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The "resin material thermal resistance measurement device" is an apparatus for measuring the thermal resistance of resin materials, which is effective for heat dissipation design in semiconductors. 【Features】 ■ Using a steady-state method, it can measure the thermal resistance of resin, including contact thermal resistance, with high precision under conditions close to those in which the resin is actually used. (Measurement example: For silicon nitride with dimensions of 10 mm square and a thickness of 2 mm, the measurement accuracy is ±0.03°C/W) ■ Depending on the form of resin used, you can choose between constant load mode and constant thickness mode. (Measurement example: For thermosetting resin materials, measurements can be taken in constant load mode, while gel-like or grease-like resin materials can be measured in constant thickness mode.) *For more details, please request documentation or view the PDF data available for download.

• Other measurement, recording and measuring instruments