Observation of Conductive Particle Shape in COG Implementation

Observing the conductive particles from the planar direction and the cross-sectional direction! A case study confirming the degree of deformation.

We will introduce the observation of the shape of conductive particles in COG implementation. ICs and liquid crystal panels are implemented using the COG method with ACF (anisotropic conductive film). A resin ball is used as the core, and a metal layer (such as nickel or gold) is deposited on its surface for conductivity. During connection, the particles deform appropriately to electrically connect the IC and the panel. To confirm the degree of particle deformation and the connection state, cross-sectional observations were conducted, revealing that the particle deformation amount was "medium," indicating an appropriate level of deformation. By examining the deformation of conductive particles from both the planar and cross-sectional directions, we can explore the correlation with display defects. Please feel free to contact us for any inquiries regarding panel-related defects. [Summary] - In implemented ICs, slight "warping" or "tilting" can cause differences in particle deformation between the edges and the center, potentially leading to display defects. - By examining the deformation of conductive particles from both the planar and cross-sectional directions, we can explore the correlation with display defects. *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices

Support for the difficulties in the development and evaluation of components, devices, and materials related to semiconductor products.

【Testing, Evaluation, Analysis】 　●Reliability Testing 　　■Temperature Cycle Testing 　　■Thermal Shock Testing 　　■High-Temperature Storage Testing 　　■Highly Accelerated Life Testing 　　■Preconditioning 　　■Hot Oil Testing 　　■In-situ Continuous Measurement 　　■Ion Migration Testing 　　■Electromigration Testing 　　■Test Consulting 　●Evaluation Testing 　　■Bond Strength Testing: Pull/Shear Testing 　　■Mechanical Strength Testing: Vibration/Shock/Fall Testing/Compression Strength/Shear Strength 　　■ESD/Latch Up/CDM Testing 　　■Electrical Characteristic Measurement 　　■Salt Spray Testing 　●Analysis 　　■X-ray Transmission Observation 　　■Ultrasonic Microscope Observation 　　■Luminescence Analysis (EMS/IR-OBIRCH) 　　■Scanning Electron Microscope (SEM) 　　■Transmission Electron Microscope (TEM) 　　■Surface Contamination Analysis (TOF-SIMS) 　　■Foreign Substance Analysis (FT-IR)

• Other contract services

Some overseas manufactured parts and products may have quality issues. We provide quality evaluation services for reliability testing and assessment for these.

Some overseas manufactured parts and products may initially operate without issues, but can cause malfunctions and lead to failures and breakdowns in a short period of time. Before adopting or using overseas products, please consider AIT's parts and product quality evaluation services. ■ Examples of overseas parts evaluation - Reliability evaluation during the parts procurement and selection stage - Comparative evaluation between parts and product manufacturers - Reliability evaluation when replacing current parts with alternative parts (cost reduction) ■ Examples of applicable parts - Active components (transistors, diodes, thyristors, etc.) - Passive components (capacitors, resistors, etc.) - LCDs - Circuit boards - Power supplies - Etc.

• Testing Equipment and Devices
• Other inspection equipment and devices
• Contract Inspection

Check the quality status of LCD components and products! We will analyze the structures of the LCD panels using our analytical methods and expertise!

At AITES, we conduct quality analysis of LCD components/products, confirming the quality status of products based on our expertise in LCDs. The target panels include SEG-LCD, AM-LCD (a-Si TFT / LTPS TFT), OLED for automotive, monitors, mobile devices, and more. We perform quality analysis using our analytical methods on the various structures of liquid crystal panels. 【Analysis Content (Excerpt)】 <Reliability/Lighting Tests> ■ Classification - Reliability Tests - Lighting Inspections ■ Analytical Methods - Oven Drive Tests - Visual Inspection *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis
• Analysis Services

We will narrow down the defective areas through lighting confirmation, panel disassembly, and optical microscope observation!

