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  1. Home
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  3. EXSEAL CO., LTD. Head office
  4. We will be exhibiting at the "Total Solutions Exhibition for Electronic Devices."
SEMINAR_EVENT
  • May 20, 2024
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May 20, 2024

We will be exhibiting at the "Total Solutions Exhibition for Electronic Devices."

EXSEAL CO., LTD. EXSEAL CO., LTD. Head office
We will be exhibiting at the "Total Solutions Exhibition for Electronic Devices," a trade show that contributes to the development of the entire electronic circuit industry and related sectors. At our booth, we will showcase products that are active in the semiconductor industry! You can actually see samples and try them out for confirmation. ○ Ideal for holding and storing precision parts and chips! Siloxane-free precision parts transport case with "domestic/fully non-silicone specifications"【Gel Base】 ○ For dust removal from printed circuit boards and devices, and for picking small parts! Reusable adhesive pen for foreign matter collection that can be "washed with water"【Gel Cleaner Pen】 ○ Perfect for removing fine dust from fingertips! Can be reused by washing with water! Adhesive gel for fingertips with "non-silicone specifications & no plasticizers"【Tip Remover】 We sincerely look forward to your visit. ★ Visit us here ★ Total Solutions Exhibition for Electronic Devices ◎ Dates: June 12 (Wednesday) - 14 (Friday), 2024, 10:00 AM - 5:00 PM ◎ Venue: Tokyo Big Sight (East Exhibition Hall) ◎ Booth Number: 6H-10
Gel-based image
Gel-based image
Total Solution Banner for Electronic Devices
Total Solution Banner for Electronic Devices
Date and time Wednesday, Jun 12, 2024 ~ Friday, Jun 14, 2024
10:00 AM ~ 05:00 PM
Capital Tokyo Big Sight (East Exhibition Hall) No. 6H-10
Entry fee Free If you register in advance for your visit, the admission fee will be free.
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Silicone-free chip transport case "Gel Base" without adhesive materials.

Protect semiconductor chips and precision devices from vibrations for safe storage and transportation! This is a transport case for precision devices that is free of siloxane.

Gelbase can be used for the internal and process transport of small parts such as semiconductor chips and precision devices, as well as for overseas transport. It protects precision parts from vibrations and is also highly effective for securing devices during the transport of components like semiconductors. It can be used with peace of mind as it is free of adhesive materials and siloxanes. 【Features】 ■ Protects precision parts from vibrations during transport, preventing damage. The soft gel material significantly reduces vibrations and shocks during transport, supporting safe handling. ■ No silicone used, so there is no impact from siloxanes. Silicone is not used in the materials or separators. ■ No adhesive transfer to parts! The loading surface uses a self-adhesive gel, and since no adhesive materials are used, there is no transfer of glue to the parts. ■ Anti-static treatment! It prevents static destruction of components. ■ Trays and cases can be stacked! Both cases and trays can be held, transported, and stored while stacked. ■ Can be picked up even without a vacuum device!

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Silicone-free semiconductor chip transport case "Gel Base V Type"

Protect semiconductor chips and precision devices from vibrations for safe storage and transport! This is a transport case for precision devices that is free of siloxane.

Gelbase can be used for the internal and process transport of small parts such as semiconductor chips and precision devices, as well as for overseas transport. During transport, it protects precision parts from vibrations and is also highly effective for fixing semiconductor components. It can be used with peace of mind as it is free of adhesive materials and siloxane. During transport, parts are securely fixed, and they can be easily picked up by creating a vacuum with a vacuum device. 【Features】 ■ Protects precision parts from vibrations during transport, preventing damage. The soft gel material significantly reduces vibrations and shocks during transport, supporting safe transportation. ■ Minimal change in adhesive strength over time! The adhesive strength remains stable over time, maintaining ease of pickup. ■ No siloxane influence due to non-silicone specifications! Silicone is not used in the materials or separators. ■ No adhesive transfer to parts! A self-adhesive gel is used on the loading surface, and since no adhesive materials are used, there is no transfer of adhesive to the parts.

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For cleaning the base! Gently removes dust from details with the 'Gel Cleaner Pen'

Are you having trouble removing dust from small areas? A soft pen catches foreign objects! Dust collection pen for printed circuit boards.

The gel cleaner pen can collect dust using the self-adhesive properties of the gel itself. The soft material conforms to the fine irregularities of the circuit board and devices, capturing dust and dirt in detail. 【Important Points of the Gel Cleaner Pen】 ■ No adhesive materials used! No worry about glue transfer! Since it captures dust with the gel's self-adhesive properties, no adhesive materials are used. You can use it with peace of mind without worrying about glue transferring to the circuit board or devices. ■ The tip of the pen does not use silicone. ■ Washable to remove dirt! When it gets dirty, washing it with water or transferring dirt to a transfer sheet (sold separately) restores its stickiness, allowing for repeated use. *For more details, please download and view the catalog.

