日精 List of Products and Services

It enables bonding control at low loads compared to conventional flip chip bonding, significantly reducing load and stress damage to bumps, aluminum pads, wiring, and more. The thermal shrinkage compensation function during cooling prevents failures such as cracks and disconnections, achieving a high-yield, highly reliable bonding process. Moreover, it is an innovative system capable of achieving bonding with high precision of ±1μm at 3σ.

- Low heat generation with energy-saving, human-friendly lamp adopted - Lamp and N2 On/Off linked with a timer - Built-in cooling fan (temperature-controlled variable) eliminates overheating concerns - Interlock mechanism and top cover hinge damper ensure safe operation - Lamp replacement is very easy - Achieves long lamp lifespan (exceeds 4,000 hours) - Equipped with an LCD screen for easy and reliable operation - Microcontroller-controlled, with external connection terminals (pin, USB) installed

This is a compact optical microscope equipped with the functions necessary for routine work inspections. It provides clear images and a wide zoom range. With its unique optical system that achieves high flatness and deep focal depth, it meets a wide range of inspection needs. It is also ideal for device integration, featuring a compact body that excels in usability.

This product is an ultraviolet (UV) irradiation device. Despite being compact and reasonably priced, it thoroughly pursues cost-effectiveness in "curing" (i.e., effectiveness). It is utilized in various fields such as research and development of semiconductors, resin materials, films, and adhesives. Additionally, we also offer a fluorescent lamp type (note: this product uses LED lighting)! 【Features】 ■ UV irradiation is possible from both the top and bottom by changing the direction of the lamp ■ Compact and lightweight ■ Lamp lifespan exceeds 20,000 hours ■ Easy operation with a liquid crystal display *For more details, please download the PDF or feel free to contact us.

This product is a UV irradiation device capable of dual-sided irradiation (top/bottom). Despite its compact size and reasonable price, it thoroughly pursues cost-effectiveness in "curing" (i.e., effectiveness). It is used in various fields such as research and development of semiconductors, resin materials, films, and adhesives. (Note: An LED lighting type is also available.) 【Features】 ■ Capable of dual-sided irradiation ■ Compact and lightweight ■ Lamp life exceeds 4,000 hours ■ Easy operation with a liquid crystal screen *For more details, please download the PDF or feel free to contact us.

The "RSS-3×210-S" is a desktop vacuum solder reflow device that enables a maximum void-free rate of 0.01%, making it suitable for solving challenges related to no-clean and lead-free soldering. It supports the removal of oxide films on the metal surfaces to be joined through "hydrogen reduction" and "formic acid reduction." The strong reducing effect of formic acid enhances wettability even without flux. Additionally, despite its compact design, which is among the smallest in the industry, it condenses various functions and performance to accommodate a wide range of prototype development. With a variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required in power devices and aerospace applications. **Features** - Rapid heating at a speed of 2°C per second, significantly reducing takt time due to water cooling - Near-zero in-plane temperature difference on the heating plate, allowing for uniform heating of large objects - Nearly exact realization of the set temperature profile, with high repeatability and almost zero overshoot - Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen *We also accept requests for free demonstrations. Please feel free to contact us.* *For more details, please refer to the PDF document or feel free to reach out to us.*

The RVS-210 is a tabletop vacuum solder reflow device that enables a maximum of 0.01% void-free soldering, making it suitable for solving challenges related to no-clean and lead-free processes. In addition to "hydrogen reduction" for removing the oxide layer on the metal surfaces to be joined, it also supports "formic acid reduction." The powerful reducing effect of formic acid improves wettability even without flux. Despite its compact design, which is among the smallest in the industry, it condenses all the necessary functions and performance for various prototype developments into one unit. With a wide range of reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace applications. **Features** - Rapid heating at a speed of 2°C per second, significantly reducing takt time due to water cooling - Supports a maximum temperature of 400°C - Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen - Almost perfectly realizes the set temperature profile with high repeatability and minimal overshoot - The in-plane temperature difference on the heating plate is close to zero, allowing for uniform heating of large workpieces *Free demo requests are also accepted. Please feel free to contact us.* *For more details, please refer to the PDF document or feel free to contact us.*

