Industrial Machinery

Shinwa Co., Ltd. Mechatronics System Center

EstablishmentFebruary 12, 1951
capital95100Ten thousand
number of employees1100
addressAichi/Kasugai-shi/501 daisenji-cho
phone0568-37-2230
last updated：
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Shinwa Co., Ltd. Product Lineup

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Ultra-Precision Dispenser Quspa Series Ultra-Precision Dispenser Quspa Series
Non-destructive testing equipment Non-destructive testing equipment
Semiconductor manufacturing equipment Semiconductor manufacturing equipment
Jinwa Jet Pump Series Jinwa Jet Pump Series
Jinwa Screw Pump Series Jinwa Screw Pump Series
Jinwa

Jinwa Screw Pump Series

Dispensing Industry Top-Class Performance 【Shinwa Screw Dispenser】 - LED Post-Processing / PCB Mounting Process → Adjustment of application amount based on screw rotation (Compatible with high-viscosity materials) → Reduction in the number of equipment investments due to increased application speed (Compared to air dispensers: 2 to 5 times processing capacity) → Increased stability of application amount due to room temperature discharge → Significant reduction in yield loss and increased production efficiency 【Applications】 ◆ Secondary Underfill ◆ General LED Phosphors (SMD/Side View/Dam & Fill, etc.) ◆ Cream Solder (φ250~φ300μm) * The application diameter may vary depending on the solder particle used ◆ Ag Paste ◆ UV Curing Resin Others

Screw dispenser [LED post-process / board mounting]

Achieving ultra-precise dispensing through screw rotation! Extensive track record and versatility in LED/line coating/3D coating!

【Dispensing Industry Achieves Capability No.1】 Shinwa Screw Dispenser - LED Post-Processing / PCB Assembly Process ▶ Adjustment of dispensing amount based on screw rotation (Compatible with high-viscosity materials) ▶ Reduction in the number of equipment investments through high-speed dispensing (Compared to air dispensers: 2 to 5 times processing capacity) ▶ Increased stability of dispensing amount through room temperature discharge ▶ Significant reduction in yield loss, increased production efficiency! 【Applications】 ■ Secondary Underfill ■ LED Phosphors (General) (SMD/Side View/Dam & Fill, etc.) ■ Cream Solder (φ250~φ300μm) * The dispensing diameter may vary depending on the solder particles used. ■ Ag Paste ■ UV Curing Resin, among others.

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