We will be exhibiting at the "Total Solutions Exhibition for Electronic Devices."

Protect semiconductor chips and precision devices from vibrations for safe storage and transportation! This is a transport case for precision devices that is free of siloxane.

Gelbase can be used for the internal and process transport of small parts such as semiconductor chips and precision devices, as well as for overseas transport. It protects precision parts from vibrations and is also highly effective for securing devices during the transport of components like semiconductors. It can be used with peace of mind as it is free of adhesive materials and siloxanes. 【Features】 ■ Protects precision parts from vibrations during transport, preventing damage. The soft gel material significantly reduces vibrations and shocks during transport, supporting safe handling. ■ No silicone used, so there is no impact from siloxanes. Silicone is not used in the materials or separators. ■ No adhesive transfer to parts! The loading surface uses a self-adhesive gel, and since no adhesive materials are used, there is no transfer of glue to the parts. ■ Anti-static treatment! It prevents static destruction of components. ■ Trays and cases can be stacked! Both cases and trays can be held, transported, and stored while stacked. ■ Can be picked up even without a vacuum device!

• Other electronic parts

Protect semiconductor chips and precision devices from vibrations for safe storage and transport! This is a transport case for precision devices that is free of siloxane.

Gelbase can be used for the internal and process transport of small parts such as semiconductor chips and precision devices, as well as for overseas transport. During transport, it protects precision parts from vibrations and is also highly effective for fixing semiconductor components. It can be used with peace of mind as it is free of adhesive materials and siloxane. During transport, parts are securely fixed, and they can be easily picked up by creating a vacuum with a vacuum device. 【Features】 ■ Protects precision parts from vibrations during transport, preventing damage. The soft gel material significantly reduces vibrations and shocks during transport, supporting safe transportation. ■ Minimal change in adhesive strength over time! The adhesive strength remains stable over time, maintaining ease of pickup. ■ No siloxane influence due to non-silicone specifications! Silicone is not used in the materials or separators. ■ No adhesive transfer to parts! A self-adhesive gel is used on the loading surface, and since no adhesive materials are used, there is no transfer of adhesive to the parts.

• Other electronic parts

Are you having trouble removing dust from small areas? A soft pen catches foreign objects! Dust collection pen for printed circuit boards.

The gel cleaner pen can collect dust using the self-adhesive properties of the gel itself. The soft material conforms to the fine irregularities of the circuit board and devices, capturing dust and dirt in detail. 【Important Points of the Gel Cleaner Pen】 ■ No adhesive materials used! No worry about glue transfer! Since it captures dust with the gel's self-adhesive properties, no adhesive materials are used. You can use it with peace of mind without worrying about glue transferring to the circuit board or devices. ■ The tip of the pen does not use silicone. ■ Washable to remove dirt! When it gets dirty, washing it with water or transferring dirt to a transfer sheet (sold separately) restores its stickiness, allowing for repeated use. *For more details, please download and view the catalog.

• others

Are you troubled by dirt on your fingertips while working? Simply grip to remove fine dust from the gloves. Can be reused by washing with water!

Tip remover is a fingertip adhesive gel designed to remove dirt and grease from gloves. It allows you to remove foreign substances attached to gloves without interrupting your workflow. Its hollow structure makes it easy to grip and conforms well to your fingers. By gently rubbing it with your palm under running water, dirt is removed, and the adhesive power is restored. ★Using a dedicated cleaner also allows for disinfection★ 【Important Points of Tip Remover】 ■ Easy-to-grip structure that effectively catches fine dust on fingertips! Made from soft gel material. Its hollow structure adheres closely to the fingertips. ■ No silicone or plasticizers used in the materials. ■ No adhesive materials used! It utilizes the gel's self-adhesive properties to remove dirt. It does not transfer glue to gloves and does not become sticky. It can be installed in any preferred location such as desks, walls, or ceilings according to your needs, and can also be removed. (Note: Installation may not be possible depending on the material of the surface.) ■ Wash with water to remove dirt! Can be washed completely! When it gets dirty, washing it with water restores its adhesive properties, allowing for repeated use. Using a dedicated cleaner also enables disinfection. *For more details, please download and view the catalog.

• Other safety and hygiene products

Protects IC chips and electronic components from vibrations, ensuring safe storage and transportation! This is a domestically produced semiconductor component transport case with a short delivery time and silicone-free specifications.

Gelbase can be used for the transportation of small components such as IC chips and electronic parts within factories, during processes, and for overseas shipping. It protects semiconductor components from vibrations and also serves as a tray for securing devices during transport. Even when overseas products are hard to obtain due to domestic manufacturing, we achieve small lot sizes and short delivery times! It can be used safely as it is free from adhesive materials and siloxanes. 【Features】 - The soft gel material protects IC chips and other components from vibrations and shocks during transport, preventing damage. - The materials/separators are non-silicone, so there is no influence from siloxanes. - A self-adhesive gel is used on the loading surface, ensuring no adhesive transfer to the components since no adhesive materials are used. - Being domestically produced allows for short delivery times. ⇒ While overseas products may take several months from order to delivery, we can deliver immediately because it is made in Japan. - Supports small lot sizes. ⇒ Available for sale in quantities of 10 or more. - No vacuum device is needed during pickup. - Anti-static processing.

