services

We would like to introduce the "Wafer Processing Equipment" handled by Dai Nichi Shoji Co., Ltd. The "Laser Scribers" are scribers for wafers such as sapphire, GaN, SiC, and quartz. The "High-Speed Chip Transfer Device" achieves a speed of 0.2 seconds per piece for sheet-to-sheet transfers and is also compatible with sheet-to-tray transport. Additionally, we handle "Atmospheric Plasma/Vacuum Plasma Devices" that can modify surfaces before printing, as well as "Shipping Adhesive Trays" for the storage and transport of precision parts compatible with LEDs and LDs. 【Laser Scribers Features】 ■ High-speed throughput: Achieves 800 mm/sec ■ Debris-free processing ■ Accommodates wafer warping and thickness variations ■ Compatible with diameters from φ2 to φ6 inches ■ Patent pending *For more details, please refer to the PDF document or feel free to contact us.

• Other inspection equipment and devices

We would like to introduce the "Cleaning Equipment" handled by Dai Nichi Shoji Co., Ltd. The "Pure Water and Semi-Pure Water Inline Cleaning Equipment" includes nine types of cleaning devices, such as cleaning equipment for photochemical parts and glass substrates, as well as NC spray cleaning devices. The "Flux Cleaning Device" is a compact shower-type device capable of powerful cleaning with upper and lower pure water showers, while the "Hydrocarbon and Organic Solvent Vacuum Cleaner" is a product with a proven track record in cleaning sealed press parts. We also handle the "PC Board Cleaner," which removes debris and burrs from printed circuit boards. 【Pure Water and Semi-Pure Water Inline Cleaning Equipment Lineup】 ■ Cleaning Equipment for Photochemical Parts and Glass Substrates ■ NC Spray Cleaning Device ■ Semiconductor Package Cleaning Device (Direct Path Cleaning Device) ■ Inline Glass Substrate Cleaning Device (Counter Ultrasonic and Brush Cleaning Process) ■ Wafer Cleaning Device *For more details, please refer to the PDF materials or feel free to contact us.

• Other inspection equipment and devices

We would like to introduce the "joining materials" handled by Dai Nichi Shoji Co., Ltd. The "Pb-free solder paste" comes in two types: water-washable and no-clean. The viscosity of the water-washable type is 160 Pa.s, while the no-clean type has a viscosity of 180 Pa.s. We offer two types of "BGA balls": low melting point and high melting point. For "flux," we have three types with different viscosities available. 【Main compositions (Pb-free solder paste)】 ■ Sn-Ag-Cu ■ Sn-Zn-Al(Bi) ■ Sn-Ag-Cu-Co ■ High melting point options are also available. *For more details, please refer to the PDF document or feel free to contact us.

• Other inspection equipment and devices

We would like to introduce the "Reflow Equipment" handled by Dai Nichi Shoji Co., Ltd. The "N2 Compact Size Reflow" is a product that achieves a compact size with a total length of 2.5m and 6 zones, compatible with packages such as BGA/CSP. The "φ6-8 Inch Wafer BUMP Reflow" can be used as a wet back device for bump formation after solder plating, while the "φ8-12 Inch Wafer BUMP Reflow" is suitable for reflow after ball mounting and bump printing. Additionally, we also handle "Vacuum Reflow Equipment" and "Desktop Reflow Equipment." [N2 Compact Size Reflow Features] ■ Max 350℃ (±2.5℃) ■ Compatible Size: Max 250×230mm ■ Oxygen Concentration in Oven: 50ppm and above ■ 3-phase 200V 20kW ■ Combination of hot air circulation and far infrared radiation is possible *For more details, please refer to the PDF materials or feel free to contact us.

• Other inspection equipment and devices

Dainichi Shoji Co., Ltd. introduces the "Inspection Equipment" it handles. The "Wafer and Chip Appearance Inspection Equipment" achieves labor-saving with high-speed throughput and is capable of inspecting micro-cracks, foreign substances, and pattern defects. The "Small Glass Substrate Appearance Inspection Equipment" can detect minute scratches and dirt on small glass substrates such as those used in smartphones. Additionally, we also handle the "Electronic Component 6-Surface Appearance Inspection Equipment," which can perform high-speed inspection of chip components from six sides, processing approximately 1,500 pieces per minute. 【Wafer and Chip Appearance Inspection Equipment Features】 ■ Compatible with 2-inch to 12-inch sizes ■ Supports Si wafers, compounds, glass, etc. ■ Inspection of warped wafers and chips after dicing ■ Automatic discrimination function / Map data storage function ■ Resolution: 1.5μm *For more details, please refer to the PDF document or feel free to contact us.

• Other inspection equipment and devices

This catalog features the product lineup handled by the post-process department. We offer a wide range of products, including the "Wafer and Chip Appearance Inspection Equipment" compatible with 2-inch to 12-inch sizes, as well as "N2 Compact Size Reflow" and "Solder Paste." [Featured Products (Excerpt)] ■ Inspection Equipment ■ Reflow Equipment ■ Joining Materials ■ Cleaning Equipment ■ Wafer Process Equipment ■ Others *For more details, please refer to the PDF document or feel free to contact us.

• Other inspection equipment and devices
• Other cleaning machines
• Wafer processing/polishing equipment

The vacuum tweezers, Conductive C Series / Chemical Resistant F Series, exhibit excellent airtightness and durability by having the internal tweezers valve finished with a mirror surface. Additionally, dust generation during button opening and closing has been minimized. The precisely machined unique valve structure promises stable performance over long periods for the repeated tasks of wafer adhesion and instant release. The exposure of metal parts has been minimized, allowing for safe handling. 【Features】 ○ The suction chip has a highly polished finish on the suction surface. ○ Prevents particle generation and maintains stable suction surface accuracy for long-term use. ○ The tweezers body is connected to the tube via a connector. ○ The body can be easily detached from the tube. ○ The suction chip comes in a variety of sizes, allowing for a wide selection to accommodate various wafer sizes. For more details, please contact us or download the catalog.

