神港精機 Product Lineup

The "Arc Discharge Type High Vacuum Ion Plating Device" is an ion plating device capable of forming extremely dense and smooth hard films. By utilizing a unique method, it enables film formation in high vacuum without the need for argon gas, allowing for the creation of dense and highly reactive films. It primarily focuses on the formation of titanium-based films, such as TiC and TiCN, which provide high hardness and smoothness, making it suitable for surface treatment of molds. It has a wealth of experience in surface treatment applications for automotive parts molds. The system can be flexibly customized according to the size and shape of the substrate and processing requirements. It offers a wide range of options, from compact devices dedicated to precision machining tools to large-scale production types suitable for large molds. 【Features】 ■ No discharge gas required ■ Smooth hard films can be formed (no polishing required after film formation) ■ Decorative films that can replace gold plating can be formed (gold, gray, brown) ■ Proven results not only in metal surface treatment and hard films (capable of handling electronic components, metal films, oxide films) *For more details, please download the PDF document or feel free to contact us.

The "PIG-type DLC Film Formation Device" utilizes a uniquely developed PIG plasma gun, enabling the high-speed formation of extremely smooth and low-adhesive DLC films through a high-density plasma CVD system. It comes standard with a sputter cathode, achieving excellent film adhesion and high surface pressure resistance through a laminated structure with sputter films. With a wealth of experience in surface treatment applications for automotive parts, it has been adopted in many applications. Additionally, by equipping a newly developed arc discharge magnetron cathode, it is capable of forming hard films via PVD, making it easy to expand functionality into a plasma CVD + PVD composite film formation device. For those interested in evaluation, we offer sample testing. For more details on specifications and film quality, please feel free to contact us. 【Features】 ■ Extremely smooth DLC films can be formed: (Ra = 0.015μm or less) ■ Fast film formation rate: (3μm/hr or more) ■ Low-temperature film formation: (200℃ or less) ■ Thick film formation possible: (20μm) ■ DLC film removal: DLC removal can be performed within the same vacuum chamber. *For more details, please refer to the PDF document or feel free to contact us.

We would like to introduce our "Arc Discharge Type Magnetron Sputtering Device." By adding a low-voltage, high-current arc discharge mechanism to the front of the magnetron sputtering mechanism, the amount of ions incident on the substrate has increased tenfold compared to conventional devices, allowing for the formation of dense, hard, and smooth reaction films at an industrial level. Additionally, the elimination of the need for finishing polishing on the coating surface has improved durability and contributed to energy savings. 【Features】 - Addition of a low-voltage, high-current arc discharge mechanism to the front of the magnetron sputtering mechanism - Ten times more ions incident on the substrate compared to conventional devices - Formation of dense, hard, and smooth reaction films at an industrial level - No need for finishing polishing on the coating surface - Improved durability and contribution to energy savings *For more details, please refer to the PDF document or feel free to contact us.