神港精機 List of Products and Services

The "Vacuum Deposition Device for Research and Development" is a series of compact deposition devices suitable for universities, public research institutions, and basic experiments. We offer two models: a front-door type equipped with an electronic evaporation source as standard and a simplified experimental type based on a fully manual resistance heating source. Both models (front-door type and simplified experimental type) can be flexibly customized according to purpose and cost. We have demo units available for sample testing. 【Features】 ■ Proven hardware with flexible cost options ■ A wide range of optional features tailored to specific needs (high-temperature heating, substrate cooling, multi-source simultaneous deposition, evaporation sources for organic materials, lift-off process support) ■ Support for ionization mechanisms such as plasma electrodes and RF coils, with options for additional plasma electrodes ■ Consistent customer support from sample testing to hardware customization and post-delivery follow-up *For more details, please refer to the PDF materials or feel free to contact us.

The "High-Speed Batch-Type Resin Vapor Deposition Device" is a specialized vapor deposition device dedicated to the vapor deposition processing of resin molded products, such as automotive parts (exterior components). It achieves high-speed batch processing through a large-diameter exhaust system and a compact chamber. The simple device configuration and high-speed batch processing aim to improve productivity on mass production lines. By adopting an old-dry exhaust system and a front-door type device shape, it excels in maintenance-free exhaust systems and system maintainability, achieving a high operating rate. 【Features】 ■ High-speed batch processing for resin substrates ■ Stable film formation performance and high-speed exhaust performance ■ Maintenance-free exhaust system due to the old-dry exhaust system ■ High productivity due to compact device size *For more details, please refer to the PDF materials. *For other specifications and sample testing inquiries, please contact us.

The "Large Resin Substrate Deposition Device" is a large deposition system aimed at forming thin films on large resin molded parts for automotive exterior components. Equipped with multiple electron gun evaporation sources, it enables high-speed film formation at low temperatures for metal films such as Al, Cu, and Ni on large resin substrates up to 1 meter in length. It has a proven track record not only for automotive parts but also for electromagnetic wave shielding in electronic devices. The combination of a large chamber (φ2000), electron gun evaporation sources, and a large exhaust system makes it suitable for the production of high-quality decorative films and electromagnetic wave shielding films through large batch processing. 【Features】 - Low-temperature formation of various metal films (below 70°C) - Short-time batch processing - High adhesion of films to resin substrates via RF bombardment - Formation of various thin films, thick films, and multilayer films (Cu/Ni Cu1μmNi0.25μm stacking) - Stable film formation of discontinuous films - Customization options allow for full-area film formation on long substrates (up to 1750mm) *For more details, please refer to the PDF document or feel free to contact us.

This product is a simple and cost-effective sputtering device that covers everything from basic research to advanced process development. We offer two models: a fully manual, low-cost batch type and a simplified load lock type equipped with a manual transport mechanism. Both models achieve significant cost reductions while maintaining the process performance of higher-end models. We provide consistent and careful support from sample testing and specification compliance to post-delivery follow-up. 【Features】 ■ Reasonable cost and high process performance ■ High reliability capable of handling small-scale production ■ A wide range of options and flexible hardware support backed by extensive track records ■ Supports process development in advanced thin film development with load lock mechanisms and pre-deposition testing ■ A demo unit is permanently available for sample testing *For more details, please refer to the PDF document or feel free to contact us.

Realization of the capabilities of a higher-end model capable of small-scale production using a manually operated simple experimental machine. An 8-inch compatible multi-frequency RF sputtering device. Supports fundamental research in MEMS, compound semiconductors, and electronic devices due to high-speed exhaust and excellent process performance. A series of batch-type sputtering devices with a proven track record in mass production of electronic components.

A high-density plasma sputtering method developed in-house, the ADMS method (arc discharge type magnetron sputtering), enables the deposition of a dense AlN film on three-dimensional substrates, unlike anything seen before. It achieves a high-density plasma sputtering with ten times the amount of ions compared to conventional methods. With a unique high-reactivity sputtering process, crystalline AlN is formed at low temperatures below 500°C. This new thin-film formation device creates new surface functions for everything from electronic devices to mechanical parts.