Vecow will exhibit at "Japan IT Week Spring 2024" held in Tokyo, Japan.

NVIDIA Jetson Orin NX equipped, easily deployable AI computing EAC-6000.

The "EAC-6000," which is compact and equipped with the NVIDIA Jetson Orin NX, features 6 GigE LAN ports (4 of which are PoE+), 3 USB 3.1 ports, a wide power input range of 9-50V, ignition control, and supports up to 4 automotive GMSL cameras (with Fakra-Z connectors), making it ideal for various automotive applications and AIoT applications. *For the main specifications, please download the catalog or check the website.

• Image Processing Equipment
• Industrial PCs
• Other embedded systems (software and hardware)

Compact 2U/Half-size design. All I/O is on one side, making it a compact yet high-performance and user-friendly industrial PC.

Equipped with 14th/13th/12th generation Intel Core i9/i7/i5/i3 processors (14th generation, RPL-S Refresh/RPL-S/ADL-S) and featuring the Intel R680E chipset, this fanless model boasts a highly reliable ultimate mechanical design, supporting a wide operating temperature range of -25°C to 75°C. The high-performance fanless PC "VCM-1000 Series," which supports WiFi/4G/3G/LTE/GPRS/UMTS, is the perfect choice for various edge AI applications, including machine vision, in-vehicle computing, public safety, automated factories, intelligent transportation systems (ITS), autonomous mobile robots (AMR), automated guided vehicles (AGV), robotic control, and deep learning. *For main specifications, please download the catalog or check our website.

• Industrial PCs

Upgrading existing industrial PCs is as simple as replacing the latest processors!

We are pleased to announce that as an Intel Gold Member, we will be launching three series of industrial PCs equipped with the latest 13th generation (codename: Raptor Lake-S) on a robust edge AI platform, allowing many customers to choose the optimal combination tailored to their application environments. - ECX-3000 PEG series, GPU-expandable, designed for deep learning with excellent flexibility and scalability - ECX-3000 series, incorporating cutting-edge technology for machine vision - IVX-1000 series, ideal for railway and automotive applications *Please download the catalog or visit our website to check the main specifications.

• Industrial PCs
• Embedded Board Computers
• Embedded system design service

NVIDIA Jetson AGX Orin equipped, an AI embedded system with outstanding detection accuracy.

The "EAC-5000," which is compact and equipped with the NVIDIA Jetson AGX Orin, features one PCIe x8 expansion slot (Gen4 speed) allowing for the construction of 10GigE/PoE LAN/USB, two GigE LAN ports, five USB 3.1 ports, one Digital Display port supporting 8K60, a wide power input range of 9-50V, ignition control, and support for up to eight automotive GMSL cameras (with Fakra-Z connectors), making it ideal for various automotive applications and AIoT applications.

• Image Processing Equipment
• Industrial PCs
• Embedded system design service

Equipped with a neural processing unit (NPU) and adopting the power-efficient Cortex-A53, it meets the needs of all embedded applications.

The EIC-2000, equipped with an industrial-grade Arm-based NXP i.MX 8M Plus quad-core Cortex-A53 processor and built-in NPU supporting up to 2.3 TOPS, features GigE LAN ports compliant with Intel Time-Sensitive Networking (TSN) standards, enabling seamless access. Additionally, it offers a rich set of expansion options including two USB 3.0 ports, one Micro USB port, two Nano SIM card sockets, and a Mini PCIe socket, making it an ideal AI edge computing system for applications such as base station construction, irrigation systems, and factory automation in AIoT/Industry 4.0. *Please download the catalog or visit our website to check the main specifications.*

• Image Processing Equipment
• Embedded Board Computers
• Other embedded systems (software and hardware)

VCOM-BASE, a carrier board compatible with the compact COM Express Type 6 in ATX form factor specifications.

The "VCOM-BASE," compliant with the COM Express Carrier Design Guide specifications, supports the compact COM Express Type 6 in an ATX form factor. With one each of PCIe x16, PCIe x4, and PCIe x1 expansion slots, as well as switchable Dual BIOS support, the "VCOM-BASE" is an ideal carrier board for all industrial embedded development. *Please download the datasheet or check our website for the main specifications. *You may also consider the COM Express Type 6 compatible Computer-On-Module (COM) VCOM-1600.

