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  3. アイテス
  4. Solder Heat Resistance Test (SMD)
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  • Jun 07, 2023
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Jun 07, 2023

Solder Heat Resistance Test (SMD)

アイテス アイテス
Our company conducts solder heat resistance tests to evaluate the heat resistance of surface mount devices (SMD) during the solder mounting process. We replicate moisture absorption before mounting through humidification treatment and assess the presence of delamination or cracks through heating treatment that corresponds to the thermal stress during solder mounting. Additionally, as part of the post-test inspection, we perform inspections identical to the initial measurements and, if necessary, conduct analyses such as cross-sectional observations of defective parts. For more detailed information, please refer to the related products and catalogs.
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Analysis of the assembly joints of the implemented components

By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, it is important to observe not only the shape but also the metal structure.

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Total Support Service for Reliability

We conduct environmental testing, as well as non-destructive observation and electrical property measurements.

At AITES, we use environmental testing equipment that conforms to standard specifications such as JIS, JEDEC, and MIL, and we accept commissioned testing for reliability evaluation of various electronics products, components, and materials. We offer a range of tests including electrical testing, non-destructive observation, and power cycle testing. 【Environmental Testing】 ■ Highly Accelerated Life Testing ■ Constant Temperature and Humidity Testing ■ Thermal Shock Testing ■ Liquid Bath Thermal Shock Testing ■ Temperature and Humidity Cycle Testing ■ In-Situ Continuous Measurement Reliability Evaluation Testing Service *For more details, please refer to the PDF materials or feel free to contact us.

  • Analytical Equipment and Devices
  • Analysis Services

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Cross-sectional observation pre-treatment (sample cutting and resin embedding)

We will introduce the pre-treatment for cross-sectional observation using devices for sample cutting, such as band saws!

We would like to introduce the sample preparation (sample cutting and resin embedding) for cross-sectional observation conducted by Aites Co., Ltd. We use cutting equipment suitable for cutting large substrates and thick components, such as the band saw "HOZAN K-100" and the IsoMet "Buehler Low Speed Saw." With the "HOZAN K-100," samples up to approximately X150mm, Y230mm, and Z70mm in size can be cut. Additionally, after cutting, the samples are embedded in epoxy resin or similar materials, but it is also possible to embed in resin before cutting. 【Product Lineup】 ■ Band Saw ■ IsoMet ■ Multifunctional Diamond Wire Saw *For more details, please refer to the PDF document or feel free to contact us.

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Cross-sectional polishing service for implementation parts and electronic components.

Each part is carefully polished by hand, using an efficient process without waste!

Our company specializes in "cross-section polishing of implemented components and electronic parts." To quickly provide suitable cross-section samples for the observation of various components, we carefully polish each part by hand, using an efficient process without waste. Please feel free to contact us for more information. 【Features】 ■ Quickly providing suitable cross-section samples for the observation of various components ■ Carefully polishing each part by hand, using an efficient process without waste *For more details, please refer to the PDF document or feel free to contact us.

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Surface mount electronic component cross-sectional observation service

You can closely observe the solder joint condition of electronic components on the implementation board and the internal structure of the components!

Our company conducts "cross-sectional observation of surface-mounted electronic components." Through cross-sectional observation after mechanical polishing, it is possible to closely examine the solder joint condition (presence of cracks and voids) of electronic components on the mounted substrate, as well as the internal structure of the components. For "SOP components," detailed observation can be made from the overall cross-section to the solder connection, while for "aluminum electrolytic capacitors," it is possible to observe the internal structure of the electrolytic capacitor components and their connection to the substrate. 【Features】 ■ SOP (Small Outline Package) components - Detailed observation can be made from the overall cross-section of SOP components to the solder connection. ■ Chip ceramic capacitors - Detailed observation can be made from cracks in the component material to cracks in the solder area. ■ Aluminum electrolytic capacitors - Observation can be made from the internal structure of the electrolytic capacitor components to their connection to the substrate. *For more details, please refer to the PDF document or feel free to contact us.

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Related catalog(6)

Analysis of the assembly joints of the implemented components

Analysis of the assembly joints of the implemented components

PRODUCT
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Total Support Service for Reliability

Total Support Service for Reliability

OTHER
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Cross-sectional observation pre-treatment (sample cutting and resin embedding)

Cross-sectional observation pre-treatment (sample cutting and resin embedding)

PRODUCT
  • E-book viewing
  • Catalog download

Contact this catalog

Cross-sectional polishing service for implementation parts and electronic components.