• Other electronic parts

Are you troubled by dust caused by static electricity? A sheet that can transfer and adsorb dust with the power of urethane gel!

This is a sticky sheet that transfers and adsorbs dust attached to gloves and antistatic gel rollers. It is made of urethane gel material and does not transfer adhesive. It has antistatic properties, making it usable in places where static electricity is undesirable. It has a high dust collection effect. 【Key Points of Antistatic Gel Sheet】 ■ Static electricity prevention effect! This sticky sheet has antistatic properties, allowing it to be used in environments where static electricity is a concern. The surface resistance value is 10⁸Ω. ■ No adhesive used! Made from urethane gel material, it removes dust using the gel's self-adhesive properties, so no adhesive materials are used. There is no worry about adhesive transferring to gloves, antistatic gel rollers, gel cleaner pens, etc. ■ Washable to restore stickiness! Reusable! When it gets dirty, washing it with water removes the dirt, and once dried, the stickiness is restored. It is not disposable and can be used repeatedly. *For more details, please feel free to contact us.

• others

The goal is not to introduce AI. We will explain "standardization of manufacturing processes" to eliminate dependency and maximize the effectiveness of AI! While the spread of generative AI is progressing, there is an increasing number of manufacturing companies that say, "We don't know where to apply AI due to the black box nature of the site," and "Despite implementation, productivity hasn't increased." The cause lies not in the performance of AI, but in the "lack of business organization and standardization before implementation." In this webinar, we will clearly explain business improvement methods (BPMS) and how to properly organize business processes to avoid wasting AI investments, using case studies. [Recommended for those who:] - Are struggling to engage the field due to resistance like "busy" or "it's fine as it is." - Want to eliminate differences in rules between factories and locations, as well as dependency and black box issues with veteran employees. - Are being asked to "utilize AI" but don't know where to start due to disorganized business processes. [Here is the application form] https://www.earthlink.co.jp/seminar/10840/ *Pre-registration required (free) *We will give a "partial excerpt of the presentation materials" to those who respond to the survey after viewing.

[Speaker] Ms. Sayako Sumomo, Director, International Equipment Division, Equipment Policy Department, Acquisition, Technology & Logistics Agency [Key Lecture Content] As the security environment surrounding our country changes at an accelerating pace, the government is promoting defense equipment transfers as an important policy measure to create a desirable security environment for our nation. Promoting defense equipment transfers not only enhances regional deterrence and response capabilities for peace and stability in the Indo-Pacific region but also contributes to strengthening our country's defense production and technological base through market expansion and supply chain cooperation. Furthermore, the development of the defense industry and other industries with dual-use technologies can lead to growth in the Japanese economy. In this lecture, I will explain recent trends in defense equipment transfers, taking into account the recent revisions to the equipment transfer system. [Lecture Topics] 1. Japan's Defense Policy 2. Significance and System of Equipment Transfers 3. Recent Trends in Equipment Transfers 4. Government Initiatives 5. Q&A / Business Card Exchange

[Speaker] Hiroki Hara, Country Lead, Cloud & Service Provider Segment, Schneider Electric Holdings Co., Ltd. [Key Lecture Content] In the era of AI, it is essential to redesign not just the equipment but the very way energy is utilized in data centers. This presentation will organize the approach to power architecture aimed at enhancing competitiveness, taking into account global trends and the constraints of the Japanese market. Additionally, through Schneider Electric's comprehensive portfolio, which includes cooling and operations, we will provide perspectives for selecting optimal options in Japan's increasingly complex power environment, as well as hints for future implementations. [Lecture Items] 1. Introduction to Schneider Electric 2. Global megatrends and the external environment surrounding the data center industry 3. Architecture of data center power infrastructure - Design philosophy necessary for safely delivering electricity 4. Schneider's portfolio connecting power and cooling, design, construction, and operation 5. Unique challenges of the Japanese market and options for optimal solutions 6. Q&A / Business card exchange

[Speaker] Yuya Sato, Director, Innovation Management Co., Ltd. [Lecture Topics] 1. Main challenges in the field of research and development 2. Overview of research and development management 3. How to utilize "roadmaps" for formulating persuasive mid- to long-term strategies 4. How to utilize "technology portfolios" to achieve convincing resource allocation 5. "Gate management" to improve the success rate of highly innovative research and development themes 6. Integrated research and development management process 7. Q&A

Our TL Division will be exhibiting at the "Surface Treatment Processing Technology Exhibition 2026" to be held on June 26 (Friday) at the Osaka Industry Creation Center. We invite you to visit our booth to see our products and technologies. We sincerely look forward to your attendance. ■ Exhibition Name Surface Treatment Processing Technology Exhibition 2026 ■ Date June 26, 2026 (Friday) ■ Venue Osaka Industry Creation Center, 3F Market Plaza / 4F Event Hall ■ Exhibited Technology We will introduce optimal solutions for surface modification composites and ultra-hard coating removal by adding a new coating to Y-Coat, which leads the mold market. New Coating: Y-Coat Type UL Product Introduction Page