Achieve smooth etching surfaces and high machining precision! We support sample testing!
"SERIO" is a high-density plasma etching device that accommodates a wide range of applications, including deep silicon etching, vertical processing of quartz, and organic film etching. Equipped with a proven ICP plasma electrode, it achieves smooth etching surfaces and high processing precision. It enables smooth etching without scalloping, making it suitable for creating nanoimprint molds. It possesses many process capabilities required for nanoimprint molds, such as smooth etching sidewalls, verticality of the processing surface, and control of opening angles. 【Features】 ■ Smooth etching sidewalls without scalloping ■ High verticality during deep silicon etching (90°±2°) ■ Controllability of etching taper angles ■ Support for high aspect ratio etching ■ Permanent demonstration unit available ■ Sample testing available *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Specifications】 ■ Hardware Configuration: Load-lock type, consisting of one load-lock chamber and one etching chamber * Multi-chamber type for mass production is also available ■ Processable Substrates: Up to φ8-inch wafer shapes (rectangular substrates can be accommodated) ■ Compatible Substrates: Si, quartz, ceramics (alumina, AlTiC, etc.), glass, piezoelectric materials (LT, LN), etc. ■ Etching Targets: Substrate Si, quartz, various film types Si-based (SiO2, SiN) and organic films, etc. ■ Target Processes: Si deep etching, SiN sacrificial layer formation, various thin film etching, etc. * For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Deep Si etching ■ Vertical processing of quartz ■ Formation of sacrificial layers ■ Oxynitride film ■ Etching of organic films, etc. *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Shinko Seiki, as a technology-driven manufacturer, leverages the numerous know-how accumulated particularly in the field of vacuum equipment to deliver innovative products that meet user needs. In recent years, the company has also been challenging cutting-edge fields such as electronics and new materials, aiming to develop truly valuable hardware and software through the advancement of distinctive technologies and their organic integration.
