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  3. EXSEAL CO., LTD. Head office
  4. Notice of participation in the "3rd Kyushu Semiconductor Industry Exhibition," one of the largest semiconductor-focused exhibitions in Western Japan, from September 30 (Wed) to October 1 (Thu).
SEMINAR_EVENT
  • Sep 08, 2026
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Sep 08, 2026

Notice of participation in the "3rd Kyushu Semiconductor Industry Exhibition," one of the largest semiconductor-focused exhibitions in Western Japan, from September 30 (Wed) to October 1 (Thu).

EXSEAL CO., LTD. EXSEAL CO., LTD. Head office
Due to the positive response last time, Exile Corporation will exhibit at the Kyushu Semiconductor Industry Exhibition again this year. To everyone in the semiconductor industry, do you have any of these concerns? - I want a transport case for precision parts, but there are no non-silicone options... - I'm having trouble because I can't purchase small lots of overseas products... - I want to remove foreign substances attached to substrates and devices, especially in small areas... Exile can solve these worries. We will showcase clean products that are valuable in the semiconductor industry, including our non-silicone precision parts transport case "Gel Base" and the "Gel Cleaner Pen," which can precisely remove dust and debris from substrates and devices. Here, you will find hints for solving challenges without giving up on cost or quality. Please come and experience the actual usability at the venue. We sincerely look forward to your visit.
Date and time Wednesday, Sep 30, 2026 ~ Thursday, Oct 01, 2026
Capital ■Venue: Marine Messe Fukuoka Hall B ■Booth Number: B8-23 ■Address: 2-1 Okihamacho, Hakata Ward, Fukuoka City, Fukuoka Prefecture, 812-0031
Entry fee Free
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Non-silicone specification semiconductor precision parts transport case "Gel Base"

Sample giveaway! For holding and storing precision parts and chips. Protects precision parts and allows for pickup without a vacuum device!

The soft gel prevents damage during the transport of precision parts from vibrations and other factors. Since it does not use adhesive materials, there is no risk of glue transfer to the parts, and there is also no concern about siloxane transfer as silicone is not used in the material. 【Key Points of Gel Base】 ■ Non-Silicone! There is no concern about transfer since silicone is not used in the material. ■ No glue transfer to parts! A self-adhesive gel is used on the loading surface, and since no adhesive materials are used, there is no glue transfer to the parts. ■ Anti-static treatment! Conductivity is imparted to the material, preventing electrostatic damage to the parts. ■ Stackable trays and cases! Both cases and trays can be held, transported, and stored while stacked. ■ Can be picked up without a vacuum device! The cloudy mesh type has a surface with irregularities, allowing for pickup without a vacuum device. *For more details, please download the materials or contact us through our website.

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"Gentle Dust Removal" Foreign Object Collection Adhesive Pen 'Gel Cleaner Pen'

Gently removes dust with the softness and stickiness of the gel! Catches fine dust without damaging circuit boards and other surfaces!

The soft gel prevents damage from vibrations during the transport of precision parts. Since it does not use adhesive materials, there is no worry about glue transfer to the parts. 【Important Points of the Gel Cleaner Pen】 ■ Does not scratch parts! Due to its soft material, it can remove dust without scratching chips or devices. ■ No glue transfer to parts! It uses self-adhesive gel to pick up dirt, so it does not use adhesive materials, and there is no transfer of glue to the device. ■ Reusable! Dirt can be transferred to a transfer sheet or washed away with water, allowing it to be cleaned effectively. Once dried, its adhesive properties are restored, making it reusable. ■ For picking parts! Utilizing the gel's adhesion, it can also be used for picking up small parts. ■ Choose from different pen tip shapes! There are four types of pen tip shapes available, allowing you to choose according to your needs. *For more details, please download the materials or contact us through our website.

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Silicone-free semiconductor chip transport case "Gel Base V Type"

Protect semiconductor chips and precision devices from vibrations for safe storage and transport! This is a transport case for precision devices that is free of siloxane.

