Manual flip chip bonder suitable for small-scale production and various experiments.
The "CB-505" supports various packages (*1) and various bonding processes (*2) due to its highly versatile device concept. *1 MEMS, 5G, data communication, millimeter-wave sensors, photonics, AR fields, etc. *2 ACF, ACP, NCF, NCP, ultrasonic, etc. *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
■Response Process 1. Heat Press Bonding 2. Ultrasonic Welding ■Alignment of the chip and substrate is performed on the same screen, achieving extremely high bonding position accuracy. *For more details, please refer to the PDF document or feel free to contact us.*
Price information
It may vary due to optional features, so please feel free to contact us.
Price range
P7
Delivery Time
※Please feel free to contact us. (Negotiable)
Applications/Examples of results
【Applications】 ■Compatible with various packages in fields such as MEMS, 5G, data communication, millimeter-wave sensors, photonics, and AR. ■Customized with a variety of options, available for purchase by individuals in a wide range of fields, including universities, government agencies, and corporate R&D. *For more details, please refer to the PDF document or feel free to contact us.
Line up（3）
| Model number | overview |
|---|---|
| CB-200 | Desktop Flip Chip Bonder https://www.ipros.jp/product/detail/2000558584 |
| CB-600 | High Precision, Low Load Flip Chip Bonder https://www.ipros.jp/product/detail/2000554324 |
| CB-700 | Ultra High Precision Flip Chip Bonder |
catalog（3）
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Company information
We respond flexibly and promptly to customer needs. In the "trading company" functional area, we are fully committed to providing truly attractive products and services that meet customer needs by collaborating with leading specialized manufacturers and utilizing advanced mechatronics technology to add value, thereby adapting to a highly information-oriented society. In the "mechanical parking equipment" business, we manufacture and install high-quality, environmentally friendly, and safety-conscious products to meet various customer needs. Based on our accumulated wealth of experience and technology, we provide 24-hour maintenance services through a nationwide service network, earning strong trust from our customers. The "freeze-drying equipment" business consistently develops next-generation "freeze dryers," including the sealed tube-type freeze dryer, which received the Minister of Economy, Trade and Industry Award from the Japan Industrial Machinery Manufacturers Association. We deliver and maintain both small-scale research and large-scale production equipment, and we also support the development of pharmaceuticals and food, establishing ourselves as an industry leader and receiving high praise. ◆ Locations Sapporo, Hitachi, Nagoya, Osaka, Fukuoka, Yamaguchi ◆ Overseas Subsidiary Thailand - Business activities: Sales of resin molded products, metal processed products, sheet metal, packaging materials, and electronic components.
