We will be exhibiting at SEMICON JAPAN 2023.

It is the process of forming UBM. It can improve the connection reliability between the aluminum electrode and the package terminal.

UBM stands for Under Bump Metal or Under Barrier Metal, and it is a film formed to join aluminum electrode pads on semiconductor chips with package terminals through wire bonding, soldering, or silver sintering. This film is composed of materials such as electroless nickel/gold plating or electroless nickel/palladium/gold plating. We offer a wide range of products that support the evolution of semiconductors and electronics, so please feel free to consult with us.

• Chemicals

Okuno Pharmaceutical Industry, a top-class company in surface treatment and plating chemicals, offers surface treatment chemicals and process technologies for wafers and package substrates!

■Exhibiting at SEMICON JAPAN 2023■ Okuno Pharmaceutical Industry will be exhibiting at SEMICON JAPAN 2023, which will be held at Tokyo Big Sight from December 13 (Wednesday) to December 15 (Friday), 2023. We will showcase a variety of new products, including plating technologies for wafers and semiconductor package substrates, as well as plating processes for power modules that contribute to device connection reliability. Please visit our booth at Tokyo Big Sight, East Hall 1, [1131]. Latest information about the exhibition and more can be found on our company website. Please check the related links. All of our employees look forward to your visit. *For more details, please download the PDF or contact us directly.

• Surface treatment contract service
• Other contract services

FOWLP, FOPLP, and next-generation semiconductor package substrates, as well as ultra-fine wiring copper sulfate plating additives - TORYZA LCN FRV.

In recent years, semiconductor packaging technology has gained attention with FOWLP and FOPLP, which allow for an increase in the number of terminals relative to chip area by forming a redistribution layer on the wafer and expanding the terminals to the outside of the chip (Fan Out), in contrast to the conventional FC-BGA that is disadvantageous for thinness and cost reduction. Our company has developed a new copper sulfate plating additive for the formation of the redistribution layer in FOWLP and FOPLP. This product excels in film thickness uniformity and rectangularity of pattern shape, and it also accommodates filling of small-diameter vias. Additionally, to support the increase in the number of terminals on the chip side, the formation of ultra-fine wiring layers on the build-up layer of conventional FC-BGA is also being considered. This product is optimal for the formation of ultra-fine wiring in next-generation semiconductor package substrates.

• Chemicals

Supports high aspect ratio filling, copper sulfate plating additive for silicon interposers - TORYZA LCN SV.

With the advancement of semiconductor performance and functionality, packaging technologies related to chiplets that implement multiple chips with different functions on a single substrate and three-dimensional integration are gaining attention. Among these, silicon interposers with wiring formed on silicon are attracting interest because they can miniaturize the length and width of the wiring, thereby enhancing the transmission capability of high-frequency signals. Our company has developed TORYZA LCN SV as an additive for silicon interposers that supports high aspect ratio filling. TORYZA LCN SV excels in embedability into TSVs, achieving void-free and low film thickness high aspect ratio filling.

• Chemicals

Copper sulfate plating additive for semiconductor wafers, high heat dissipation and high current applications - TORYZA LCN SD.

Smartphones are widely used not only for calls but also for content viewing such as music and videos, online shopping, and in industries like automobiles, smart home appliances, and robotics. Mobile communication devices like cell phones and tablets have undergone significant evolution approximately every 10 years, with their maximum communication speeds increasing by about 1,000,000 times over the past 30 years. Additionally, semiconductors used in servers and high-performance computers are required to achieve even higher performance and multifunctionality. Our company has recently developed a new copper sulfate plating additive, TORYZA LCN SD, which is optimal for low aspect ratio via filling. TORYZA LCN SD can be widely applied to microbumps that join semiconductor chips and build-up wiring boards, as well as thermal vias used for heat dissipation in trench wiring on wafers and power semiconductors.

• Chemicals

TORYZA LCN SP, the optimal electroplating solution for forming copper pillars on semiconductor wafers and package substrates.

