Supports etching of fine patterns of metal films such as Al and Cr! Demo machines available! Facility tours and sample testing are currently being conducted.
The "ICP Metal Etching Device" is a high-density plasma etching device compatible with metal films, designed for advanced thin film processes. It actively supports not only general devices such as semiconductors and MEMS but also special processes like surface treatment for exposure masks and metal substrates. Thanks to its unique chamber structure, it achieves metal etching with low particle contamination at the nm level, characterized by high yield and operational efficiency. 【Features】 ■ Precision etching of metal films at the nm level ■ Low particle process through a unique mechanism ■ Process compatibility for a wide range of applications, including metal films and compound semiconductor substrates ■ High reliability of hardware leveraging the basic configuration of "SERIO" for nanoimprint molds ■ Active support for not only wafers but also special materials and shaped substrates *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Specifications】 ■ Hardware Configuration: Load lock type, consisting of one load lock chamber and one etching chamber * A multi-chamber type for mass production is also available in the lineup ■ Processable Substrate: Up to φ8-inch wafer-shaped products (rectangular substrates can be accommodated) ■ Substrate Materials: Si, glass, compound semiconductor substrates (GaAs, sapphire), etc. ■ Etching Targets: Various film types such as Al-based (AlSi, AlSiCu), Cr, etc. : Various substrates such as GaAs, sapphire, etc. ■ Target Processes: Various thin film etching, etc. * For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Plasma etching compatible with metal films ■ Metal films, compound semiconductor substrates, etc. ■ Semiconductors, MEMS, etc. ■ Surface treatment of exposure masks and metal substrates, etc. *For more details, please refer to the PDF document or feel free to contact us.
Line up（1）
| Model number | overview |
|---|---|
| ICP Etching Equipment "SERIO" | A high-density plasma etching device suitable for Si deep etching and SiN sacrificial layer formation. Ideal for mass production of MEMS sensors and devices, as well as for creating nanoimprint molds. |
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Company information
Shinko Seiki, as a technology-driven manufacturer, leverages the numerous know-how accumulated particularly in the field of vacuum equipment to deliver innovative products that meet user needs. In recent years, the company has also been challenging cutting-edge fields such as electronics and new materials, aiming to develop truly valuable hardware and software through the advancement of distinctive technologies and their organic integration.
