Remove the insulation layer of the IC! A system with a small footprint and high cost-effectiveness.
We handle plasma etching equipment for semiconductor failure analysis. From multi-level deprocessing that does not etch the metal layer to maintain electrical characteristics, to processes with high selectivity and no damage, including metal etching, our RIE and ICP-RIE FA solutions can be used for samples of dies, package dies, and wafers up to 200 mm. Please feel free to contact us when you need assistance. 【Features】 ■ Capable of processing dies, package dies, and 200 mm wafers ■ Accumulated process know-how prevents over-etching ■ Compact footprint and cost-effective system * You can download the English version of the catalog. * For more details, please refer to the PDF materials or feel free to contact us.
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*You can download the English version of the catalog. *For more details, please refer to the PDF document or feel free to contact us.
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*You can download the English version of the catalog. *For more details, please refer to the PDF document or feel free to contact us.
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Our company offers etching, film deposition, and cutting equipment utilizing plasma technology, as well as the sale of ICP, RIE, DSE, IBE, IBD, PECVD, HDPCVD, and HDRF F.A.S.T.-ALD equipment, along with customer service related to these devices. Plasma-Therm LLC, headquartered in Florida, USA, was established in 1974. Since its founding, it has been manufacturing and selling semiconductor manufacturing equipment utilizing plasma technology for over 50 years. Please feel free to contact us for inquiries. ▼ Group company Corial official website https://corial.plasmatherm.com/en
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