iPROS Manufacturing
  • Search for products by classification category

    • Electronic Components and Modules
      Electronic Components and Modules
      56853items
    • Machinery Parts
      Machinery Parts
      71800items
    • Manufacturing and processing machinery
      Manufacturing and processing machinery
      96337items
    • Scientific and Physics Equipment
      Scientific and Physics Equipment
      33575items
    • Materials
      Materials
      35179items
    • Measurement and Analysis
      Measurement and Analysis
      52903items
    • Image Processing
      Image Processing
      14789items
    • Control and Electrical Equipment
      Control and Electrical Equipment
      50643items
    • Tools, consumables, and supplies
      Tools, consumables, and supplies
      63201items
    • Design and production support
      Design and production support
      11911items
    • IT/Network
      IT/Network
      41358items
    • Office
      Office
      13459items
    • Business support services
      Business support services
      32269items
    • Seminars and Skill Development
      Seminars and Skill Development
      5799items
    • Pharmaceutical and food related
      Pharmaceutical and food related
      25457items
    • others
      60663items
  • Search for companies by industry

    • Manufacturing and processing contract
      7349
    • others
      5031
    • Industrial Machinery
      4425
    • Machine elements and parts
      3283
    • Other manufacturing
      2872
    • IT/Telecommunications
      2530
    • Trading company/Wholesale
      2468
    • Industrial Electrical Equipment
      2315
    • Building materials, supplies and fixtures
      1819
    • software
      1641
    • Electronic Components and Semiconductors
      1564
    • Resin/Plastic
      1485
    • Service Industry
      1428
    • Testing, Analysis and Measurement
      1131
    • Ferrous/Non-ferrous metals
      980
    • environment
      701
    • Chemical
      631
    • Automobiles and Transportation Equipment
      561
    • Printing Industry
      510
    • Information and Communications
      449
    • Consumer Electronics
      421
    • Energy
      322
    • Rubber products
      313
    • Food Machinery
      302
    • Optical Instruments
      280
    • robot
      272
    • fiber
      251
    • Paper and pulp
      231
    • Electricity, Gas and Water Industry
      170
    • Pharmaceuticals and Biotechnology
      166
    • Warehousing and transport related industries
      144
    • Glass and clay products
      141
    • Food and Beverage
      133
    • CAD/CAM
      121
    • retail
      109
    • Educational and Research Institutions
      107
    • Medical Devices
      101
    • Ceramics
      95
    • wood
      89
    • Transportation
      83
    • Medical and Welfare
      62
    • Petroleum and coal products
      60
    • Shipbuilding and heavy machinery
      52
    • Aviation & Aerospace
      49
    • Fisheries, Agriculture and Forestry
      40
    • Public interest/special/independent administrative agency
      29
    • equipment
      24
    • self-employed
      23
    • Government
      20
    • Materials
      19
    • Research and development equipment and devices
      18
    • Mining
      17
    • Finance, securities and insurance
      13
    • Individual
      10
    • Restaurants and accommodations
      8
    • cosmetics
      8
    • Police, Fire Department, Self-Defense Forces
      7
    • Laboratory Equipment and Consumables
      3
    • Contracted research
      3
    • Raw materials for reagents and chemicals
      2
  • Special Features
  • Ranking

    • Overall Products Ranking
    • Overall Company Ranking
Search for Products
  • Search for products by classification category

  • Electronic Components and Modules
  • Machinery Parts
  • Manufacturing and processing machinery
  • Scientific and Physics Equipment
  • Materials
  • Measurement and Analysis
  • Image Processing
  • Control and Electrical Equipment
  • Tools, consumables, and supplies
  • Design and production support
  • IT/Network
  • Office
  • Business support services
  • Seminars and Skill Development
  • Pharmaceutical and food related
  • others
Search for Companies
  • Search for companies by industry