Gelbase can be used for the internal and process transport of small parts such as semiconductor chips and precision devices, as well as for overseas transport. During transport, it protects precision parts from vibrations and is also highly effective for fixing semiconductor components. It can be used with peace of mind as it is free of adhesive materials and siloxane. During transport, parts are securely fixed, and they can be easily picked up by creating a vacuum with a vacuum device. 【Features】 ■ Protects precision parts from vibrations during transport, preventing damage. The soft gel material significantly reduces vibrations and shocks during transport, supporting safe transportation. ■ Minimal change in adhesive strength over time! The adhesive strength remains stable over time, maintaining ease of pickup. ■ No siloxane influence due to non-silicone specifications! Silicone is not used in the materials or separators. ■ No adhesive transfer to parts! A self-adhesive gel is used on the loading surface, and since no adhesive materials are used, there is no transfer of adhesive to the parts.

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For transporting precision parts! Chip and component holding sheet 'Gel Base Sheet'

Are you struggling with product defects in chips and precision parts? Prevent device failures with adhesive-free, non-silicone holding sheets!

The soft gel prevents damage during the transport of precision parts due to vibrations and other factors. Since it does not use adhesive materials, there is no risk of glue transfer to the parts, and there is also no concern about siloxane transfer as it does not use silicone in the material. This is a non-silicone sheet that can be attached to cases for temporary fixation of parts or laid on workbenches for holding. **Key Points of the Gel Base** - **Non-Silicone!** The material does not contain silicone. - **No Glue Transfer to Parts!** The load-bearing surface uses a self-adhesive gel, and since no adhesive materials are used, there is no transfer of glue to the parts. - **Static Electricity Prevention!** The material is endowed with conductivity to prevent static destruction of parts. - **Can Be Cut with Scissors, Size Adjustable!** The sheet can be cut with scissors, allowing you to use it according to the size of your cases or trays. - **Can Be Picked Up Without a Vacuum Device!** The cloudy mesh type has a textured surface, allowing for pickup without a vacuum device.

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Silicone-free chip transport case "Gel Base" without adhesive materials.

Protect semiconductor chips and precision devices from vibrations for safe storage and transportation! This is a transport case for precision devices that is free of siloxane.

Gelbase can be used for the internal and process transport of small parts such as semiconductor chips and precision devices, as well as for overseas transport. It protects precision parts from vibrations and is also highly effective for securing devices during the transport of components like semiconductors. It can be used with peace of mind as it is free of adhesive materials and siloxanes. 【Features】 ■ Protects precision parts from vibrations during transport, preventing damage. The soft gel material significantly reduces vibrations and shocks during transport, supporting safe handling. ■ No silicone used, so there is no impact from siloxanes. Silicone is not used in the materials or separators. ■ No adhesive transfer to parts! The loading surface uses a self-adhesive gel, and since no adhesive materials are used, there is no transfer of glue to the parts. ■ Anti-static treatment! It prevents static destruction of components. ■ Trays and cases can be stacked! Both cases and trays can be held, transported, and stored while stacked. ■ Can be picked up even without a vacuum device!

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Domestic Short Delivery Adhesive-Free Transport Chip Tray 'Gel Base'

Protects IC chips and electronic components from vibrations, ensuring safe storage and transportation! This is a domestically produced semiconductor component transport case with a short delivery time and silicone-free specifications.

Gelbase can be used for the transportation of small components such as IC chips and electronic parts within factories, during processes, and for overseas shipping. It protects semiconductor components from vibrations and also serves as a tray for securing devices during transport. Even when overseas products are hard to obtain due to domestic manufacturing, we achieve small lot sizes and short delivery times! It can be used safely as it is free from adhesive materials and siloxanes. 【Features】 - The soft gel material protects IC chips and other components from vibrations and shocks during transport, preventing damage. - The materials/separators are non-silicone, so there is no influence from siloxanes. - A self-adhesive gel is used on the loading surface, ensuring no adhesive transfer to the components since no adhesive materials are used. - Being domestically produced allows for short delivery times. ⇒ While overseas products may take several months from order to delivery, we can deliver immediately because it is made in Japan. - Supports small lot sizes. ⇒ Available for sale in quantities of 10 or more. - No vacuum device is needed during pickup. - Anti-static processing.

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"Gel Base" to prevent damage inside the transport case for precision parts.