The "RSO-200" is a desktop vacuum solder reflow device that enables a void-free rate of up to 0.01%, making it suitable for solving challenges related to no-clean and lead-free soldering. In addition to "hydrogen reduction" for removing oxide films from the metal surfaces to be joined, it also supports "formic acid reduction." The powerful reducing effect of formic acid enhances wettability even without flux. Moreover, despite its compact design, which is among the smallest in the industry, it condenses various functions and performance to accommodate a wide range of prototype development. With its diverse reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace development. 【Features】 ■ Ultra-fast heating rate of 10°C per second, significantly reducing takt time with water cooling ■ Supports maximum temperature of 650°C ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Nearly achieves the set temperature profile as is, with high repeatability and almost zero overshoot ■ The in-plane temperature difference on the heating plate is nearly zero, allowing for uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF document or feel free to contact us.

The "VPO-1000-300" is a tabletop vacuum process high-speed heating furnace that is suitable for research and development as well as prototype development, and is among the smallest in the industry. It supports Φ12-inch, Φ6-inch, and 4-inch sizes, and allows for the processing of small sample pieces with a dedicated susceptor. With a maximum temperature of 1000°C, it accommodates a variety of gas purge environments. It can be used for the crystal growth of new materials such as GaN and SiC, as well as for the sintering of paste materials, making it versatile. 【Features】 ■ Supports nitrogen gas, oxygen gas, forming gas (hydrogen + nitrogen) purging, as well as high-concentration hydrogen gas purging. ■ Equipped with 24 IR (infrared) heaters for precise high-speed heating. ■ High-purity quartz chamber. ■ Cooling compatible with nitrogen gas purging method. ■ Up to 4 process gas lines (MFC). ■ Achieves a vacuum level of 0.1 Pa (10^-3 Pa possible with HV model equipped with TMP). ■ Standard touch panel monitor for easy operation. *For more details, please refer to the PDF document or feel free to contact us.

The "RTP-150" is a tabletop vacuum process rapid heating furnace that is suitable for research and development as well as prototype development, classified as one of the smallest in the industry. It supports a maximum temperature of 1000°C and accommodates a variety of gas purge environments. It can be used for various purposes, including crystal growth of new materials such as GaN and SiC, as well as sintering of paste materials. 【Features】 ■ Supports nitrogen gas, oxygen gas, forming gas (hydrogen + nitrogen) purging, as well as high-concentration hydrogen gas purging. ■ Enables precise rapid heating with 24 IR (infrared) heaters on the top and bottom. ■ High-purity quartz chamber. ■ Supports cooling using nitrogen gas purging method. ■ Up to 4 process gas lines (MFC). ■ Achieves vacuum levels of 10^-1 Pa (10^-3 Pa possible with HV model equipped with TMP). ■ Standard touch panel monitor for easy operation. *For more details, please refer to the PDF document or feel free to contact us.

The "RTP-100" is a tabletop vacuum process rapid heating furnace that is suitable for research and development as well as prototype development, and is among the smallest in the industry. It supports 4-inch wafers and allows for the processing of small samples using a dedicated susceptor. With a maximum temperature of 1200°C, it accommodates a variety of gas purge environments. It can be used for various purposes, such as crystal growth of new materials like GaN and SiC, and sintering of paste materials. 【Features】 - Supports nitrogen gas, oxygen gas, and forming gas (hydrogen + nitrogen) purging, as well as high-concentration hydrogen gas purging. - Enables precise rapid heating with 18 IR (infrared) heaters on the top and bottom. - High-purity quartz chamber. - Supports cooling through nitrogen gas purging. - Up to 4 process gas lines (MFC). - Achieves a vacuum level of 10^-1 Pa (10^-3 Pa possible with the HV model equipped with TMP). - Comes standard with a touch panel monitor for easy operation. *For more details, please refer to the PDF document or feel free to contact us.

The "AZ9T/AZ9C" is a microscope that achieves a working distance (WD) of 90 mm, an optical 10x zoom, and a resolution of 3 μm. During profile execution, it has previously been difficult to confirm the status of objects within the chamber. By attaching this product to the "viewing window" standardly equipped on the reflow unit and connecting it to the main unit, you can observe the melting of solder in real-time. Additionally, with a working distance (WD) of 90 mm, it captures sharp and clear images even when passing through the glass of the viewing window (10 mm thick). Furthermore, data can be saved to a PC not only as still images but also as videos. 【Features】 ■ Real-time observation of solder melting ■ Sharp and clear imaging even when passing through the glass of the viewing window (10 mm thick) ■ Data can be saved to a PC as still images or videos *For more details, please refer to the PDF document or feel free to contact us.