  • Manufacturing and processing contract
  • others
  • Industrial Machinery
  • Machine elements and parts
  • Other manufacturing
  • IT/Telecommunications
  • Trading company/Wholesale
  • Industrial Electrical Equipment
  • Building materials, supplies and fixtures
  • software
  • Electronic Components and Semiconductors
  • Resin/Plastic
  • Service Industry
  • Testing, Analysis and Measurement
  • Ferrous/Non-ferrous metals
  • environment
  • Chemical
  • Automobiles and Transportation Equipment
  • Printing Industry
  • Information and Communications
  • Consumer Electronics
  • Energy
  • Rubber products
  • Food Machinery
  • Optical Instruments
  • robot
  • fiber
  • Paper and pulp
  • Electricity, Gas and Water Industry
  • Pharmaceuticals and Biotechnology
  • Warehousing and transport related industries
  • Glass and clay products
  • Food and Beverage
  • CAD/CAM
  • retail
  • Educational and Research Institutions
  • Medical Devices
  • Ceramics
  • wood
  • Transportation
  • Medical and Welfare
  • Petroleum and coal products
  • Shipbuilding and heavy machinery
  • Aviation & Aerospace
  • Fisheries, Agriculture and Forestry
  • Public interest/special/independent administrative agency
  • equipment
  • self-employed
  • Government
  • Materials
  • Research and development equipment and devices
  • Mining
  • Finance, securities and insurance
  • Individual
  • Restaurants and accommodations
  • cosmetics
  • Police, Fire Department, Self-Defense Forces
  • Laboratory Equipment and Consumables
  • Contracted research
  • Raw materials for reagents and chemicals
Special Features
Ranking
  • Overall Products Ranking
  • Overall Company Ranking
  • privacy policy
  • terms of service
  • About Us
  • Careers
  • Advertising
  1. Home
  2. Machine elements and parts
  3. 日精 本社
  4. Product/Service List
Machine elements and parts
  • Added to bookmarks

    Bookmarks list

    Bookmark has been removed

    Bookmarks list

    You can't add any more bookmarks

    By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

    Free membership registration

日精 本社

EstablishmentDecember 16, 1953
capital45000Ten thousand
number of employees300
addressTokyo/Minato-ku/1-18-17 Nishi-Shinbashi (Meisan Nishi-Shinbashi Building)
phone0335029579
  • Special site
  • Official site
last updated:Oct 14, 2025
日精logo
  • Contact this company

    Contact Us Online
  • Before making an inquiry

    Download PDF
  • Company information
  • Products/Services(171)
  • catalog(169)
  • news(32)

日精 List of Products and Services

  • category

1~28 item / All 28 items

Displayed results

Filter by category

Universal Bond Tester Universal Bond Tester
Various semiconductor/substrate-related equipment Various semiconductor/substrate-related equipment
Various appearance inspection devices Various appearance inspection devices
Various cleaning devices/units Various cleaning devices/units
Dicing device Dicing device
Small-sized substrate antenna Small-sized substrate antenna
Various semiconductor-related cleaning equipment Various semiconductor-related cleaning equipment
Ultrafine bubbles (nanobubbles) Ultrafine bubbles (nanobubbles)
Biometric authentication Biometric authentication
Freeze dryer Freeze dryer
Switch Switch
UHF band tag inlet UHF band tag inlet
HF band tag and inlet HF band tag and inlet
NFC tag inlet NFC tag inlet
HF band products HF band products
UHF band products UHF band products
Other products Other products
Various

Various semiconductor/substrate-related equipment

Various semiconductor/substrate-related equipment

High-precision flip chip bonder "Athlete FA (manufactured by Asurito Co., Ltd.)"

It is a flip chip bonder capable of high-precision mounting with a tolerance of ±1μm (3σ). Demo tests are available.

It enables bonding control at low loads compared to conventional flip chip bonding, significantly reducing load and stress damage to bumps, aluminum pads, wiring, and more. The thermal shrinkage compensation function during cooling prevents failures such as cracks and disconnections, achieving a high-yield, highly reliable bonding process. Moreover, it is an innovative system capable of achieving bonding with high precision of ±1μm at 3σ.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Low-cost compound microscope

Achieving high performance at a low cost compared to conventional binocular stereo microscopes! We can offer it at about half the price of other companies' binocular stereo microscopes.

