[Book] Latest Trends in Next-Generation Semiconductor Packaging and the Development of Its Materials and Processes (No. 2197) [Available for Preview]

[Available for preview] ~ 2.XD, 3D integration and substrate materials, encapsulation and bonding technologies, heat dissipation materials ~

Book Title: Latest Trends in Next-Generation Semiconductor Packaging and the Development of Its Materials and Processes ★ As the miniaturization of integrated circuits approaches its limits and the differentiation of advanced semiconductors becomes crucial, packaging technology holds the key! This book covers the transformation of packaging technology associated with chiplets and 3D integration, along with new materials and process technologies. ■ Key Points of This Book - Development status of next-generation packaging technologies such as FOWLP, 2.XD, silicon bridge, and 3D... - Hybrid bonding technology and new bonding materials that are key to 3D stacking. - Required characteristics of encapsulants for new applications and measures to suppress cracks and delamination. - Build-up processes that achieve fine wiring and high density in package substrates. - Package structures that demonstrate the performance of next-generation WBG semiconductors, along with high-temperature resistant encapsulants and bonding materials. - Causes and countermeasures for defects such as cracks, voids, and whiskers in solder mounting. - Compatibility of low dielectric properties and other characteristics (heat resistance, low CTE, etc.) in films for multilayer substrates for high-speed communication. - Techniques for the densest packing of fillers for high thermal conductivity, and the design of heat dissipation materials that are both highly thermally conductive and low dielectric.

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Contec Co., Ltd. has started selling the "SH-9210TSN," an industrial managed switching hub that has obtained CC-Link IE TSN recommended network wiring component certification Class B. It features dual power supply redundancy, a DC power input, eight gigabit ports, and two SFP slots. The SH-9210TSN complies with IEEE 802.3ab (1000BASE-T), IEEE 802.3u (100BASE-TX), and IEEE 802.3 (10BASE-T) standards, and is designed for use in environments where quiet operation and long lifespan are required due to its fanless design. Additionally, it achieves an operating temperature range of -10 to 65°C thanks to its excellent heat dissipation metal casing. It can be installed on a 35mm DIN rail or mounted on walls using various mounting brackets. In addition to a wide-range DC power input (12-48VDC), it supports input from two power supply lines and includes various managed functions for network management, control, and reliability enhancement.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If you require a detailed technical explanation, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is kept to a minimum. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without any thermal impact on the base material. Repairs can be conducted in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is required, please contact us.