Assembly and Processing - Company Ranking(14 companies in total)

Last Updated：Oct 22, 2025 Aggregation Period:Sep 24, 2025〜Oct 21, 2025
This ranking is based on the number of page views on our site.

Company Name	Company information	Featured Products
Company Name	Company information	Product Image, Product Name, Price Range	overview	Application/Performance example
函館電子	Address Hokkaido/ Business Activities Manufacturing of electronic components and electronic devices. Key Partners	"Semiconductor assembly and processing outsourcing" Daisoto Other	For more details, please refer to the PDF document or feel free to contact us.	For more details, please refer to the PDF document or feel free to contact us.
		[Contract Assembly and Processing of Semiconductors] Au Stud Bump Other	For more details, please refer to the PDF document or feel free to contact us.	【Examples of Delivery Achievements】 ■Prototype level with a bump diameter of 30μm *For more details, please refer to the PDF document or fe...
		Introduction of Hakodate Electronics' technology: "Au Stud Bump Processing" Other	Overview of Bump Processing Mechanism Introduction Materials ◎ Standard (Tearing Bump) ◎ Leveling (Crushing Bump) ◎ Tamping (Crushing ...	For more details, please refer to the PDF document or feel free to contact us.
---	Address --- Business Activities ---	--- ---	---