This is a compact optical microscope equipped with the functions necessary for routine work inspections. It provides clear images and a wide zoom range. With its unique optical system that achieves high flatness and deep focal depth, it meets a wide range of inspection needs. It is also ideal for device integration, featuring a compact body that excels in usability.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Tabletop UV irradiation device (top and bottom irradiation type) *Demo unit available for loan

Both upper and lower surfaces can be UV irradiated. Even with an affordable version that is easy to use, we thoroughly pursue cost-effectiveness (effectiveness) in curing.

- Low heat generation with energy-saving, human-friendly lamp adopted - Lamp and N2 On/Off linked with a timer - Built-in cooling fan (temperature-controlled variable) eliminates overheating concerns - Interlock mechanism and top cover hinge damper ensure safe operation - Lamp replacement is very easy - Achieves long lamp lifespan (exceeds 4,000 hours) - Equipped with an LCD screen for easy and reliable operation - Microcontroller-controlled, with external connection terminals (pin, USB) installed

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

[Compact & Lightweight] UV (Ultraviolet) Irradiation Device - Dual-Sided Irradiation Type

A compact curing device that can be used on a tabletop. It allows for both top and bottom irradiation, and its affordable price is also attractive! *Demo units available for loan.

This product is a UV irradiation device capable of dual-sided irradiation (top/bottom). Despite its compact size and reasonable price, it thoroughly pursues cost-effectiveness in "curing" (i.e., effectiveness). It is used in various fields such as research and development of semiconductors, resin materials, films, and adhesives. (Note: An LED lighting type is also available.) 【Features】 ■ Capable of dual-sided irradiation ■ Compact and lightweight ■ Lamp life exceeds 4,000 hours ■ Easy operation with a liquid crystal screen *For more details, please download the PDF or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

[Compact & Lightweight] UV-LED Irradiation Device

A compact LED curing device that can be used on a tabletop. It can emit light from both the top and bottom, and its affordable price is also attractive! *Demo units available for loan.

This product is an ultraviolet (UV) irradiation device. Despite being compact and reasonably priced, it thoroughly pursues cost-effectiveness in "curing" (i.e., effectiveness). It is utilized in various fields such as research and development of semiconductors, resin materials, films, and adhesives. Additionally, we also offer a fluorescent lamp type (note: this product uses LED lighting)! 【Features】 ■ UV irradiation is possible from both the top and bottom by changing the direction of the lamp ■ Compact and lightweight ■ Lamp lifespan exceeds 20,000 hours ■ Easy operation with a liquid crystal display *For more details, please download the PDF or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Formic Acid and Hydrogen Reduction Compatible Tabletop Vacuum Solder Reflow Device RSO-200

A super high-speed heating model capable of a maximum heating rate of 600 K/min, suitable for metal sintering. Manufactured by Unitemp Japan.

The "RSO-200" is a desktop vacuum solder reflow device that enables a void-free rate of up to 0.01%, making it suitable for solving challenges related to no-clean and lead-free soldering. In addition to "hydrogen reduction" for removing oxide films from the metal surfaces to be joined, it also supports "formic acid reduction." The powerful reducing effect of formic acid enhances wettability even without flux. Moreover, despite its compact design, which is among the smallest in the industry, it condenses various functions and performance to accommodate a wide range of prototype development. With its diverse reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace development. 【Features】 ■ Ultra-fast heating rate of 10°C per second, significantly reducing takt time with water cooling ■ Supports maximum temperature of 650°C ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Nearly achieves the set temperature profile as is, with high repeatability and almost zero overshoot ■ The in-plane temperature difference on the heating plate is nearly zero, allowing for uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF document or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Formic Acid and Hydrogen Reduction Compatible Tabletop Vacuum Solder Reflow Device VSS-300

300mm square compatible model. Can be linked with loaders and unloaders for mass production. Made by Unitec Japan.

