Supports stud bump bonding processing that can reduce the implementation area! We also have a track record of delivering bump diameters of 30μm for small diameters!
The bump shapes can be customized according to requirements, including pull cut, leveling, tamping, and multi-stage bumps. The wafer size can accommodate up to 8 inches. We can handle a wide range of processing, from mass production to small-batch prototypes and individual chip processing. Please feel free to contact us for inquiries or quotes regarding processing. 【Overview】 ■ Si, quartz, GaAs ■ Wafer size (Max 8 inches) ■ Bump size (Min 30μm) *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Examples of Delivery Achievements】 ■Prototype level with a bump diameter of 30μm *For more details, please refer to the PDF document or feel free to contact us.
catalog（2）
Download All Catalogs![[Introduction to Manufacturing Process] Au Stud Bump](https://image.mono.ipros.com/public/catalog/image/01/7c8/714946/IPROS20673739369247710424.jpeg?w=120&h=170)
Company information
Hakodate Electronics Co., Ltd. is engaged in semiconductor assembly and LED testing, focusing on gold stud bump processing. We have established a consistent line for semiconductor back-end processes and an LED probe inspection sorting line, maintaining quality in an environment with temperature and humidity control and measures against electrostatic discharge. We cater to a wide range of needs from development prototypes to mass production, so please feel free to consult with us.