We provide a defect diagnosis menu for LCD panels, from confirming defects to identifying causes and conducting detailed failure analysis. In the initial analysis, we perform a status check (lighting test), panel disassembly, and optical microscope observation, tailored to the defect symptoms. In the detailed analysis, based on the diagnostic results from the initial analysis, we propose suitable methods such as surface analysis, cross-sectional analysis, and component analysis. It is also possible to speculate on the mechanisms of defect occurrence, including narrowing down the production processes that caused the defects. 【Analysis Content】 ■ Initial Analysis - Status check (lighting test), panel disassembly, optical microscope observation, conducted according to defect symptoms - Narrowing down from general areas such as cell panels and peripheral circuits to finer details ■ Detailed Analysis (additional analysis fees apply) - Based on the diagnostic results from the initial analysis, we propose suitable methods such as surface analysis, cross-sectional analysis, and component analysis - It is also possible to speculate on the mechanisms of defect occurrence, including narrowing down the production processes that caused the defects *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis
• Analysis Services

We can perform good product characteristic measurements for performance verification, as well as defective characteristic measurements and reliability evaluations!

Our company can perform good product characteristic measurements, defective characteristic measurements, and reliability evaluations for specific TFTs in liquid crystal panels. In the "Electrical characteristic measurement of TFTs at various temperatures," we can disassemble the monitor in display mode and measure the electrical characteristics of the pixel TFTs within the panel. In the "DC bias stress test," we apply an arbitrary DC bias to the Gate and Drain and measure the Vth shift when stress is applied to the TFT, conducting reliability verification. 【Features】 - Electrical characteristic measurements can be performed on the pixel TFTs within the panel. - Measurements can be conducted before and after annealing, under light exposure, heating, or cooling conditions. - From the measurement results, indicators such as Ion, Ioff, Vth, and mobility can be calculated. - Verification of actual values in good product analysis and clarification of causes of defects can be performed. *For more details, please refer to the PDF document or feel free to contact us.

• LCD display

If you're having trouble with LCD analysis, we at ITES are here to help you find a solution!

Are you struggling with LCD analysis? We, at ITES, are here to help you find a solution! Structural Analysis: We evaluate and report on potential issues related to characteristics and structure in FPD products and advanced technologies that are constantly evolving. Defect Analysis: We approach and investigate the causes of manufacturing defects in increasing overseas products through the shortest route. Reliability Testing: Based on your objectives and needs, we propose the optimal reliability testing methods and conditions using our extensive know-how. [Contents] ■ Did you know? What is a display? ■ Panel analysis case studies ■ Tell me more! ITES's LCD analysis ■ ITES can perform these types of analysis!

• Contract Analysis

Rich equipment and expertise! We will elucidate the molecular structures of materials in general through chemical instrument analysis!

There are various types of liquid crystal materials, including low molecular weight compounds used in LCD panels and high molecular weight polymers used in printed circuit boards and electronic components. We would like to introduce examples of molecular structure analysis of these low molecular weight liquid crystals and high molecular weight liquid crystals (LCP). Our company, equipped with a wealth of devices and expertise, can handle reliability testing and analytical analysis of not only liquid crystal materials but also various other materials. Please feel free to consult us regarding the understanding of molecular structures of imported overseas products and materials, as well as troubleshooting issues. 【Case Study Details】 ■ Molecular structure analysis using FT-IR ■ Understanding of surface functional groups (molecular groups) through XPS (ESCA) analysis ■ Example of LCD liquid crystal material analysis using GC-MS *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices
• Contract Analysis
• Contract Analysis

We propose analytical methods tailored to materials and purposes! Here are examples of chemical analysis for each component, such as liquid crystals and sealing materials.

Liquid crystal displays use various organic materials, including liquid crystals, sealing materials, encapsulants, and polarizers. Considering the material properties and degradation mechanisms of each component from a chemical perspective is important for product evaluation and defect analysis. This document presents examples of chemical analysis for the components of liquid crystal displays. [Examples of Chemical Analysis] ■FT-IR: Principal component analysis ■EDX: Elemental analysis ■GCMS: Liquid crystal component analysis ■HS-GCMS: Outgassing analysis (degradation analysis) and more *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices
• Other contract services

The observation target is an IC chip connected to the LCD panel using the COG mounting method! The circuit surface was clearly visible.

We will introduce a case where precision planar grinding was applied to remove glass substrate wiring and conductive particles, allowing for the observation of IC chip circuits with minimal damage. Careful planar grinding was performed from the glass substrate side, removing material down to a few micrometers from the IC chip, enabling the observation of the circuit surface. The IC chip circuit surface was clearly visible, and detailed observation at high magnification became possible. There are many samples, like the one in this case, where detailed observation has become possible through planar grinding, as well as samples that can be processed using FIB or CP techniques. If you have any samples you are struggling with, please consult us. We accept requests for planar grinding only, as well as requests that include observation and analysis. [Overview] <Planar Grinding and Optical Observation> ■ Careful planar grinding was performed from the glass substrate side, removing material down to a few micrometers from the IC chip, enabling the observation of the circuit surface. ■ The IC chip circuit surface was clearly visible, and detailed observation at high magnification became possible. *For more details, please refer to the PDF document or feel free to contact us.