This product is a tabletop vacuum solder reflow device that enables a maximum of 0.01% void-free soldering, making it suitable for addressing challenges related to fluxless and lead-free applications. It supports the removal of oxide films on the metal surfaces to be joined through "hydrogen reduction" and "formic acid reduction." The powerful reducing effect of formic acid enhances wettability even without flux. Additionally, despite its compact design, which is among the smallest in the industry, it consolidates the functions and performance needed for everything from prototype development to mass production into a single unit. With a wide variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace development. **Features** - Rapid heating at a speed of 2.5°C per second, significantly reducing takt time with water cooling - Maximum reachable temperature of 450°C (optional up to 650°C) - Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen - Almost perfectly realizes the set temperature profile, with high repeatability and nearly zero overshoot - The in-plane temperature difference on the heating plate is nearly zero, allowing for uniform heating of large workpieces *Free demo requests are also accepted. Please feel free to contact us.* *For more details, please refer to the PDF materials or feel free to reach out to us.*

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Formic Acid and Hydrogen Reduction Compatible Vacuum Solder Reflow Device RSS-210-S

Standard model that achieves high-reliability mounting such as fluxless, void-free, and lead-free. Made by Unitec Japan.

The "RSS-210-S" is a desktop vacuum solder reflow device that is suitable for solving challenges related to no-clean flux, void removal, and lead-free processes. It supports traditional "flux," "hydrogen reduction," and reduction using "formic acid." With the powerful reducing effect of formic acid, it effectively removes the oxide film on metal surfaces such as substrates, achieving improved wettability even without flux. Furthermore, by combining vacuum technology, it enables a maximum of 0.01% void-free results. With a variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting that meets the standards required for power devices and aerospace applications. 【Features】 ■ Rapid heating at 4°C per second, significantly reducing takt time due to water cooling ■ Maximum reachable temperature of 400°C (optional 500°C) ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Almost perfectly realizes the set temperature profile, with high repeatability and nearly zero overshoot ■ The in-plane temperature difference on the heating plate is close to zero, allowing for uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF materials or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-160-S

Standard model achieving high-reliability assembly such as fluxless, void-free, and lead-free. Manufactured by Unitec Japan.

The "RSS-160-S" is a desktop vacuum solder reflow device suitable for solving challenges related to no-clean flux, void removal, and lead-free processes. In addition to conventional "flux" and "hydrogen reduction," it also supports reduction using "formic acid." With the powerful reducing action of formic acid, it effectively removes oxide films from metal surfaces such as substrates, achieving improved wettability without flux. Furthermore, by combining vacuum technology, it enables a maximum of 0.01% void-free results. Despite its compact design, which is among the smallest in the industry, it condenses various functions and performance to support a wide range of prototype development. 【Features】 ■ Rapid heating at 100°C per minute, and with water cooling, significantly reduces takt time ■ Maximum reachable temperature of 400°C (optional 500°C) ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Nearly achieves the set temperature profile as is, with high repeatability and almost zero overshoot ■ The in-plane temperature difference on the heating plate is close to zero, allowing for uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF materials or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Formic acid and hydrogen reduction compatible vacuum solder reflow device RSS-110-S

Standard model that achieves high-reliability implementation such as fluxless, void-free, and lead-free. Manufactured by Unitec Japan.

The "RSS-110-S" is a desktop vacuum solder reflow device suitable for solving challenges related to no-clean, void removal, and lead-free processes. It supports traditional "flux," "hydrogen reduction," and reduction using "formic acid." With the powerful reducing action of formic acid, it effectively removes oxide films from metal surfaces such as substrates, achieving improved wettability even without flux. Furthermore, by combining vacuum technology, it enables a maximum of 0.01% void-free results. With a variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace applications. 【Features】 ■ Rapid heating at 2°C per second, significantly reducing takt time due to water cooling ■ Maximum reachable temperature of 400°C (optional 500°C) ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Nearly exact realization of the set temperature profile High repeatability with almost zero overshoot ■ Minimal in-plane temperature difference on the heating plate, allowing uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF materials or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

10X Optical Zoom Microscope AZ9T/AZ9C

A microscope capable of real-time observation and recording inside the chamber in conjunction with the main body. Manufactured by Unitec Japan.