Solve problems such as electronic device failures due to siloxane and impacts during transportation with the non-silicone case "Gel Base"!

When transporting precision parts, do you have any of these concerns? - The product was damaged due to impact during transport... - Electronic components failed due to siloxane emitted from silicone cases... - Static electricity affected the parts... The transport case 'Gelbase' developed by Exile protects products from shaking and impact during transport with its soft urethane gel sheet and the gel's self-adhesiveness. Additionally, because it is non-silicone, there is no risk of siloxane, which can cause failures during transport, and it is also treated to prevent static electricity, contributing to a reduction in defective products during transport. You can choose the sheet shape, size, color, and height according to your application. ★ Currently offering samples ★ If you are interested, please check the materials or contact us through our website. 【Features】 ■ Non-silicone ■ No adhesive transfer to parts ■ Stackable trays and cases ■ Can be picked up without a vacuum device due to surface irregularities

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"Just grip it!" Tip remover to clean dirt from fingertips during work.

Are you troubled by dirt on your fingertips while working? Simply grip to remove fine dust from the gloves. Can be reused by washing with water!

Tip remover is a fingertip adhesive gel designed to remove dirt and grease from gloves. It allows you to remove foreign substances attached to gloves without interrupting your workflow. Its hollow structure makes it easy to grip and conforms well to your fingers. By gently rubbing it with your palm under running water, dirt is removed, and the adhesive power is restored. ★Using a dedicated cleaner also allows for disinfection★ 【Important Points of Tip Remover】 ■ Easy-to-grip structure that effectively catches fine dust on fingertips! Made from soft gel material. Its hollow structure adheres closely to the fingertips. ■ No silicone or plasticizers used in the materials. ■ No adhesive materials used! It utilizes the gel's self-adhesive properties to remove dirt. It does not transfer glue to gloves and does not become sticky. It can be installed in any preferred location such as desks, walls, or ceilings according to your needs, and can also be removed. (Note: Installation may not be possible depending on the material of the surface.) ■ Wash with water to remove dirt! Can be washed completely! When it gets dirty, washing it with water restores its adhesive properties, allowing for repeated use. Using a dedicated cleaner also enables disinfection. *For more details, please download and view the catalog.

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Related catalog(6)

Precision Parts Storage and Transport Case "Gelbase" Leaflet

Precision Parts Storage and Transport Case "Gelbase" Leaflet

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Foreign Object Collection Adhesive Pen "Gel Cleaner Pen" Leaflet

Foreign Object Collection Adhesive Pen "Gel Cleaner Pen" Leaflet

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Leaflet for the "Gel Base Sheet" for temporary fixation of precision devices.

Leaflet for the "Gel Base Sheet" for temporary fixation of precision devices.

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Vacuum Type Precision Parts Storage and Transport Case 'Gelbase V Type' Leaflet

Vacuum Type Precision Parts Storage and Transport Case 'Gelbase V Type' Leaflet

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Hold parts with the power of gel! Precision parts transport case 'Gel Base'

Hold parts with the power of gel! Precision parts transport case 'Gel Base'

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Finger Adhesive Gel 'Tip Remover' Leaflet

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EXSEAL CO., LTD.
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Knit sample

Announcement of Participation in "Japan Best Knit Selection 2026"

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  • SEMINAR_EVENT

Our company will be exhibiting at the "Japan Best Knit Selection 2026" held at the Tokyo Metropolitan Industrial Trade Center, Hamamatsucho Hall. At this exhibition, we will introduce various digital data that can be searched, viewed, and purchased to assist in the planning, production, and sales of fashion items, centered around our design software <APEXFiz Design>. We will also present our comprehensive web service <yarnbank>, which allows users to search, view, and download yarn information from around the world, as well as our digital content web service <SHIMA Datamall>. Additionally, we will showcase new services we are launching, including a <data creation outsourcing service> that supports everything from planning to product commercialization, and an <aftercare service> that maintains the condition of knitting machines. Exhibition Contents: APEXFiz Design (Design Software) SHIMA Datamall (Digital Content Web Service) yarnbank (Comprehensive Yarn Information Web Service) SHIMANAVI (e-Learning System) Whole Garment and other knit samples <Contact Information> Tokyo Branch, Minami TEL: 03-3246-0511

