Surface observation of IC chips implemented on LCD panels.

We will introduce the observation of the shape of conductive particles in COG implementation. ICs and liquid crystal panels are implemented using the COG method with ACF (anisotropic conductive film). A resin ball is used as the core, and a metal layer (such as nickel or gold) for conductivity is deposited on its surface. During connection, the particles deform appropriately to electrically connect the IC and the panel. To confirm the degree of particle deformation and connection status, cross-sectional observations were conducted, revealing that the particle deformation was at a "medium" level, indicating an appropriate degree of deformation. By examining the deformation of conductive particles from both the planar and cross-sectional directions, we can explore the correlation with display defects. Please feel free to contact us for any inquiries regarding panel-related defects.

We will introduce a case where precision planar grinding was applied to remove wiring and conductive particles from a glass substrate, allowing for the observation of IC chip circuits with minimal damage. Careful planar grinding was performed from the glass substrate side, removing material up to a few micrometers in front of the IC chip, enabling the observation of the circuit surface. The IC chip circuit surface was clearly visible, and detailed observation at high magnification became possible. There are many samples, like the one in this case, where detailed observation has been made possible through planar grinding, as well as samples that can undergo FIB processing or CP processing. If you have any samples that are causing you trouble, please consult with us. We accept requests for planar grinding only, as well as requests that include observation and analysis. For more details, please refer to the related products and catalogs below.