The "AZ9T/AZ9C" is a microscope that achieves a working distance (WD) of 90 mm, an optical 10x zoom, and a resolution of 3 μm. During profile execution, it has previously been difficult to confirm the status of objects within the chamber. By attaching this product to the "viewing window" standardly equipped on the reflow unit and connecting it to the main unit, you can observe the melting of solder in real-time. Additionally, with a working distance (WD) of 90 mm, it captures sharp and clear images even when passing through the glass of the viewing window (10 mm thick). Furthermore, data can be saved to a PC not only as still images but also as videos. 【Features】 ■ Real-time observation of solder melting ■ Sharp and clear imaging even when passing through the glass of the viewing window (10 mm thick) ■ Data can be saved to a PC as still images or videos *For more details, please refer to the PDF document or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

RTP-100 High-Speed Annealing Heating System for Φ4 Compatible Vacuum and Process Gas

This is an annealing furnace manufactured by Unitemp Japan, applicable to a wide range of applications requiring rapid and uniform heat treatment, including the crystal growth of GaN.

The "RTP-100" is a tabletop vacuum process rapid heating furnace that is suitable for research and development as well as prototype development, and is among the smallest in the industry. It supports 4-inch wafers and allows for the processing of small samples using a dedicated susceptor. With a maximum temperature of 1200°C, it accommodates a variety of gas purge environments. It can be used for various purposes, such as crystal growth of new materials like GaN and SiC, and sintering of paste materials. 【Features】 - Supports nitrogen gas, oxygen gas, and forming gas (hydrogen + nitrogen) purging, as well as high-concentration hydrogen gas purging. - Enables precise rapid heating with 18 IR (infrared) heaters on the top and bottom. - High-purity quartz chamber. - Supports cooling through nitrogen gas purging. - Up to 4 process gas lines (MFC). - Achieves a vacuum level of 10^-1 Pa (10^-3 Pa possible with the HV model equipped with TMP). - Comes standard with a touch panel monitor for easy operation. *For more details, please refer to the PDF document or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Φ6 Compatible Vacuum/Process Gas High-Speed Annealing Heating System RTP-150

This is an annealing furnace that can be applied to a wide range of applications requiring rapid and uniform heat treatment, including the crystal growth of GaN. Manufactured by Unitemp Japan.

The "RTP-150" is a tabletop vacuum process rapid heating furnace that is suitable for research and development as well as prototype development, classified as one of the smallest in the industry. It supports a maximum temperature of 1000°C and accommodates a variety of gas purge environments. It can be used for various purposes, including crystal growth of new materials such as GaN and SiC, as well as sintering of paste materials. 【Features】 ■ Supports nitrogen gas, oxygen gas, forming gas (hydrogen + nitrogen) purging, as well as high-concentration hydrogen gas purging. ■ Enables precise rapid heating with 24 IR (infrared) heaters on the top and bottom. ■ High-purity quartz chamber. ■ Supports cooling using nitrogen gas purging method. ■ Up to 4 process gas lines (MFC). ■ Achieves vacuum levels of 10^-1 Pa (10^-3 Pa possible with HV model equipped with TMP). ■ Standard touch panel monitor for easy operation. *For more details, please refer to the PDF document or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Φ12 compatible high-speed annealing heating system VPO-1000-300

This is an annealing furnace that can be applied to a wide range of applications requiring rapid and uniform heat treatment, including the crystal growth of GaN. 【Testable】

The "VPO-1000-300" is a tabletop vacuum process high-speed heating furnace that is suitable for research and development as well as prototype development, and is among the smallest in the industry. It supports Φ12-inch, Φ6-inch, and 4-inch sizes, and allows for the processing of small sample pieces with a dedicated susceptor. With a maximum temperature of 1000°C, it accommodates a variety of gas purge environments. It can be used for the crystal growth of new materials such as GaN and SiC, as well as for the sintering of paste materials, making it versatile. 【Features】 ■ Supports nitrogen gas, oxygen gas, forming gas (hydrogen + nitrogen) purging, as well as high-concentration hydrogen gas purging. ■ Equipped with 24 IR (infrared) heaters for precise high-speed heating. ■ High-purity quartz chamber. ■ Cooling compatible with nitrogen gas purging method. ■ Up to 4 process gas lines (MFC). ■ Achieves a vacuum level of 0.1 Pa (10^-3 Pa possible with HV model equipped with TMP). ■ Standard touch panel monitor for easy operation. *For more details, please refer to the PDF document or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Manual Flip Chip Bonder CB-505 Athlete FA Model

Manual flip chip bonder suitable for small-scale production and various experiments.