Solder balls have been widely used in semiconductor packaging. However, due to the increase in pin count (the number of terminals on the substrate), the increase in the number of chips being packaged, and the reduction in bonding area, solder bumps with a diameter of about 100µm are becoming insufficient for high-density packaging. As an alternative, attention is being drawn to a method that involves forming a redistribution layer (RDL) on the semiconductor and using copper pillars for bonding. Our company has developed the optimal additive for copper pillars, TORYZA LCN SP. TORYZA LCN SP can also be used to form ultra-fine electrodes on the build-up layer of the package substrate.

• Chemicals

We handle TFT LCD modules from WINSTAR for use in display sections of devices. 【We receive inquiries in the following situations】 - Wanting to update the display section of measuring instruments or control panels - Looking for LCDs to incorporate into industrial equipment - Searching for a supplier that can accommodate small quantities 【We can assist with】 - Selecting sizes and interfaces that meet application and enclosure conditions - Confirming pin assignments and arranging samples - Developing custom products and embedded systems - Selling in small lots We also handle OLED (organic EL) modules from the same WINSTAR company. Please consider these as well for devices that want to take advantage of their thinness, low power consumption, and wide viewing angles. Please check the specific specifications in the manufacturer's datasheet. We also accept requests for quotes only.

CLT is known as a building material, but its applications are not limited to just buildings. The wooden lightweight mat "Hyper CLT Mat" is a new option for utilizing CLT in civil engineering. It can be used as a wooden mat in places where steel plates have been the norm, such as temporary roads, access routes, heavy machinery work yards, and material storage areas. The 5×10 mat is relatively light at about 230 kg, making it easy to install, remove, and relocate. Additionally, it offers different values compared to steel, such as reducing glare and metallic noise, as well as CO2 fixation through wood. Moreover, the Hyper CLT Mat is registered with the Ministry of Land, Infrastructure, Transport and Tourism as a NETIS technology "TH-250021-A." It can also be utilized for proposals involving the use of new technologies and environmental considerations in public works. From construction to civil engineering, the new use of wood is expanding in the form of wooden lightweight mats.

Metal cracks are one of the concerns in equipment maintenance operations. Conventional welding methods for repairs can cause changes in the base material around the crack due to heat, leading to residual stress and deformation, which always carries the risk of "crack recurrence" and "secondary damage." Hinode Water Supply Equipment Co., Ltd.'s "Mechanical Stitching Method" is a new technique that allows for the repair of metal cracks without applying heat. By using special bolts and reinforcement plates, the crack is physically removed without affecting the base material at all. Repairs can be made even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. For more details, please contact us or download the catalog.

We have newly added a **"Frequently Asked Questions Q&A"** section to the Hyper CLT sheet website. It clearly summarizes many questions frequently asked by those considering the introduction of the product, such as "What types of civil engineering sites can it be used on?", "Can it be used on rainy days?", "Is it compatible with large machinery?", and "What is NETIS?". The Hyper CLT sheet is a lightweight wooden sheet utilizing wood CLT, suitable for a wide range of applications including temporary roads, access routes, and heavy machinery work yards. It is also registered as a **Ministry of Land, Infrastructure, Transport and Tourism NETIS registered technology "TH-250021-A"**. Since it is a new material, we will not leave any uncertainties unaddressed. We aim to create a website that makes it easy to resolve questions before introduction, including information on wood, NETIS, civil engineering, and CLT, and we will continue to enhance the Q&A section.

We have added a new **"Glossary"** to the Hyper CLT sheet website. In the civil engineering and construction industries, there are many specialized terms such as "CLT," "NETIS," "temporary roads," and "wooden lightweight sheets." Therefore, we have introduced related terms in an easy-to-understand manner so that those who are encountering Hyper CLT sheets for the first time can understand the products and technologies. Hyper CLT sheets are wooden lightweight sheets for civil engineering that utilize wood CLT and are registered under the Ministry of Land, Infrastructure, Transport and Tourism's NETIS technology as **"TH-250021-A."** We hope that by not only conveying the features of the product but also sharing the underlying technologies and terminology, users will feel a closer connection to Hyper CLT sheets. We will continue to enhance our website and provide clear information related to wood, NETIS, civil engineering, and CLT.