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  3. 神港精機 東京支店
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神港精機 東京支店

EstablishmentJanuary 24, 1949
capital10000Ten thousand
number of employees194
addressTokyo/Chuo-ku/2nd Floor, Kusunoki Nihonbashi Building, 4-2-16 Nihonbashi Muromachi
phone03-3271-2156
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last updated:Oct 08, 2025
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神港精機 List of Products and Services

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Vacuum pump components Vacuum pump components
Vacuum device Vacuum device
Hard film formation device Hard film formation device
Assembly device Assembly device
Plasma treatment device Plasma treatment device
Thin film formation device Thin film formation device
Thin

Thin film formation device

I will introduce sputtering devices, vacuum deposition devices, and plasma CVD devices.

Research and development vacuum deposition device

Flexible response according to purpose and cost! For universities, public research institutions, and basic experiments.

The "Vacuum Deposition Device for Research and Development" is a series of compact deposition devices suitable for universities, public research institutions, and basic experiments. We offer two models: a front-door type equipped with an electronic evaporation source as standard and a simplified experimental type based on a fully manual resistance heating source. Both models (front-door type and simplified experimental type) can be flexibly customized according to purpose and cost. We have demo units available for sample testing. 【Features】 ■ Proven hardware with flexible cost options ■ A wide range of optional features tailored to specific needs (high-temperature heating, substrate cooling, multi-source simultaneous deposition, evaporation sources for organic materials, lift-off process support) ■ Support for ionization mechanisms such as plasma electrodes and RF coils, with options for additional plasma electrodes ■ Consistent customer support from sample testing to hardware customization and post-delivery follow-up *For more details, please refer to the PDF materials or feel free to contact us.

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Vacuum Deposition Device for Automotive Parts (AAMF-C1075SR Type)

Compact housing supports full coating of large resin molded products such as automotive exterior parts, achieving dry processing of resin surface treatment through high-speed batch processing.

The "High-Speed Batch-Type Resin Vapor Deposition Device" is a specialized vapor deposition device dedicated to the vapor deposition processing of resin molded products, such as automotive parts (exterior components). It achieves high-speed batch processing through a large-diameter exhaust system and a compact chamber. The simple device configuration and high-speed batch processing aim to improve productivity on mass production lines. By adopting an old-dry exhaust system and a front-door type device shape, it excels in maintenance-free exhaust systems and system maintainability, achieving a high operating rate. 【Features】 ■ High-speed batch processing for resin substrates ■ Stable film formation performance and high-speed exhaust performance ■ Maintenance-free exhaust system due to the old-dry exhaust system ■ High productivity due to compact device size *For more details, please refer to the PDF materials. *For other specifications and sample testing inquiries, please contact us.

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Large resin substrate deposition device

High adhesion to the resin substrate due to discharge cleaning with high-frequency plasma before film formation.

The "Large Resin Substrate Deposition Device" is a large deposition system aimed at forming thin films on large resin molded parts for automotive exterior components. Equipped with multiple electron gun evaporation sources, it enables high-speed film formation at low temperatures for metal films such as Al, Cu, and Ni on large resin substrates up to 1 meter in length. It has a proven track record not only for automotive parts but also for electromagnetic wave shielding in electronic devices. The combination of a large chamber (φ2000), electron gun evaporation sources, and a large exhaust system makes it suitable for the production of high-quality decorative films and electromagnetic wave shielding films through large batch processing. 【Features】 - Low-temperature formation of various metal films (below 70°C) - Short-time batch processing - High adhesion of films to resin substrates via RF bombardment - Formation of various thin films, thick films, and multilayer films (Cu/Ni Cu1μmNi0.25μm stacking) - Stable film formation of discontinuous films - Customization options allow for full-area film formation on long substrates (up to 1750mm) *For more details, please refer to the PDF document or feel free to contact us.

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Simple experimental sputtering device

Two models: manual batch type and simple load lock type. The simple load lock type enables the mass production process of compound semiconductors. Currently accommodating sample tests and equipment tours.

This product is a simple and cost-effective sputtering device that covers everything from basic research to advanced process development. We offer two models: a fully manual, low-cost batch type and a simplified load lock type equipped with a manual transport mechanism. Both models achieve significant cost reductions while maintaining the process performance of higher-end models. We provide consistent and careful support from sample testing and specification compliance to post-delivery follow-up. 【Features】 ■ Reasonable cost and high process performance ■ High reliability capable of handling small-scale production ■ A wide range of options and flexible hardware support backed by extensive track records ■ Supports process development in advanced thin film development with load lock mechanisms and pre-deposition testing ■ A demo unit is permanently available for sample testing *For more details, please refer to the PDF document or feel free to contact us.

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Research and development sputtering equipment

Compact, low-cost, and feature-rich, low-cost sputtering equipment for research and development. Sample testing and facility tours available.

Realization of the capabilities of a higher-end model capable of small-scale production using a manually operated simple experimental machine. An 8-inch compatible multi-frequency RF sputtering device. Supports fundamental research in MEMS, compound semiconductors, and electronic devices due to high-speed exhaust and excellent process performance. A series of batch-type sputtering devices with a proven track record in mass production of electronic components.

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ALN coating device (high-density plasma sputtering ADMS device)

Forming crystalline AlN films with high-density plasma sputtering, compatible with full coating on three-dimensional shapes. Fully automated mass production equipment lineup.

A high-density plasma sputtering method developed in-house, the ADMS method (arc discharge type magnetron sputtering), enables the deposition of a dense AlN film on three-dimensional substrates, unlike anything seen before. It achieves a high-density plasma sputtering with ten times the amount of ions compared to conventional methods. With a unique high-reactivity sputtering process, crystalline AlN is formed at low temperatures below 500°C. This new thin-film formation device creates new surface functions for everything from electronic devices to mechanical parts.

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