Supports stud bump bonding processing that can reduce the implementation area! We also have a track record of delivering bump diameters of 30μm for small diameters!
The bump shapes can be customized according to requirements, including pull cut, leveling, tamping, and multi-stage bumps. The wafer size can accommodate up to 8 inches. We can handle a wide range of processing, from mass production to small-batch prototypes and individual chip processing. Please feel free to contact us for inquiries or quotes regarding processing. 【Overview】 ■ Si, quartz, GaAs ■ Wafer size (Max 8 inches) ■ Bump size (Min 30μm) *For more details, please refer to the PDF document or feel free to contact us.
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basic information
For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Examples of Delivery Achievements】 ■Prototype level with a bump diameter of 30μm *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Hakodate Electronics Co., Ltd. is engaged in semiconductor assembly and LED testing, focusing on gold stud bump processing. We have established a consistent line for semiconductor back-end processes and an LED probe inspection sorting line, maintaining quality in an environment with temperature and humidity control and measures against electrostatic discharge. We cater to a wide range of needs from development prototypes to mass production, so please feel free to consult with us.