• Embedded Board Computers
• Embedded system design service
• Other embedded systems (software and hardware)

COM Express Type 6 compatible computer-on-module (COM) VCOM-1600

The "VCOM-1600," a computer-on-module (COM) equipped with the Intel Atom x6000E processor (Elkhart Lake) and compliant with COM Express Type 6, features a compact form factor (95mm x 95mm) and supports real-time data synchronization with Intel TSN/TCC standards. It enables 4K display output through various interfaces such as DDI, VGA, and LVDS. The "VCOM-1600" is the optimal COM Express solution for all embedded applications. *Please download the datasheet or check our website for the main specifications. *You may also consider the carrier board "VCOM-BASE," which complies with the COM Express Carrier Design Guide specifications.

• Embedded Board Computers
• Embedded system design service
• Other embedded systems (software and hardware)

In civil engineering sites such as mountainous areas and construction sites, it may be necessary to use wooden boards on slopes or inclined access roads. Hyper CLT boards are civil engineering materials utilizing wood CLT, which can be laid not only on flat ground but also on sloped terrain. They can be used for temporary roads, access routes, heavy machinery entry paths, and measures against muddy conditions, creating a driving environment that takes advantage of the unique surface characteristics of wood. The 5×10 board weighs approximately 230 kg, and the 5×20 board weighs about 460 kg, making them lightweight and easy to install and remove even with small machinery, which is a notable feature for maneuverability in narrow sites. This wooden board is registered as a technology under the Ministry of Land, Infrastructure, Transport and Tourism's NETIS system as "TH-250021-A," and can also be utilized for safety measures and innovative ideas in public works.

Metal cracks are one of the concerns in equipment maintenance operations. Repairs using conventional welding methods can alter the base material around the crack due to heat, leading to residual stress and deformation, which always carries the risk of "crack recurrence" or "secondary damage." Hinode Waterworks Equipment Co., Ltd.'s "Mechanical Stitching Method" is a new technique that allows for the repair of metal cracks without applying heat. By using special bolts and reinforcement plates, the crack is physically removed without affecting the base material with heat. Repairs can be performed even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. For more details, please contact us or download the catalog.

● The production time for cast prototypes can be shortened! Since model making is not required, the production time for prototypes, which previously took about a month, can be significantly reduced. ● Model costs can be reduced! By directly producing sand molds from 3D data, there is no need for model production costs. If changes to the model are necessary, they can be addressed by modifying the 3D data. ● Similar products with different shapes and dimensions can be prototyped simultaneously! Different products, such as similar shapes or varying dimensions, can be molded at the same time in one molding process. This allows for the verification of multiple types in a short period.

● To determine the sealing and waterproofing of sealed products based on pressure changes, it is not necessary to conduct tests that involve spraying water on the product or immersing it in water. ● Once the product is placed in a dedicated fixture within the inspection device, waterproofing can be quantitatively confirmed through automatic measurement. ● The target product size is W 300 × D 210 × H 100 mm or smaller. ● The target products include automotive cameras, smartphones, ECUs, small motors, and other packaging containers, and are effective for any products that require confirmation of sealing, waterproofing, and airtightness. ● For product specifications and details, please contact us.

The inspection targets of the "MSX-7003 series" are relatively large electronic devices. 【Inspection Targets】 - LED - Optical devices - High-frequency devices - Power semiconductors - IR sensors - Gyro sensors - Angular velocity sensors - Electrolytic capacitors, etc. The transport system is designed based on "pallet to pallet" to accommodate various types of work. The following three processes are performed automatically by the airtight inspection device: - Helium bombarding - Gross leak test - Fine leak test For packaged products smaller than 10 mm on each side, the work is set up using pallets or trays, followed by helium bombarding ↓ Then transported to the leak test process through high-speed handling ↓ Going through a continuous process from the gross leak test to the fine leak test ↓ And finally, discharged onto a pallet through high-speed handling. It also supports inline operations (the height of the pass line is 940 mm). Please watch the YouTube video from the link below.