Cross-sectional polishing service for implementation parts and electronic components.

PRODUCT
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Surface mount electronic component cross-sectional observation service

Surface mount electronic component cross-sectional observation service

PRODUCT
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Solder Heat Resistance Test (SMD)

Solder Heat Resistance Test (SMD)

TECHNICAL
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アイテス
Electronic Components and Semiconductors
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Exhibition Invitation

[Live demo available] We will debut an outdoor transportable AMR at INNOVATION EXPO 2025.

  • NEW
  • COMPANY

We are pleased to announce that Tokyo Machine Works Co., Ltd. will be exhibiting at the "INNOVATION EXPO 2025" to be held at Tokyo Big Sight from September 10 (Wednesday) to September 12 (Friday), 2025. 【Exhibited Equipment】 - 1-ton portable autonomous mobile robot (AMR) - 2-ton portable unmanned transport vehicle (AGV) - Shutter-equipped unmanned transport vehicle - Autonomous cleaning robot, etc. 【Booth Number】 - 6-405 You will have the opportunity to see each machine up close, including demonstrations that link the equipment together. We sincerely look forward to your visit during this event. Please note that pre-registration (free of charge) is required to attend the exhibition, so we kindly ask you to register using the link below. https://www.logistech-online.com/jp/registration.php?exhibitor=EX000072 If you would like an invitation, please request it through our contact form.

Sep 08, 2025

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Inside the casing

Added Windows 11 IoT Enterprise LTSC 2024 to the BTO menu of the industrial computer "MR4310 series."

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  • PRODUCT

Contec has added a BTO menu for the Windows 11-based embedded OS - Windows 11 IoT Enterprise LTSC 2024 to its industrial computer "MR4310 series" and has started accepting orders.

Sep 08, 2025

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RP-WAH-SR12 Long-Distance Transfer Type

Achieving long-distance wireless Ethernet transmission of up to 1 km using the sub-gigahertz band. New release of Ethernet wireless converters "RP-WAH-SR12/RP-WAH-SR22".

  • NEW
  • PRODUCT

Contec has developed the Ethernet wireless converters "RP-WAH-SR12" and "RP-WAH-SR22," which utilize 920MHz sub-gigahertz wireless (IEEE 802.11ah) to enable Ethernet communication wirelessly even at distances of up to 1 km. Sales began on August 21, 2025. The new products are compact IEEE 802.11ah compliant wireless LAN converters that can be installed in various locations. The new Wi-Fi standard "IEEE 802.11ah," which utilizes sub-gigahertz wireless communication, became available in Japan in September 2022. It operates in the 920MHz band without the need for a license and can be used outdoors. Compared to conventional 920MHz wireless communication, it enables high-speed communication and the establishment of long-distance networks, making it expected to be utilized in large factories, plants, and farms. The new Ethernet wireless converters are designed to be lightweight and compact, allowing for installation in various locations such as walls and DIN rails with the included mounting brackets. Additionally, they support external antennas, enabling the construction of flexible wireless LAN systems.

Sep 08, 2025

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Introducing the new ultra-compact business computer "LPC-500 Series" recommended for edge AI terminals with built-in "Intel(R) AI Boost."

  • NEW
  • PRODUCT

Contec has developed a super compact business computer equipped with the Intel(R) Core(TM) Ultra processor (Series 1), and has started accepting orders for the business computer "LPC-500 Series" (hereinafter referred to as the new product) from August 28, 2025. The new product is a super compact business computer featuring the Intel(R) Core(TM) Ultra 5 processor 125U (Series 1, Meteor Lake-U). It is equipped with "Intel(R) AI Boost," which integrates an NPU into the CPU, allowing for the execution of AI functions such as image recognition and voice processing at high speed and low power consumption while reducing the load on the CPU and GPU. With ultra-compact dimensions of 150(W) × 150(D) × 33(H) mm, it comes with a vertical stand and VESA mounting brackets, enabling installation in tight spaces on desks, behind displays, or inside equipment without restriction. It adopts a BTO (Build to Order) method that allows customers to freely choose memory capacity, storage, OS, and more, enabling the order of a PC with specifications optimal for their needs and budget starting from just one unit.

Sep 08, 2025

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Notice of Shipping Suspension Period Due to Interim Financial Statement Inventory Count

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Thank you very much for your continued support. We would like to inform you that our company will suspend product shipping operations for inventory purposes due to the interim financial closing on the following dates. We apologize for any inconvenience this may cause and appreciate your understanding. Shipping suspension period: Tuesday, September 30, 2025.

Sep 08, 2025

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