Carefully responding to niche demands. Light etching and ashing for thin wafers and double-sided processing, compact type CtC etching equipment.
A plasma etching device that realizes automatic sheet transport of thin wafers (100μm or less). It supports a wide range of processes with multi-mode plasma and step processes, from natural oxide film removal to thick film resist ashing, cleaning, and descumming. It is actively used in mass production environments for various devices such as discrete ICs, power devices, compound semiconductors, and MEMS, employing diverse processes.
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basic information
Atmospheric transport type CtoC system compatible with 3 to 8-inch wafers. Based on a parallel plate RIE device, it achieves soft mode plasma processing through multi-mode plasma using electrode switching. It allows for the selection of differential processes by combining gas types such as CF series, O2, Ar, and H2 with plasma modes. Optional features include dual-side processing capability and support for 300mm wafers and rectangular substrates. A high-throughput type with an additional process chamber is also available in the lineup.
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Applications/Examples of results
Power device ashing Discrete IC etching (removal of natural oxide film, pre-treatment before electrode formation) MEMS device ashing and descum Compound semiconductor wafer cleaning (removal of organic matter)
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Company information
Shinko Seiki, as a technology-driven manufacturer, leverages the numerous know-how accumulated particularly in the field of vacuum equipment to deliver innovative products that meet user needs. In recent years, the company has also been challenging cutting-edge fields such as electronics and new materials, aiming to develop truly valuable hardware and software through the advancement of distinctive technologies and their organic integration.
![[Case Study] Plasma Analysis of "Particle-PLUS" Dual Frequency CCP](https://image.mono.ipros.com/public/product/image/aec/2000679537/IPROS56625809199193232139.jpeg?w=280&h=280)