The "CB-505" supports various packages (*1) and various bonding processes (*2) due to its highly versatile device concept. *1 MEMS, 5G, data communication, millimeter-wave sensors, photonics, AR fields, etc. *2 ACF, ACP, NCF, NCP, ultrasonic, etc. *For more details, please refer to the PDF materials or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Standard Type Clean Roller "RY Series"

It is a dust removal device suitable for both inline and outline applications. We offer a range from 2 to 5 units.

This series is a basic type of dust removal device used in various processes. We offer models ranging from 2 to 5 units, suitable for both inline and outline applications. The lineup includes the "RY-705B," which features a non-contact magnetic gear for the drive gear, and the "RY-505Z," a two-unit clean roller type with cleaning on both the upper and lower sides. We accommodate various customer requests for sheet products and roll-to-roll lines. 【Features】 ■ Clean Roller RY-705B - Employs a non-contact magnetic gear for the drive gear - A revolutionary clean roller that eliminates dust generation from within the device ■ Clean Roller RY-505Z - Arranges two clean rolls on both the upper and lower sides to double the dust removal effect - Ideal for surface dust removal of products before the lamination process or exposure process in automatic lines ■ Customized Products - Designed and manufactured to fit the customer's work size * We also accept demo evaluations to determine if removal is possible with samples provided. * For more details, please refer to the PDF materials or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Clean Roller "RY Series" Thin Plate Compatible Type

Dust removal device compatible with thin plates. Equipped with a magnetic gear in the drive unit! This single unit can accommodate a wide range of substrate thicknesses.

We would like to introduce the "Thin Plate Compatible Clean Roller." The "RY-1106 Series" utilizes a new type of clean roll with a small diameter, making it possible to remove dust from thin plates and films. Additionally, by adopting a magnetic gear in the drive section of the device, we suppress minute dust generation from the gear part. We also offer the "RFC-705A" and "RF-705A." 【Features】 ■ Prevents dropping ■ Clean roll that prevents entanglement ■ Uses magnetic gear in the drive section ■ Capable of cleaning 50μm workpieces ■ Customized products Designed and manufactured to fit the customer's work size * We also accept demo evaluations to determine if removal is possible with samples provided. * For more details, please refer to the PDF document or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Dust Removal Roll to Roll RUTR Series

We would like to propose a unit roller that meets your specifications.

We propose customized unit rollers tailored to your needs. We accommodate various specifications for roll-to-roll lines and vertical path lines, as well as designs for fixed installation units in line equipment. Our solutions are ideal for dust removal from films, substrates, and glass panels. 【Features】 - Manufactured to order according to customer requirements. - Capable of responding to various requests for installation and mounting in existing lines and equipment. - We can produce unit rollers up to 2,600mm based on our track record. - Suitable for long products in raw material processes and slitting processes. - Enhanced structural strength improves adhesion to products, allowing for high-speed flow rates of up to 250m/min. *We also accept demo evaluations to determine if removal is possible with samples provided. *For more details, please refer to the PDF document or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

High-precision semi-auto FC bonder 'CB-700 (Athlete FA model)'

Semi-auto FCB (Flip Chip Bonder) that meets a wide range of user needs.

The "CB-700 (Athlete FA model)" is an all-in-one FC bonder for R&D purposes. It features an advanced interactive MMIF interface that enhances operability. With high precision (±0.5μm [3σ]) and a wide load range (0.05 to 1000N) as its foundation, it accommodates various applications and broadly meets the needs of R&D. 【Features】 ■ Extremely low load capability and high precision bonding ■ Tool lift operation utilizing high precision Z-axis control ■ Capable of ultrasonic bonding with tool exchange ■ Suitable for process development *For more details, please refer to the PDF document or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Inline Laser Marking System "LMS-K500 Series"

Lasers can be selected from three types: CO2, YVO4, and UV, depending on the application! Equipped with a 3D laser marker that can mark large areas with high quality.