The "RSS-110-S" is a desktop vacuum solder reflow device suitable for solving challenges related to no-clean, void removal, and lead-free processes. It supports traditional "flux," "hydrogen reduction," and reduction using "formic acid." With the powerful reducing action of formic acid, it effectively removes oxide films from metal surfaces such as substrates, achieving improved wettability even without flux. Furthermore, by combining vacuum technology, it enables a maximum of 0.01% void-free results. With a variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace applications. 【Features】 ■ Rapid heating at 2°C per second, significantly reducing takt time due to water cooling ■ Maximum reachable temperature of 400°C (optional 500°C) ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Nearly exact realization of the set temperature profile High repeatability with almost zero overshoot ■ Minimal in-plane temperature difference on the heating plate, allowing uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF materials or feel free to contact us.

The "RSS-160-S" is a desktop vacuum solder reflow device suitable for solving challenges related to no-clean flux, void removal, and lead-free processes. In addition to conventional "flux" and "hydrogen reduction," it also supports reduction using "formic acid." With the powerful reducing action of formic acid, it effectively removes oxide films from metal surfaces such as substrates, achieving improved wettability without flux. Furthermore, by combining vacuum technology, it enables a maximum of 0.01% void-free results. Despite its compact design, which is among the smallest in the industry, it condenses various functions and performance to support a wide range of prototype development. 【Features】 ■ Rapid heating at 100°C per minute, and with water cooling, significantly reduces takt time ■ Maximum reachable temperature of 400°C (optional 500°C) ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Nearly achieves the set temperature profile as is, with high repeatability and almost zero overshoot ■ The in-plane temperature difference on the heating plate is close to zero, allowing for uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF materials or feel free to contact us.

The "RSS-210-S" is a desktop vacuum solder reflow device that is suitable for solving challenges related to no-clean flux, void removal, and lead-free processes. It supports traditional "flux," "hydrogen reduction," and reduction using "formic acid." With the powerful reducing effect of formic acid, it effectively removes the oxide film on metal surfaces such as substrates, achieving improved wettability even without flux. Furthermore, by combining vacuum technology, it enables a maximum of 0.01% void-free results. With a variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting that meets the standards required for power devices and aerospace applications. 【Features】 ■ Rapid heating at 4°C per second, significantly reducing takt time due to water cooling ■ Maximum reachable temperature of 400°C (optional 500°C) ■ Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen ■ Almost perfectly realizes the set temperature profile, with high repeatability and nearly zero overshoot ■ The in-plane temperature difference on the heating plate is close to zero, allowing for uniform heating of large workpieces *Requests for free demonstrations are also accepted. Please feel free to contact us. *For more details, please refer to the PDF materials or feel free to contact us.

This product is a tabletop vacuum solder reflow device that enables a maximum of 0.01% void-free soldering, making it suitable for addressing challenges related to fluxless and lead-free applications. It supports the removal of oxide films on the metal surfaces to be joined through "hydrogen reduction" and "formic acid reduction." The powerful reducing effect of formic acid enhances wettability even without flux. Additionally, despite its compact design, which is among the smallest in the industry, it consolidates the functions and performance needed for everything from prototype development to mass production into a single unit. With a wide variety of reflow profile settings and excellent temperature control, it achieves high-reliability mounting standards required for power devices and aerospace development. **Features** - Rapid heating at a speed of 2.5°C per second, significantly reducing takt time with water cooling - Maximum reachable temperature of 450°C (optional up to 650°C) - Compatible with various atmospheric environments such as formic acid, hydrogen, and nitrogen - Almost perfectly realizes the set temperature profile, with high repeatability and nearly zero overshoot - The in-plane temperature difference on the heating plate is nearly zero, allowing for uniform heating of large workpieces *Free demo requests are also accepted. Please feel free to contact us.* *For more details, please refer to the PDF materials or feel free to reach out to us.*

The "CB-600" is a flip chip bonder designed for ultra-low load applications. It enables heating and bonding from room temperature to 450°C through a tool lift operation that utilizes high-precision Z-axis control, with a ceramic heater. With a head exchange, it also supports ultrasonic bonding (customer replaceable). Additionally, due to its highly versatile equipment concept, it accommodates various packages (*1) and bonding processes (*2). *1 MEMS, 5G, data communication, millimeter-wave sensors, photonics, AR fields, etc. *2 ACF, ACP, NCF, NCP, solder, ultrasonic, etc. 【Features】 ■ Ultra-low load compatibility ■ High-precision bonding ■ Tool lift operation utilizing high-precision Z-axis control ■ Supports ultrasonic bonding with tool exchange *For more details, please refer to the PDF document or feel free to contact us.