• Contract Inspection
• Other contract services

Numerous achievements in defect analysis! Detailed analysis is possible, from confirming phenomena to hypothesizing the mechanisms of defect occurrence.

Our company conducts "defect analysis of overseas manufactured displays." We can perform detailed analysis from confirming the phenomenon, hypothesizing the defect occurrence mechanism, to narrowing down the production processes that caused the issue. We carry out lighting observations, panel disassembly, and optical microscope observations tailored to the defect symptoms. If it is necessary to narrow down the defective areas and conduct detailed analysis, we will propose appropriate methods. 【Examples of detailed analysis (partial)】 ■ Cross-sectional observation of wiring ■ Foreign object analysis ■ Liquid crystal component analysis ■ Electrical characteristic measurement *Additional costs will be incurred. *For more details, please refer to the PDF document or feel free to contact us.

• LCD display

If any issues arise, detailed analysis will also be provided! A simplified analysis for customers considering the introduction of overseas LCDs.

We will introduce the analysis of good products for liquid crystal displays by Aites Co., Ltd. First, we conduct optical microscope observations focusing on the FPC, FOG, COG, and sealing materials in the state of the cell panel as part of the appearance observation. Next, we dismantle the cell panel to check the sealing materials, PI film, and TFT shape. If any defects are found during the good product analysis, we will propose additional analyses such as cross-sectional observation of wiring and foreign matter analysis to investigate the cause. Please feel free to consult us when needed. [Contents of Appearance Observation] ■ Are there any corrosion or foreign matter on the FPC wiring? ■ Is there any issue with the FOG bonding? ■ Is there any issue with the COG bonding? ■ Are there any breaks or defects in the sealing material? *For more details, please refer to the PDF document or feel free to contact us.

• Analysis Services

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

● The production time for casting prototypes can be shortened! Since model production is not required, the time needed to create prototypes, which previously took about a month, can be significantly reduced. ● Model costs can be reduced! By directly producing sand molds from 3D data, there is no need for model production costs. If changes to the model are necessary, they can be addressed by modifying the 3D data. ● Similar products with different shapes and dimensions can be prototyped simultaneously! With one molding process, different products with similar shapes or varying dimensions can be molded at the same time. This allows for the verification of multiple types in a short period.

Are you struggling to explain "safety" to the client using just drawings? - The risks in blind spots are difficult to convey to the client through drawings alone. - Safety measures often become a target for cost reduction, making it hard to communicate their necessity. - There is a concern that the client might say, "It's more dangerous than I thought," after completion. Risks that are visible to design professionals are not easily understood intuitively by clients who are outside the field. This document is not just a simple explanation of sensor functions; it is a guide to visually explain "why sensors are necessary in that location." It can be used directly as explanatory material for the client. Here are three key points for utilizing this document: 1. Visualization of Risks Blind spots during vehicle departure and contact risks within the site are illustrated clearly. 2. Clarification of Selection Criteria A comparison table outlines the differences between complex sensor types such as infrared, ultrasonic, and loop coils. 3. Diagram of System Configuration It illustrates not just the sensors alone, but how they combine with components like rotating lights and control panels, providing practical assistance for electrical equipment design. Please make use of this to prevent "rework after completion" and "accident risks."

In facilities operating nurse call systems, we have made the bed exit sensor wireless, allowing it to notify in conjunction with the nurse call system. By simply connecting the mat sensor "Foldable Thin Matt-kun," the body movement call "Ugo-kun," and the wheelchair body movement call "Ayumi-chan" to the transmitter HB-RS, you can make the bed exit sensor wireless. The infrared sensor "Just Place Pole-kun" has the transmitter HB-RS built-in. This helps prevent accidents caused by falls, slips, or wandering, contributing to the efficiency of medical operations. 【Features】 ○ Wireless conversion by simply connecting existing sensors to the transmitter HB-WSK. ○ The bed exit sensor notifies wirelessly in conjunction with the nurse call system. ○ Up to 5 transmitters can be registered with a single receiver. ○ The communication distance between the transmitter and receiver is approximately 10 meters. ◎ For more details, please contact us or download the catalog.