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  1. Home
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  3. アイテス
  4. Solder Heat Resistance Test (SMD)
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  • Jun 07, 2023
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Jun 07, 2023

Solder Heat Resistance Test (SMD)

アイテス アイテス
Our company conducts solder heat resistance tests to evaluate the heat resistance of surface mount devices (SMD) during the solder mounting process. We replicate moisture absorption before mounting through humidification treatment and assess the presence of delamination or cracks through heating treatment that corresponds to the thermal stress during solder mounting. Additionally, as part of the post-test inspection, we perform inspections identical to the initial measurements and, if necessary, conduct analyses such as cross-sectional observations of defective parts. For more detailed information, please refer to the related products and catalogs.
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Analysis of the assembly joints of the implemented components

By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, it is important to observe not only the shape but also the metal structure.

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Total Support Service for Reliability

We conduct environmental testing, as well as non-destructive observation and electrical property measurements.

At AITES, we use environmental testing equipment that conforms to standard specifications such as JIS, JEDEC, and MIL, and we accept commissioned testing for reliability evaluation of various electronics products, components, and materials. We offer a range of tests including electrical testing, non-destructive observation, and power cycle testing. 【Environmental Testing】 ■ Highly Accelerated Life Testing ■ Constant Temperature and Humidity Testing ■ Thermal Shock Testing ■ Liquid Bath Thermal Shock Testing ■ Temperature and Humidity Cycle Testing ■ In-Situ Continuous Measurement Reliability Evaluation Testing Service *For more details, please refer to the PDF materials or feel free to contact us.

  • Analytical Equipment and Devices
  • Analysis Services

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Cross-sectional observation pre-treatment (sample cutting and resin embedding)

We will introduce the pre-treatment for cross-sectional observation using devices for sample cutting, such as band saws!

We would like to introduce the sample preparation (sample cutting and resin embedding) for cross-sectional observation conducted by Aites Co., Ltd. We use cutting equipment suitable for cutting large substrates and thick components, such as the band saw "HOZAN K-100" and the IsoMet "Buehler Low Speed Saw." With the "HOZAN K-100," samples up to approximately X150mm, Y230mm, and Z70mm in size can be cut. Additionally, after cutting, the samples are embedded in epoxy resin or similar materials, but it is also possible to embed in resin before cutting. 【Product Lineup】 ■ Band Saw ■ IsoMet ■ Multifunctional Diamond Wire Saw *For more details, please refer to the PDF document or feel free to contact us.

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Cross-sectional polishing service for implementation parts and electronic components.

Each part is carefully polished by hand, using an efficient process without waste!

Our company specializes in "cross-section polishing of implemented components and electronic parts." To quickly provide suitable cross-section samples for the observation of various components, we carefully polish each part by hand, using an efficient process without waste. Please feel free to contact us for more information. 【Features】 ■ Quickly providing suitable cross-section samples for the observation of various components ■ Carefully polishing each part by hand, using an efficient process without waste *For more details, please refer to the PDF document or feel free to contact us.

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Surface mount electronic component cross-sectional observation service

You can closely observe the solder joint condition of electronic components on the implementation board and the internal structure of the components!

Our company conducts "cross-sectional observation of surface-mounted electronic components." Through cross-sectional observation after mechanical polishing, it is possible to closely examine the solder joint condition (presence of cracks and voids) of electronic components on the mounted substrate, as well as the internal structure of the components. For "SOP components," detailed observation can be made from the overall cross-section to the solder connection, while for "aluminum electrolytic capacitors," it is possible to observe the internal structure of the electrolytic capacitor components and their connection to the substrate. 【Features】 ■ SOP (Small Outline Package) components - Detailed observation can be made from the overall cross-section of SOP components to the solder connection. ■ Chip ceramic capacitors - Detailed observation can be made from cracks in the component material to cracks in the solder area. ■ Aluminum electrolytic capacitors - Observation can be made from the internal structure of the electrolytic capacitor components to their connection to the substrate. *For more details, please refer to the PDF document or feel free to contact us.

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Related catalog(6)

Analysis of the assembly joints of the implemented components

Analysis of the assembly joints of the implemented components

PRODUCT
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Total Support Service for Reliability

Total Support Service for Reliability

OTHER
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Cross-sectional observation pre-treatment (sample cutting and resin embedding)

Cross-sectional observation pre-treatment (sample cutting and resin embedding)

PRODUCT
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Cross-sectional polishing service for implementation parts and electronic components.

Cross-sectional polishing service for implementation parts and electronic components.

PRODUCT
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Surface mount electronic component cross-sectional observation service

Surface mount electronic component cross-sectional observation service

PRODUCT
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Solder Heat Resistance Test (SMD)

Solder Heat Resistance Test (SMD)

TECHNICAL
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アイテス
Electronic Components and Semiconductors
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Fukuda's leak test, leak inspection, leak detection, leak test, integrity test.

  • NEW
  • PRODUCT

Fukuda Co., Ltd. has been pursuing leak detection for 60 years and is committed to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing properties. We will propose the appropriate testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)

Jan 23, 2026

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[Opening on January 6, 2026] New service launched to search for exhibits nationwide.

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  • COMPANY

We have launched a "Display Item Search Page" that allows you to search for unit houses currently on display at exhibition halls nationwide, which was made available on January 6, 2026. There are over 800 items listed on the website. You can filter by area, price range, size, purpose, product type, color, and more. You can also check exterior and interior photos, prices, facilities, and drawings/specifications online. If you're interested in a display item, you can directly inquire, make a reservation to visit, or consult via LINE. This is a convenient service that allows you to efficiently progress from comparison to detailed consideration. Please take a look!

Jan 23, 2026

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Publication of a paper in Oxford Open Materials Science

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  • OTHER

A co-authored paper by Shin Otsuki from the Data Science Department and another author has been published in Oxford Open Materials Science. 【Paper Summary】 Title: The Exploration of Enhanced Methods in Data Science and Applications in Materials Science Authors: Raymond Wu, Shin Otsuki

Jan 23, 2026

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[New Product] Announcement of the High Brightness LED Lighting Box LLBLM-A Series

  • NEW
  • PRODUCT

"With high-precision dimming settings of 256/1000 gradations, you can achieve your desired results." The new 1-channel dedicated model LLBLM-A maximizes the performance of high-brightness LEDs. It offers high light stability through constant current control and flexibly accommodates a wide range of inspection and lighting applications with three types of interfaces: parallel, RS232C, and LAN. In addition to intuitive operation via the front panel, it supports high-precision dimming with 256/1000 gradations (256 gradations in parallel mode). The available emission colors are G (green) and B (blue). This new model balances stable light output with ease of use. For more details, please feel free to contact us.

Jan 23, 2026

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All participants chant for safety.

The Winter Safety Conference for the 7th year of Reiwa was held.

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Last month, we held a winter safety conference organized by our company. We have compiled the details and atmosphere of the day, as well as information on winter labor accidents, into a PDF. We would appreciate it if you could take a moment to read it.

Jan 23, 2026

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