• Other conveying machines
• Transport and handling robots

The Bernoulli chuck generates a stronger suction force by utilizing Bernoulli's principle to expel air. The transported object makes point contact with the edge of the Bernoulli chuck's surface, allowing it to be transported with stable holding power in a non-contact state at the center of the wafer, without rotation. The main body is designed to accommodate various wafer sizes with just one unit. 【Features】 - The main body can be selected from three angles of use: 20 degrees, 45 degrees, and 90 degrees. - By changing the guide ring compatible with different inches, it can be used for wafers ranging from 2 to 12 inches. - The use of conductive nylon resin for the main body reduces weight. - There are patterns printed on both sides, accommodating wafers that are 50µm thin and difficult to handle. - Custom designs tailored to specific objects, such as square shapes, are also available. For more details, please contact us or download the catalog.

• Other conveying machines

At Dai Nichi Shoji Co., Ltd., we offer a variety of cleaning system lineups optimized for different environments, ranging from water-based and semi-water-based to organic solvent-based and hydrocarbon-based. Our "water-based and semi-water-based cleaning devices" cater to all types of cleaning, from general cleaning to precision cleaning for electronic components and LCD-related items, using "water." Our "organic solvent-based cleaning devices" accommodate various new cleaning liquids, including traditional chlorine-based organic solvents, alternative fluorocarbons, and bromine-based solvents. Our "hydrocarbon-based cleaning devices" support new hydrocarbon cleaning agents and place particular emphasis on "rapid drying" after cleaning. We also handle "drying devices" and "ancillary devices for cleaning" that accompany the cleaning equipment. For more details, please contact us or refer to our catalog.

• Ultrasonic Cleaner
• Other cleaning machines

□ By extracting chips for each rank, high-speed operation is always possible. □ By partially modifying the mechanism as an option, it is also possible to change from tray arrangement to sheet arrangement. □ By installing an optional wafer loader, full automation is possible.

• Tester
• Parts feeder

The "Tack Sheet" is a sheet that securely holds precision parts, various assembly components, jigs, tools, and more with its diverse adhesive strength. We offer three types: the low outgassing "non-silicone type," the heat-resistant and chemical-resistant "silicone type," and the "conductive silicone type" that excels in conductivity, heat resistance, and chemical resistance. The adhesive strength can also be adjusted according to the application and target objects. 【Features】 ■ Three types of sheet materials are available according to the application ■ The non-silicone type has low outgassing properties ■ The conductive silicone type is conductive and excels in heat and chemical resistance ■ The silicone type excels in heat and chemical resistance *For more details, please refer to the PDF document or feel free to contact us.

• Plastic utensils and containers
• Other laboratory equipment and containers
• Other packaging materials

The "Tact Tray" is a tray that alleviates impact with the adhesive strength and elasticity of the sheet, safely protecting and holding mounted items without any rattling. The special sheet, which has a high adhesive effect without vacuum adhesion, holds mounted items securely while allowing for easy pickup (removal of mounted items), making it suitable for transporting delicate materials and precision parts with extremely thin shapes. Additionally, there is no need to change the tray based on the shape or size of the mounted items. 【Features】 ■ Uses low outgassing conductive resin (main body) ■ Low outgassing adhesive sheet is non-silicone ■ No vacuum devices or vacuum equipment needed for pickup ■ Can be stacked, effectively utilizing workspace ■ Utility model registered *For more details, please refer to the PDF document or feel free to contact us.

• Plastic utensils and containers
• Other laboratory equipment and containers
• tray

We propose environmentally friendly lead-free solder backed by experience and technology!

• Other metal materials
• Other polymer materials
• Reflow Equipment

Not only can we detect micro-defects (such as foreign substances and scratches) that occur on transparent substrates like sapphire, which have been difficult to inspect conventionally, but we can also automate and standardize the inspection process that has traditionally had a lot of variability when done by the naked eye.

• Visual Inspection Equipment
• Defect Inspection Equipment
• Circuit Board Inspection Equipment

□ The BGA package is compact yet designed with 6 zones. □ Achieves an oxygen concentration in the furnace of below 100 ppm. □ In-plane temperature distribution: ±2℃. □ Built-in catalytic device effective for in-furnace purification. □ Wafer transport uses a uniquely developed walking beam method.

• Reflow Equipment
• Other mounting machines
• Industrial Furnace

Easy to use! Easy to hold! For universities, research institutes, and researchers.

• Plasma surface treatment equipment
• Ashing device
• others

The "Tack Carrier" is a tray with an adhesive sheet that alleviates impact with the adhesive strength and elasticity of the sheet, safely protecting and holding the mounted items. It uses low outgassing conductive resin (body) and transparent static-resistant resin (lid). The adhesive sheet is non-silicone. The adhesive strength type 51 has a strong holding power for mounted items while allowing for easy pickup (removal of mounted items). 【Features】 ■ The adhesive sheet is non-silicone ■ The lid can be easily opened and closed, allowing for easy handling of mounted items ■ Can be stacked, effectively utilizing workspace ■ Size changes for printing patterns (frames, text) and printing of company logos are also possible (consult separately) *For more details, please refer to the PDF document or feel free to contact us.

• Plastic utensils and containers
• tray
• Other laboratory equipment and containers