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"Just grip it!" Tip remover to clean dirt from fingertips during work.

Are you troubled by dirt on your fingertips while working? Simply grip to remove fine dust from the gloves. Can be reused by washing with water!

Tip remover is a fingertip adhesive gel designed to remove dirt and grease from gloves. It allows you to remove foreign substances attached to gloves without interrupting your workflow. Its hollow structure makes it easy to grip and conforms well to your fingers. By gently rubbing it with your palm under running water, dirt is removed, and the adhesive power is restored. ★Using a dedicated cleaner also allows for disinfection★ 【Important Points of Tip Remover】 ■ Easy-to-grip structure that effectively catches fine dust on fingertips! Made from soft gel material. Its hollow structure adheres closely to the fingertips. ■ No silicone or plasticizers used in the materials. ■ No adhesive materials used! It utilizes the gel's self-adhesive properties to remove dirt. It does not transfer glue to gloves and does not become sticky. It can be installed in any preferred location such as desks, walls, or ceilings according to your needs, and can also be removed. (Note: Installation may not be possible depending on the material of the surface.) ■ Wash with water to remove dirt! Can be washed completely! When it gets dirty, washing it with water restores its adhesive properties, allowing for repeated use. Using a dedicated cleaner also enables disinfection. *For more details, please download and view the catalog.

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Domestic Short Delivery Adhesive-Free Transport Chip Tray 'Gel Base'

Protects IC chips and electronic components from vibrations, ensuring safe storage and transportation! This is a domestically produced semiconductor component transport case with a short delivery time and silicone-free specifications.

Gelbase can be used for the transportation of small components such as IC chips and electronic parts within factories, during processes, and for overseas shipping. It protects semiconductor components from vibrations and also serves as a tray for securing devices during transport. Even when overseas products are hard to obtain due to domestic manufacturing, we achieve small lot sizes and short delivery times! It can be used safely as it is free from adhesive materials and siloxanes. 【Features】 - The soft gel material protects IC chips and other components from vibrations and shocks during transport, preventing damage. - The materials/separators are non-silicone, so there is no influence from siloxanes. - A self-adhesive gel is used on the loading surface, ensuring no adhesive transfer to the components since no adhesive materials are used. - Being domestically produced allows for short delivery times. ⇒ While overseas products may take several months from order to delivery, we can deliver immediately because it is made in Japan. - Supports small lot sizes. ⇒ Available for sale in quantities of 10 or more. - No vacuum device is needed during pickup. - Anti-static processing.

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Static electricity prevention! 'Semiconductive gel sheet' that can transfer dust from gloves and other items.

Are you troubled by dust caused by static electricity? A sheet that can transfer and adsorb dust with the power of urethane gel!

This is a sticky sheet that transfers and adsorbs dust attached to gloves and antistatic gel rollers. It is made of urethane gel material and does not transfer adhesive. It has antistatic properties, making it usable in places where static electricity is undesirable. It has a high dust collection effect. 【Key Points of Antistatic Gel Sheet】 ■ Static electricity prevention effect! This sticky sheet has antistatic properties, allowing it to be used in environments where static electricity is a concern. The surface resistance value is 10⁸Ω. ■ No adhesive used! Made from urethane gel material, it removes dust using the gel's self-adhesive properties, so no adhesive materials are used. There is no worry about adhesive transferring to gloves, antistatic gel rollers, gel cleaner pens, etc. ■ Washable to restore stickiness! Reusable! When it gets dirty, washing it with water removes the dirt, and once dried, the stickiness is restored. It is not disposable and can be used repeatedly. *For more details, please feel free to contact us.

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Precision Parts Storage and Transport Case "Gelbase" Leaflet

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Hold parts with the power of gel! Precision parts transport case 'Gel Base'

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Vacuum Type Precision Parts Storage and Transport Case 'Gelbase V Type' Leaflet

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EXSEAL CO., LTD.
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[Seminar] Policies and Latest Trends in Decarbonization and Resource Circulation in the Construction Sector

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  • SEMINAR_EVENT

[Lecture Topics] 1. Trends in Policies for Decarbonization of Housing and Buildings Tetsuya Hirayama, Deputy Director, Housing Bureau, Ministry of Land, Infrastructure, Transport and Tourism (in charge of architectural planning) 2. Construction Circular Economy - Expanding Horizontal Recycling for Achieving Sustainable Construction Takahiro Moritomi, Analyst, Social Infrastructure Team, Next Generation Infrastructure and Services Office, Industry Research Department, Mizuho Bank, Ltd. 3. Beyond "Scrap and Build" Aiming for the Realization of "Circular Design Build®" Shoichi Fukui, Senior Chief Expert, Sustainability Promotion Department, Management Planning Office, Takenaka Corporation