Nov 06, 2026

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[Seminar] Latest Trends in Policies Related to Food Tech

  • NEW
  • SEMINAR_EVENT

[Lecture Topics] 1. Current Status of Food Tech Policy Promotion and Future Developments of Plant Factories Ryo Miyamoto, Head of Food Tech Strategy Promotion Group, Ministry of Agriculture, Forestry and Fisheries 1. Formulation of the "Japan Growth Strategy" and Future Outlook 2. Background and Responses to Food Tech Discussions at the Ministry of Agriculture, Forestry and Fisheries 3. Budget Requests for Food Tech for Fiscal Year 2027 4. Current Status and Challenges of Plant Factories, and Direction of Responses 5. Q&A / Business Card Exchange 2. Situation Surrounding Aquaculture and Future Developments Towards the Growth of Land-Based Aquaculture Shingo Fujita, Director of Cultured Aquaculture Division, Fisheries Agency 1. Supply and Demand Trends of Seafood in Japan and Worldwide 2. Production Trends in Japan's Aquaculture Industry 3. "Comprehensive Strategy for the Growth of the Aquaculture Industry" 4. Current Status of Land-Based Aquaculture in Our Country 5. Direction of Land-Based Aquaculture (Japan Growth Strategy) 6. Q&A / Business Card Exchange

Nov 06, 2026

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[Seminar] The Path to AI Transformation and Growth in the Cable Television Business

  • NEW
  • SEMINAR_EVENT

[Speaker] Keigo Shibagaki, Director CAIO, Japan Cable Lab, General Incorporated Association [Key Lecture Content] With the rapid evolution of AI, industrial structures, business domains, values, and lifestyles are undergoing significant changes. Some businesses and industries may disappear in an instant. What will not disappear, no matter how much AI evolves, is the homes where people live. Regional businesses, like cable services, which are close to these enduring end users, will be reevaluated in an AI-centric society. How businesses incorporate AI and connect it to growth is crucial. A misstep could lead to being overwhelmed by the wave of AI evolution, resulting in wasted efforts and unnecessary investments. In this lecture, we will discuss how businesses can engage with AI to protect and grow their operations, touching on the direction of technological evolution related to AI, the content of Japan Cable Lab's "Cable AI," and also the AI development engineering at Japan Cable Lab.

Nov 06, 2026

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[Seminar] The Transformation of Industrial Structure and Business Opportunities Brought by AI Factory

  • NEW
  • SEMINAR_EVENT

[Speaker] Shinya Okimoto, Founder & CEO of Oki Studio LLC [Lecture Topics] Part 1: What is an AI Factory? - A New Industrial Infrastructure for the AI Era Part 2: Who Does the AI Factory Help Grow? - The Structure of Competitive Advantage in Growing Companies Part 3: Where Will the Next Growth Opportunities Arise? - New Business Areas Created by AI Investment Part 4: Where Should Japanese Companies Compete? - Growth Strategies Toward 2030 [Q&A]

Nov 06, 2026

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[Free Online Seminar] Introduction to System Integration with Next-Generation Scales

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  • SEMINAR_EVENT

To comply with regulations, traceability, and data integrity, the adoption of LIMS and ELN is progressing, along with the networking of analytical instruments such as chromatography and mass spectrometry. However, while automated data collection and centralized management are advancing, new barriers associated with connectivity are also becoming apparent. Data silos due to inconsistent standards among equipment manufacturers, the difficulty of system integration caused by vendor lock-in, as well as cybersecurity risks and significant variations in the IT literacy of researchers and technicians conducting experiments on-site, are major bottlenecks. In this online seminar, we will introduce our next-generation premium electronic balance, the new product "Cubis III," which is gaining attention as one of the solutions to these challenges. We hope you will join us! Date and Time: December 8, 2026 (Tuesday) 13:30 - 14:30 Format: Online (Teams) Registration Deadline: December 4, 2026 (Friday) by 17:00 Participation Fee: Free Please register here: https://sar.to/onlineseminar-1208

Nov 06, 2026

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