[Book] Latest Trends in Next-Generation Semiconductor Packaging and the Development of Its Materials and Processes (No. 2197BOD)

Technical Specialized Books: 2.XD, 3D Integration and Substrate Materials, Encapsulation and Bonding Technology, Heat Dissipation Materials.

Book Title: Latest Trends in Next-Generation Semiconductor Packaging and the Development of Its Materials and Processes －－－－－－－－－－－－－－－－－－－－－－－－－－ ★ As the miniaturization of integrated circuits approaches its limits and the differentiation of advanced semiconductors becomes crucial, packaging technology holds the key! This book covers the transformation of packaging technology associated with chiplets and 3D integration, along with new materials and process technologies. ■ Key Points of This Book - Development status of next-generation packaging technologies such as FOWLP, 2.XD, silicon bridge, and 3D... - Hybrid bonding technology and new bonding materials that are key to 3D stacking - Required characteristics of encapsulants for new applications and measures to suppress cracks and delamination - Build-up processes that achieve fine wiring and high density in package substrates - Package structures that demonstrate the performance of next-generation WBG semiconductors, along with high-temperature resistant encapsulants and bonding materials - Factors and countermeasures for defects such as cracks, voids, and whiskers in solder mounting - Compatibility of low dielectric properties and other characteristics (heat resistance, low CTE, etc.) in films for multilayer substrates for high-speed communication - Techniques for the densest filling of fillers for high thermal conductivity and the design of heat dissipation materials that are both highly thermally conductive and low dielectric.

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