Optimal solution for traceability compliance. By replacing labels and stamps with laser printing, it is possible to promote cost reduction and labor saving. Printing can achieve fine markings even in narrow spaces, allowing for the embedding of large amounts of data onto individual circuit boards. The "LMS-K500 Series" is an inline laser marking system that can be equipped with various laser markers suitable for different applications, including CO2 lasers, fiber lasers, and UV lasers. Equipped with a vision camera, it supports alignment functions, 2D code reading judgment, and input direction determination as standard features. In addition to Japanese, English, and Chinese, it supports multiple languages (global compatibility), making it easy and reliable to implement in overseas factories. Please feel free to consult us for custom solutions, such as for M-size and L-size circuit boards, double-sided printing, and integration with MES systems. 【Features】 ■ SDGs-oriented airless system ■ Fully electric cylinder (no air supply required) ■ Equipped with KEYENCE-made laser markers, image processing, and control PLC ■ Equipped with a 3D laser marker that can mark large areas with high quality *For more details, please check the catalog download.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

EMS (Electronic Manufacturing Services)

From livelihood machinery to industrial equipment! Connecting and integrating the strengths of each business location across a wide range of fields through a network!

At Nichisei, we offer a one-stop service from procurement to printed circuit board assembly, sheet metal processing, and assembly. We accept contracts for the manufacturing of parts or finished products developed and designed by our customers, and we respond flexibly and seamlessly from prototype to small-batch production and mass production, including parts procurement. We connect and integrate the strengths of our various business locations across a wide range of fields, from consumer electronics to industrial equipment, and provide them to our customers in a one-stop manner. 【Our Strengths】 ■ We respond to customer needs for the manufacturing of various electronic products that require reliability, leveraging the knowledge and experience we have cultivated over many years. ■ We propose manufacturing solutions using our own FA products. *For more details, please refer to the PDF document or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

12-inch (300mm) wafer compatible LED UV irradiator

A compact LED curing device that can be used on a tabletop. It offers irradiation capabilities and is attractively priced! *Demo units available for loan.

This product is a UV irradiation device. It is compact and reasonably priced, while thoroughly pursuing cost-effectiveness in "curing" (i.e., effectiveness). It is used in various fields such as research and development of semiconductors, resin materials, films, and adhesives. We also offer a fluorescent lamp type (note: this product uses LED lighting)! 【Features】 ■ UV irradiation is possible by changing the direction of the lamp ■ Compact and lightweight ■ Lamp life exceeds 20,000 hours ■ Easy operation with a liquid crystal screen *For more details, please download the PDF or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

High-Precision Die Bonder "AB-1000" <Manufactured by Athlete FA>

High-speed Die Bonder compatible with micro and thin chips!

We would like to introduce the high-precision die bonder "AB-1000" manufactured by Athlete FA, which we handle. It achieves mounting accuracy of XY: ±5[μm], θ: ±1[deg] (±3σ). It is compatible with small and thin chips. It comes with calibration, traceability, and post-mount inspection functions. Please feel free to contact us if you have any requests. 【Features】 ■ Achieves high-precision mounting ■ Compatible with small and thin chips ■ Equipped with calibration function ■ Equipped with traceability function ■ Equipped with post-mount inspection function *For more details, please refer to the PDF document or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Single-board compatible microball-equipped machine 'BM-3500SI'

A new microball system that meets individual piece needs! Reduces ball consumption.

We would like to introduce the 'BM-3500SI', a micro ball mounting machine compatible with individual substrates, manufactured by Athlete FA. This product, designed for individual substrates, has been completed with optimized ball dispensing brushes to reduce ball consumption. By configuring flux printing and ball mounting with multiple units and implementing a two-step inspection and repair process, we have achieved a 1.5 times increase in UPH compared to the previous model. 【Features】 ■ Achieves compatibility with individual substrates ■ Configured with multiple units for flux printing and ball mounting, and a two-step inspection and repair process, achieving 1.5 times UPH compared to the previous model ■ Reduces ball consumption through optimized ball dispensing brushes ■ Delivers high performance *For more details, please refer to the PDF document or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Wafer-compatible Micro Ball Mounter BM-1310W

Achieves high-speed and stable solder ball mounting with a unique solder ball mounting method!