Jun 25, 2026

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[Seminar] Practical Response to the Obligation of Measures Against Kasuhara and Job Hunting Sexual Harassment

  • NEW
  • SEMINAR_EVENT

[Instructor] Attorney Kurato Suzuki, Irokawa Law Office [Key Lecture Content] Due to the amendments to the Comprehensive Promotion Law for Labor Policies, starting from October 1, 2026, employers will be required to take necessary measures in employment management regarding customer harassment (Kasu Hara) and sexual harassment against job seekers (Job Hunting Sexual Harassment). In line with this, companies will need to prepare for practical implementation before the enforcement date, based on the guidelines published by the Ministry of Health, Labour and Welfare. This includes developing internal regulations, establishing consultation and response systems, raising awareness within the company, and determining judgment and response methods on-site. This seminar will organize the setting of job hunting rules related to job hunting sexual harassment, internal awareness, and key points for regulatory development. It will also explain the distinction between legitimate complaints and customer harassment, judgment, documentation, and response on-site, the establishment of a company-wide system, regulatory development considering dispute risks, and points that are easily overlooked. The Human Resources, Labor, Legal, and Compliance departments will systematically organize the response matters that need to be confirmed in preparation for the enforcement on October 1, 2026, from the perspectives of guideline compliance and on-site operations. [Lecture Items] 1. Job Hunting Sexual Harassment 2. Customer Harassment 3. Q&A

Jun 25, 2026

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[Seminar] INPEX's Challenge: Technology Development and Business Outlook for CO2 Methanation

  • NEW
  • SEMINAR_EVENT

[Speaker] Mr. Itsuki Wakayama, Project General Manager, Technology Promotion Unit, Low Carbon Solutions Division, INPEX Corporation [Key Lecture Content] The greatest advantage of synthetic methane production through CO2 methanation technology is that it enables decarbonization without significant additions or modifications to all existing natural gas and city gas infrastructure. At INPEX, after two NEDO commissioned projects, we have been conducting the development of practical application technology with a capacity of 400 Nm3-CO2/h, one of the largest in the world, as a subsidized project by NEDO since the fiscal year 2021. By the fiscal year 2025, we aim to achieve the injection of synthetic methane produced during the demonstration operation of the test facility. This presentation will provide detailed information on the results of the NEDO project for the fiscal year 2025, including the current status of the latest test facilities. [Presentation Items] 1. INPEX's efforts towards net zero by 2050 2. Policy trends related to CO2 methanation 3. Challenges of CO2 methanation 4. Results of the NEDO practical application technology development project with a capacity of 400 Nm3-CO2/h for the fiscal year 2025 5. Future commercialization prospects and challenges 6. Q&A / Business card exchange

Jun 25, 2026

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[Seminar] Generative AI Planning Techniques - 90% of AI Utilization is About "Questions"

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  • SEMINAR_EVENT

[Speaker] Mr. Satoru Shimizu, President and CEO of Okunote Inc. [Key Lecture Content] Generative AI is not a "magic wand," but a "mirror" that reflects the questions of the user. In this lecture, based on my book "The 'Super' Planning Techniques Practiced by Competition Disruptors: Seven Creative Steps to Lead Winning Strategies with the 'Art of Questioning'," I will explain how to overcome the challenges of proposals being rejected, not moving forward within the company, and not being executed on-site through interactions with AI. I will introduce the entire process of planning, linking it with AI utilization, from question design to hypothesis destruction, structuring materials from the decision-maker's perspective, forming internal consensus, managing execution, and turning reflections into assets. In the latter part of the workshop (exclusive to on-site participants), you will actually formulate questions and refine your dialogue with AI, taking home usable "art of questioning" techniques for tomorrow. [Lecture Items] 1. Orientation: AI is a "mirror," not a "magic wand." 2. Enhancing the precision of planning through "question design" and "hypothesis destruction." 3. Structuring materials from the decision-maker's perspective to create "acceptable" proposals. 4. Forming consensus that transcends internal barriers. 5. Mechanisms that prevent execution from stopping and turning experiences into assets through reflection. 6. Habitualizing AI as a "partner" and the roles humans will take on in the AI era.

Jun 25, 2026

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Japan IT Week [Autumn] AI Infrastructure and Data Center EXPO

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【Exhibition Overview】 A collection of products related to data centers, which are at the core of AI infrastructure, gathered in one place.

Jun 25, 2026

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