We will be exhibiting online at the 33rd International Photovoltaic Science and Engineering Conference (PVSED-33).

Arradiance's tabletop ALD device can be equipped with a plasma unit despite being a tabletop model, and it is capable of film deposition not only for oxide films but also for nitrides, Pt, and Ru.

Despite being a compact tabletop ALD device, it enables atomic-level layer deposition. There is also a PEALD device equipped with a plasma unit. It can deposit on structures with a diameter of up to 200mm and a height of 25mm, as well as on carbon nanotubes (CNT) and graphene. In addition to oxide films, it also supports the deposition of nitrides and metals such as Pt and Ru. It features a 300W air-cooled direct ICP plasma head with four mass flow controlled plasma and gas inputs, and a reactor temperature adjustable up to 300°C. It includes a material supply pressurization assist function for low vapor pressure applications. The sample stage can accommodate substrates up to 200mm in diameter, and a 450°C heated stage is also available. The Arradiance GEMFlow software is user-friendly and allows for easy creation of deposition recipes. It controls all major operational parameters, including temperature, gas flow, high-speed ALD valves, RF power, and vacuum isolation. A diagnostic system and logs enable tracking of all system parameters during operation. Regarding RGIP (Reactor Gas Injection Protocol), it is equipped with a gas port monitoring interlock function.

• Other surface treatment equipment

With the current processing methods and technologies, it is difficult to create complex shapes, integrated structures, lattice/honeycomb structures, porous structures, hollow structures, hybrid structures, and direct manufacturing from 3D data. Furthermore, through topology optimization and collaboration with generative design, we can achieve the creation of innovative aluminum parts that are not available from conventional or other companies, rapid development and prototyping of parts, dramatic reduction in the number of parts, ultra-lightweight and compact designs, cost reduction, and significant decreases in the number of processes and personnel involved. In this seminar, leading users such as J·3D, ODEC, and pioneers in white copper, who have achieved remarkable results in aluminum part manufacturing using metal 3D printers, will discuss key points and precautions for implementation and utilization, various manufacturing methods and technologies, rapid, low-cost, high-quality manufacturing techniques, uniquely developed next-generation AM technologies, groundbreaking case studies that significantly differentiate from other companies' parts, as well as factors for failure and secrets to success. Based on numerous research results and rich manufacturing achievements, we will provide a clear and concrete explanation for those considering implementation, beginners with interest, and those who have just started in the field. [Currently, half-price tuition] When applying, please write "Other [8,500 yen]" in the "Other" section above the application form on our website.

Kou Alpha X Co., Ltd. will be exhibiting at the "6th Nagoya Smart Logistics EXPO" held at the Aichi Prefectural International Exhibition Center. At our booth, we will primarily showcase the actual model of the "HAIDI lithium-ion battery," which is gaining attention as a power source for electric drive equipment. Additionally, we will reference exhibit a "Mobility Base Unit," which serves as the base for electric wheelchairs, anticipating its use in AMRs, along with manual chargers, automatic chargers and connectors compatible with both contact and non-contact charging, and peripheral devices for electric vehicles. We look forward to your visit.

UVM (Universal Verification Methodology) is one of the verification methods that enables advanced verification flows for ASICs and large-scale FPGAs. However, writing UVM from scratch is a complex and time-consuming task. The UVM generator in Riviera-PRO reduces complexity by automatically generating SystemVerilog templates for UVM test benches and simulation scripts for designs written in VHDL, Verilog/SystemVerilog, rather than starting from scratch. This webinar will focus on how to use the UVM generator and the benefits it brings to users who create UVM code from scratch.

The RTCA/DO-254, published in 2000, serves as a guideline for the development of airborne electronic equipment equipped with FPGA/ASIC according to standards; however, in recent designs, its content has become outdated. EASA and FAA have aimed to harmonize compliance standards, and at the same time, issued AMC 20-152A/AC 20-152A as new objectives that DO-254 applicants should meet. This webinar will introduce an overview of this new document, as well as discuss its impact on the design and verification processes of airborne electronic equipment and appropriate tools for streamlining these processes.

We will be exhibiting at the FOOD Exhibition 2026, specifically at the "Food Factory Improvement Exhibition." Our theme for the exhibition will be "Positive Pressure with Dehumidified Air." In this exhibition, we will introduce our dehumidified air supply unit "Ecosara," which contributes to solving issues such as the inflow of insects and dust, condensation, and mold growth in food manufacturing facilities. We sincerely look forward to your visit. Additionally, during the "Exhibitor Seminar" held at the venue, we will also discuss the background and benefits of implementing "Ecosara."