This is a micro ball mounter compatible with 8-inch and 12-inch wafers. It has evolved from the best-selling BM-1120W in the global market to the BM-1300W, and further advanced to the successor model BM-1310W, which achieves even faster and more stable ball mounting. 【Features】 ■ High-speed and stable ball mounting enabled by a unique ball mounting method ■ Simplified maintenance due to a simple mechanism ■ Compatible with silicon wafers and molded wafers ■ Optimized ball insertion method for efficient and waste-free ball usage ■ Compatible with SECS/GEM and AGV (optional) *For more details, please refer to the PDF document or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Wafer-Compatible Micro Ball Inspection Repair System BM-1150WR

Reliable solder ball repairs are performed by a repair unit that has accumulated unique image processing and proven results.

The BM-1120WR, developed alongside our micro ball mounter, has been highly regarded worldwide due to its CCD inspection system and reliable ball repair function, establishing itself as a best-selling model. Its successor, the BM-1150WR, combines accumulated image processing technology with a proven repair unit, achieving further improvements in mounting accuracy. 【Features】 ■ High-speed inspection of ball missing, excess balls, and pitch using a 12M camera Supports inspection of two types of balls with different diameters ■ Two types of repair support ・(a) Ball missing: Ball placement after applying flux ・(b) Excess balls: Removal by nozzle suction ■ Compatible with silicon wafers and molded wafers ■ Equipped with automatic calibration function ■ Supports SECS/GEM and AGV (optional) *For more details, please refer to the PDF document or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Substrate-Compatible Inline System BM-2100SI Plus

Features stable solder ball mounting and improves productivity through an inline system.

Integrating inspection and repair processes inline with a micro ball mounter compatible with substrates and panels. This achieves greater efficiency and significant productivity improvements on the production line. 【Features】 ■ An inline system that widely adapts to PCB and BGA size substrates for mounting, inspection, and repair of micro balls. ■ Fully automated production that does not touch the substrate, from material feeding to removal. ■ Improved productivity by processing each step in parallel. ■ Flexible connection with reflow and flux cleaning processes. *For more details, please refer to the PDF document or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Micro Ball Inspection Repair System for Substrates BM-2150SR

Reliable solder ball repair is performed using high-speed image processing and a uniquely developed repair unit.

A microball inspection and repair system capable of handling a wide range of sizes, from strip substrates to large panels. It also supports simultaneous inspection of two types of differently sized balls, assisting in achieving high implementation quality. 【Features】 ■ High-speed inspection of ball missing, excess balls, and pitch using an inspection camera (150Mx1) Supports inspection of two types of differently sized balls ■ Two types of repair support ・(a) Ball missing: Ball placement after applying flux ・(b) Excess balls: Removal by nozzle suction ■ An image processing system that follows the expansion of the C4 area due to the increase in package size ■ Compatible with SECS/GEM and AGV (optional) *For more details, please refer to the PDF document or feel free to contact us.

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Prev 1 Next
  • 大型金属造形や低コストな複合加工に。ロボットシステムの資料進呈

    大型金属造形や低コストな複合加工に。ロボットシステムの資料進呈

  • 【イプロス初主催】AIを活用したリアル展示会!出展社募集中

    【イプロス初主催】AIを活用したリアル展示会!出展社募集中

  • 100%紙製でプラスチックフリー! SDGs達成に貢献する緩衝材 もぐらっぷ クッション性に優れた凹凸形状 落下試験動画を公開中 カットサンプルも配布可能!
  • 少量~量産 精密~通常溶接 金属の溶接・接合はお任せください! 太陽イービーテックは、電子ビーム溶接、TIG溶接、真空ろう付け、トーチろう付けなど様々な加工に対応します。
    • Contact this company

      Contact Us Online
    • Before making an inquiry

      Download PDF

    Products

    • Search for Products

    Company

    • Search for Companies

    Special Features

    • Special Features

    Ranking

    • Overall Products Ranking
    • Overall Company Ranking

    support

    • site map
    IPROS
    • privacy policy Regarding external transmission of information
    • terms of service
    • About Us
    • Careers
    • Advertising
    COPYRIGHT © 2001-2025 IPROS CORPORATION ALL RIGHTS RESERVED.
    Please note that the English text on this page is automatically translated and may contain inaccuracies.