This model retains the high performance of UniTemp's temperature control from Germany while incorporating only the necessary functions for reflow, making it easy to use. It is compact and easy to install. ■ Maximum temperature reach: 250℃ ■ Nitrogen gas purging possible ■ 16-step temperature program can be set ■ Automatically calculates the heat capacity of the target object for control, ensuring temperature control as set. It has high repeatability accuracy and almost zero overshoot. ■ High uniformity in heating, allowing for even heating anywhere on the heating plate.

The "CB-505" supports various packages (*1) and various bonding processes (*2) due to its highly versatile device concept. *1 MEMS, 5G, data communication, millimeter-wave sensors, photonics, AR fields, etc. *2 ACF, ACP, NCF, NCP, ultrasonic, etc. *For more details, please refer to the PDF materials or feel free to contact us.

The "CB-200" is suitable for small-scale and multi-variety production. Its highly versatile device concept accommodates various packages (※1) and various bonding processes (※2). ※1 MEMS, 5G, data communication, millimeter-wave sensors, photonics, AR fields, etc. ※2 ACF, ACP, NCF, NCP, ultrasonic, etc.

The "CB-2100" is a high-speed FC bonder that supports a variety of devices (5G/data communication/RFID). It incorporates the elemental technologies cultivated through years of FCB (flip chip bonder) manufacturing and follows the data obtained from structural analysis to accommodate mass production. We offer a lineup including the tabletop model "CB-200," the manual type "CB-505," and the semi-automatic type "CB-600." 【Features】 ■ Compatible with chip trays ■ Automatic cleaning of the head tip ■ Installation of HEPA filters and ionizers ■ Support for various devices (5G/data communication/RFID) ■ Mapping support ■ Production management support *For more details, please refer to the PDF materials or feel free to contact us.

This series is a basic type of dust removal device used in various processes. We offer models ranging from 2 to 5 units, suitable for both inline and outline applications. The lineup includes the "RY-705B," which features a non-contact magnetic gear for the drive gear, and the "RY-505Z," a two-unit clean roller type with cleaning on both the upper and lower sides. We accommodate various customer requests for sheet products and roll-to-roll lines. 【Features】 ■ Clean Roller RY-705B - Employs a non-contact magnetic gear for the drive gear - A revolutionary clean roller that eliminates dust generation from within the device ■ Clean Roller RY-505Z - Arranges two clean rolls on both the upper and lower sides to double the dust removal effect - Ideal for surface dust removal of products before the lamination process or exposure process in automatic lines ■ Customized Products - Designed and manufactured to fit the customer's work size * We also accept demo evaluations to determine if removal is possible with samples provided. * For more details, please refer to the PDF materials or feel free to contact us.

We would like to introduce the "Thin Plate Compatible Clean Roller." The "RY-1106 Series" utilizes a new type of clean roll with a small diameter, making it possible to remove dust from thin plates and films. Additionally, by adopting a magnetic gear in the drive section of the device, we suppress minute dust generation from the gear part. We also offer the "RFC-705A" and "RF-705A." 【Features】 ■ Prevents dropping ■ Clean roll that prevents entanglement ■ Uses magnetic gear in the drive section ■ Capable of cleaning 50μm workpieces ■ Customized products Designed and manufactured to fit the customer's work size * We also accept demo evaluations to determine if removal is possible with samples provided. * For more details, please refer to the PDF document or feel free to contact us.

We propose customized unit rollers tailored to your needs. We accommodate various specifications for roll-to-roll lines and vertical path lines, as well as designs for fixed installation units in line equipment. Our solutions are ideal for dust removal from films, substrates, and glass panels. 【Features】 - Manufactured to order according to customer requirements. - Capable of responding to various requests for installation and mounting in existing lines and equipment. - We can produce unit rollers up to 2,600mm based on our track record. - Suitable for long products in raw material processes and slitting processes. - Enhanced structural strength improves adhesion to products, allowing for high-speed flow rates of up to 250m/min. *We also accept demo evaluations to determine if removal is possible with samples provided. *For more details, please refer to the PDF document or feel free to contact us.

