- Publication year : 2026
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Exil Co., Ltd. will be exhibiting at "TOKYO PACK 2026," where the latest trends in packaging gather. ▼ Do you have any of these challenges in your packaging line or clean room? - We want to completely eliminate complaints about hair and dust contamination. - The costs of adhesive rollers and sheets are piling up due to waste. - We want to reduce on-site waste as part of an easily initiated SDGs effort. - We want to implement and showcase more reliable measures for the next hygiene audit. At Exil's booth, we will propose the latest measures against foreign matter contamination using our unique urethane gel products that "restore adhesive strength through washing." If you would like to "actually touch and verify the adhesive strength" or "know how much time and cost can be saved," please stop by our booth. We sincerely look forward to your visit.
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Due to the positive response last time, Exile Corporation will exhibit at the Kyushu Semiconductor Industry Exhibition again this year. To everyone in the semiconductor industry, do you have any of these concerns? - I want a transport case for precision parts, but there are no non-silicone options... - I'm having trouble because I can't purchase small lots of overseas products... - I want to remove foreign substances attached to substrates and devices, especially in small areas... Exile can solve these worries. We will showcase clean products that are valuable in the semiconductor industry, including our non-silicone precision parts transport case "Gel Base" and the "Gel Cleaner Pen," which can precisely remove dust and debris from substrates and devices. Here, you will find hints for solving challenges without giving up on cost or quality. Please come and experience the actual usability at the venue. We sincerely look forward to your visit.
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