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This product is a device suitable for quality control of semiconductors and electronic components for automotive applications in high-density mounting, capable of various bonding strength tests with just one unit. With a rich array of options, it allows for combinations tailored to the customer's intended use, enabling the acquisition of high-precision and highly reproducible data. Please feel free to contact us when you need assistance. 【Features】 ■ A versatile bond tester that can accommodate various bonding strength tests with one unit by exchanging load cells. ■ Compatible with MFC (Multi-Function Cartridge) that incorporates three types of sensors. ■ A variety of camera options for measurement observation are available. ■ The control software "Paragon" allows for the association and storage of photos of failure modes and measurement videos with the measurement data by using the camera options. *For more details, please download the PDF or feel free to contact us.

The long-selling DAGE4000 has been newly transformed. You can also use the 4000 load cell. It is a suitable device for manual pull and shear production bond tests, and it can be configured for simple wire pull tests, as well as upgraded for ball shear, die shear, ball pull, or tweezer pull/peel tests. Please feel free to contact us when you need assistance. 【Features】 ■ By replacing the load cell, it can accommodate various joint strength tests such as pull tests and shear tests. ■ The load cell replacement can be done in under 10 seconds using a one-touch method. ■ The tool touch-up accuracy during ball shear tests can be measured with high precision of ±1μm. ■ Device calibration can be easily performed by users using standard weights and fixtures, and the repeatability of the device can also be verified using standard weights. * For more details, please download the PDF or feel free to contact us.