The "CB-700 (Athlete FA model)" is an all-in-one FC bonder for R&D purposes. It features an advanced interactive MMIF interface that enhances operability. With high precision (±0.5μm [3σ]) and a wide load range (0.05 to 1000N) as its foundation, it accommodates various applications and broadly meets the needs of R&D. 【Features】 ■ Extremely low load capability and high precision bonding ■ Tool lift operation utilizing high precision Z-axis control ■ Capable of ultrasonic bonding with tool exchange ■ Suitable for process development *For more details, please refer to the PDF document or feel free to contact us.

Optimal solution for traceability compliance. By replacing labels and stamps with laser printing, it is possible to promote cost reduction and labor saving. Printing can achieve fine markings even in narrow spaces, allowing for the embedding of large amounts of data onto individual circuit boards. The "LMS-K500 Series" is an inline laser marking system that can be equipped with various laser markers suitable for different applications, including CO2 lasers, fiber lasers, and UV lasers. Equipped with a vision camera, it supports alignment functions, 2D code reading judgment, and input direction determination as standard features. In addition to Japanese, English, and Chinese, it supports multiple languages (global compatibility), making it easy and reliable to implement in overseas factories. Please feel free to consult us for custom solutions, such as for M-size and L-size circuit boards, double-sided printing, and integration with MES systems. 【Features】 ■ SDGs-oriented airless system ■ Fully electric cylinder (no air supply required) ■ Equipped with KEYENCE-made laser markers, image processing, and control PLC ■ Equipped with a 3D laser marker that can mark large areas with high quality *For more details, please check the catalog download.

At Nichisei, we offer a one-stop service from procurement to printed circuit board assembly, sheet metal processing, and assembly. We accept contracts for the manufacturing of parts or finished products developed and designed by our customers, and we respond flexibly and seamlessly from prototype to small-batch production and mass production, including parts procurement. We connect and integrate the strengths of our various business locations across a wide range of fields, from consumer electronics to industrial equipment, and provide them to our customers in a one-stop manner. 【Our Strengths】 ■ We respond to customer needs for the manufacturing of various electronic products that require reliability, leveraging the knowledge and experience we have cultivated over many years. ■ We propose manufacturing solutions using our own FA products. *For more details, please refer to the PDF document or feel free to contact us.

This product is a UV irradiation device. It is compact and reasonably priced, while thoroughly pursuing cost-effectiveness in "curing" (i.e., effectiveness). It is used in various fields such as research and development of semiconductors, resin materials, films, and adhesives. We also offer a fluorescent lamp type (note: this product uses LED lighting)! 【Features】 ■ UV irradiation is possible by changing the direction of the lamp ■ Compact and lightweight ■ Lamp life exceeds 20,000 hours ■ Easy operation with a liquid crystal screen *For more details, please download the PDF or feel free to contact us.

We would like to introduce the high-precision die bonder "AB-1000" manufactured by Athlete FA, which we handle. It achieves mounting accuracy of XY: ±5[μm], θ: ±1[deg] (±3σ). It is compatible with small and thin chips. It comes with calibration, traceability, and post-mount inspection functions. Please feel free to contact us if you have any requests. 【Features】 ■ Achieves high-precision mounting ■ Compatible with small and thin chips ■ Equipped with calibration function ■ Equipped with traceability function ■ Equipped with post-mount inspection function *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce the 'BM-3500SI', a micro ball mounting machine compatible with individual substrates, manufactured by Athlete FA. This product, designed for individual substrates, has been completed with optimized ball dispensing brushes to reduce ball consumption. By configuring flux printing and ball mounting with multiple units and implementing a two-step inspection and repair process, we have achieved a 1.5 times increase in UPH compared to the previous model. 【Features】 ■ Achieves compatibility with individual substrates ■ Configured with multiple units for flux printing and ball mounting, and a two-step inspection and repair process, achieving 1.5 times UPH compared to the previous model ■ Reduces ball consumption through optimized ball dispensing brushes ■ Delivers high performance *For more details, please refer to the PDF document or feel free to contact us.