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  4. Semiconductor Manufacturing Equipment
  5. Etching Equipment
  6. Batch-type compound semiconductor mass production machine plasma CVD and plasma etching equipment.

Batch-type compound semiconductor mass production machine plasma CVD and plasma etching equipment.

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last updated:Sep 04, 2024

プラズマ・サーモ・ジャパン
プラズマ・サーモ・ジャパン
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The industry's smallest, designed and manufactured in France, compatible with 2 to 12-inch wafers by simply replacing the wafer tray, Corial 300 and 500 series.

We would like to introduce our thin film PECVD and dry etching equipment, the "SHUTTLELINE(R)" and the compact 300 & 500 series compatible with batch processes. Film deposition is done using PECVD, while etching is performed using RIE, ICP, and ICP-RIE. By utilizing a unique wafer stage, it is possible to batch process from 1 to a maximum of 27 pieces for 2-inch wafers, for example. These systems can be used from development to mass production. 【Features】 ■ The PECVD deposition equipment features a compact chamber design and incorporates automatic cleaning, maximizing throughput. ■ The etching equipment is said to reduce operational costs, making it popular among many micro LED manufacturers. ■ It accommodates various wafer sizes and shapes, including wafer pieces and full wafers, and thanks to the shuttle system (wafer stage), no hardware changes are needed for different sample sizes. *For more details, please feel free to contact us.

    Etching Equipment
薄膜用PECVD・ドライエッチング装置「SHUTTLELINE(R)」1.JPG

Batch-type compound semiconductor mass production machine plasma CVD and plasma etching equipment.

薄膜用PECVD・ドライエッチング装置「SHUTTLELINE(R)」1.JPG
薄膜用PECVD・ドライエッチング装置「SHUTTLELINE(R)」1.JPG
  • Related Link - https://corial.plasmatherm.com/en

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【Other Features】 ■ Up to 27 wafers can be processed simultaneously with 2-inch wafers, making it suitable for small-diameter batch processing such as Optics. ■ Etching processes can be selected according to application, including RIE, ICP, and ICP-RIE, as well as film deposition processes using PECVD and ICP-CVD. ■ Proven adoption worldwide, with local support through Plasma-Therm LLC's global network. *For more details, please feel free to contact us.

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【Applications】 ■ Film formation, etching, cleaning, and patterning in semiconductor manufacturing processes ■ Sapphire substrates and compound semiconductor processes for photonics applications such as Micro LED ■ Surface cleaning that accommodates fine surfaces of microstructures ■ Device evaluation processes such as failure analysis *For more details, please feel free to contact us.

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プラズマ・サーモ・ジャパン

プラズマ・サーモ・ジャパン

Electronic Components and Semiconductors

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Our company offers etching, film deposition, and cutting equipment utilizing plasma technology, as well as the sale of ICP, RIE, DSE, IBE, IBD, PECVD, HDPCVD, and HDRF F.A.S.T.-ALD equipment, along with customer service related to these devices. Plasma-Therm LLC, headquartered in Florida, USA, was established in 1974. Since its founding, it has been manufacturing and selling semiconductor manufacturing equipment utilizing plasma technology for 48 years. Please feel free to contact us for inquiries. ▼ Group company Corial official website https://corial.plasmatherm.com/en

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