神港精機 Product Lineup

"SERIO" is a high-density plasma etching device that accommodates a wide range of applications, including deep silicon etching, vertical processing of quartz, and organic film etching. Equipped with a proven ICP plasma electrode, it achieves smooth etching surfaces and high processing precision. It enables smooth etching without scalloping, making it suitable for creating nanoimprint molds. It possesses many process capabilities required for nanoimprint molds, such as smooth etching sidewalls, verticality of the processing surface, and control of opening angles. 【Features】 ■ Smooth etching sidewalls without scalloping ■ High verticality during deep silicon etching (90°±2°) ■ Controllability of etching taper angles ■ Support for high aspect ratio etching ■ Permanent demonstration unit available ■ Sample testing available *For more details, please refer to the PDF document or feel free to contact us.

The "ICP Metal Etching Device" is a high-density plasma etching device compatible with metal films, designed for advanced thin film processes. It actively supports not only general devices such as semiconductors and MEMS but also special processes like surface treatment for exposure masks and metal substrates. Thanks to its unique chamber structure, it achieves metal etching with low particle contamination at the nm level, characterized by high yield and operational efficiency. 【Features】 ■ Precision etching of metal films at the nm level ■ Low particle process through a unique mechanism ■ Process compatibility for a wide range of applications, including metal films and compound semiconductor substrates ■ High reliability of hardware leveraging the basic configuration of "SERIO" for nanoimprint molds ■ Active support for not only wafers but also special materials and shaped substrates *For more details, please refer to the PDF document or feel free to contact us.

Supports etching of submicron Si oxide films in batch type. Compatible not only with SiN and Si-based thin films but also with high melting point metals and difficult-to-etch materials. Ideal for processing niche devices such as vertical etching of quartz and fine processing of thick photoresist. Actively supports a wide range of applications from ashing to cleaning through a multi-step process enabled by plasma mode switching.

A plasma etching device that realizes automatic sheet transport of thin wafers (100μm or less). It supports a wide range of processes with multi-mode plasma and step processes, from natural oxide film removal to thick film resist ashing, cleaning, and descumming. It is actively used in mass production environments for various devices such as discrete ICs, power devices, compound semiconductors, and MEMS, employing diverse processes.

Upgraded and customized the highly experienced plasma cleaning device "POEM" for DLC film removal. Improved the energy of ions during processing compared to conventional types, enabling the removal of dense DLC films. Proven results not only in the standard O2 cleaning process but also in the multi-gas process for the removal of various customized DLC films, including Si-containing DLC. Naturally, it also supports the removal of molding residues and oxidation layers on mold surfaces, as well as cleaning before plating. Provides proven processes for cleaning and surface treatment before and after mold specifications.

A new type of multi-purpose plasma cleaning device with a proven track record has arrived. In addition to the conventional surface cleaning function using plasma, it now features a reduction cleaning function using hydrogen plasma. The ability to remove surface oxide layers has significantly improved, and the hydrophilicity of substrates after cleaning has greatly increased. It also supports conventional plasma cleaning as before. Furthermore, with new cleaning functions such as combined cleaning with traditional Ar plasma cleaning and two-step cleaning with O2 (oxygen) cleaning, the cleaning targets and effectiveness have been greatly enhanced compared to general plasma cleaning. This new plasma cleaning device can accommodate everything from small-scale to full-scale production lines.