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  3. EXSEAL CO., LTD. Head office
  4. Notice of participation in the "3rd Kyushu Semiconductor Industry Exhibition," one of the largest semiconductor-focused exhibitions in Western Japan, from September 30 (Wed) to October 1 (Thu).
SEMINAR_EVENT UPDATE
  • Sep 08, 2026
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Sep 08, 2026

Notice of participation in the "3rd Kyushu Semiconductor Industry Exhibition," one of the largest semiconductor-focused exhibitions in Western Japan, from September 30 (Wed) to October 1 (Thu).

EXSEAL CO., LTD. EXSEAL CO., LTD. Head office
Due to the positive response last time, Exile Corporation will exhibit at the Kyushu Semiconductor Industry Exhibition again this year. To everyone in the semiconductor industry, do you have any of these concerns? - I want a transport case for precision parts, but there are no non-silicone options... - I'm having trouble because I can't purchase small lots of overseas products... - I want to remove foreign substances attached to substrates and devices, especially in small areas... Exile can solve these worries. We will showcase clean products that are valuable in the semiconductor industry, including our non-silicone precision parts transport case "Gel Base" and the "Gel Cleaner Pen," which can precisely remove dust and debris from substrates and devices. Here, you will find hints for solving challenges without giving up on cost or quality. Please come and experience the actual usability at the venue. We sincerely look forward to your visit.
Date and time Wednesday, Sep 30, 2026 ~ Thursday, Oct 01, 2026
Capital ■Venue: Marine Messe Fukuoka Hall B ■Booth Number: B8-23 ■Address: 2-1 Okihamacho, Hakata Ward, Fukuoka City, Fukuoka Prefecture, 812-0031
Entry fee Free
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Non-silicone specification semiconductor precision parts transport case "Gel Base"

Sample giveaway! For holding and storing precision parts and chips. Protects precision parts and allows for pickup without a vacuum device!

The soft gel prevents damage during the transport of precision parts from vibrations and other factors. Since it does not use adhesive materials, there is no risk of glue transfer to the parts, and there is also no concern about siloxane transfer as silicone is not used in the material. 【Key Points of Gel Base】 ■ Non-Silicone! There is no concern about transfer since silicone is not used in the material. ■ No glue transfer to parts! A self-adhesive gel is used on the loading surface, and since no adhesive materials are used, there is no glue transfer to the parts. ■ Anti-static treatment! Conductivity is imparted to the material, preventing electrostatic damage to the parts. ■ Stackable trays and cases! Both cases and trays can be held, transported, and stored while stacked. ■ Can be picked up without a vacuum device! The cloudy mesh type has a surface with irregularities, allowing for pickup without a vacuum device. *For more details, please download the materials or contact us through our website.

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"Gentle Dust Removal" Foreign Object Collection Adhesive Pen 'Gel Cleaner Pen'

Gently removes dust with the softness and stickiness of the gel! Catches fine dust without damaging circuit boards and other surfaces!

The soft gel prevents damage from vibrations during the transport of precision parts. Since it does not use adhesive materials, there is no worry about glue transfer to the parts. 【Important Points of the Gel Cleaner Pen】 ■ Does not scratch parts! Due to its soft material, it can remove dust without scratching chips or devices. ■ No glue transfer to parts! It uses self-adhesive gel to pick up dirt, so it does not use adhesive materials, and there is no transfer of glue to the device. ■ Reusable! Dirt can be transferred to a transfer sheet or washed away with water, allowing it to be cleaned effectively. Once dried, its adhesive properties are restored, making it reusable. ■ For picking parts! Utilizing the gel's adhesion, it can also be used for picking up small parts. ■ Choose from different pen tip shapes! There are four types of pen tip shapes available, allowing you to choose according to your needs. *For more details, please download the materials or contact us through our website.

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Silicone-free semiconductor chip transport case "Gel Base V Type"

Protect semiconductor chips and precision devices from vibrations for safe storage and transport! This is a transport case for precision devices that is free of siloxane.

Gelbase can be used for the internal and process transport of small parts such as semiconductor chips and precision devices, as well as for overseas transport. During transport, it protects precision parts from vibrations and is also highly effective for fixing semiconductor components. It can be used with peace of mind as it is free of adhesive materials and siloxane. During transport, parts are securely fixed, and they can be easily picked up by creating a vacuum with a vacuum device. 【Features】 ■ Protects precision parts from vibrations during transport, preventing damage. The soft gel material significantly reduces vibrations and shocks during transport, supporting safe transportation. ■ Minimal change in adhesive strength over time! The adhesive strength remains stable over time, maintaining ease of pickup. ■ No siloxane influence due to non-silicone specifications! Silicone is not used in the materials or separators. ■ No adhesive transfer to parts! A self-adhesive gel is used on the loading surface, and since no adhesive materials are used, there is no transfer of adhesive to the parts.

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For transporting precision parts! Chip and component holding sheet 'Gel Base Sheet'

Are you struggling with product defects in chips and precision parts? Prevent device failures with adhesive-free, non-silicone holding sheets!

The soft gel prevents damage during the transport of precision parts due to vibrations and other factors. Since it does not use adhesive materials, there is no risk of glue transfer to the parts, and there is also no concern about siloxane transfer as it does not use silicone in the material. This is a non-silicone sheet that can be attached to cases for temporary fixation of parts or laid on workbenches for holding. **Key Points of the Gel Base** - **Non-Silicone!** The material does not contain silicone. - **No Glue Transfer to Parts!** The load-bearing surface uses a self-adhesive gel, and since no adhesive materials are used, there is no transfer of glue to the parts. - **Static Electricity Prevention!** The material is endowed with conductivity to prevent static destruction of parts. - **Can Be Cut with Scissors, Size Adjustable!** The sheet can be cut with scissors, allowing you to use it according to the size of your cases or trays. - **Can Be Picked Up Without a Vacuum Device!** The cloudy mesh type has a textured surface, allowing for pickup without a vacuum device.

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Silicone-free chip transport case "Gel Base" without adhesive materials.

Protect semiconductor chips and precision devices from vibrations for safe storage and transportation! This is a transport case for precision devices that is free of siloxane.

Gelbase can be used for the internal and process transport of small parts such as semiconductor chips and precision devices, as well as for overseas transport. It protects precision parts from vibrations and is also highly effective for securing devices during the transport of components like semiconductors. It can be used with peace of mind as it is free of adhesive materials and siloxanes. 【Features】 ■ Protects precision parts from vibrations during transport, preventing damage. The soft gel material significantly reduces vibrations and shocks during transport, supporting safe handling. ■ No silicone used, so there is no impact from siloxanes. Silicone is not used in the materials or separators. ■ No adhesive transfer to parts! The loading surface uses a self-adhesive gel, and since no adhesive materials are used, there is no transfer of glue to the parts. ■ Anti-static treatment! It prevents static destruction of components. ■ Trays and cases can be stacked! Both cases and trays can be held, transported, and stored while stacked. ■ Can be picked up even without a vacuum device!

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Domestic Short Delivery Adhesive-Free Transport Chip Tray 'Gel Base'

Protects IC chips and electronic components from vibrations, ensuring safe storage and transportation! This is a domestically produced semiconductor component transport case with a short delivery time and silicone-free specifications.

Gelbase can be used for the transportation of small components such as IC chips and electronic parts within factories, during processes, and for overseas shipping. It protects semiconductor components from vibrations and also serves as a tray for securing devices during transport. Even when overseas products are hard to obtain due to domestic manufacturing, we achieve small lot sizes and short delivery times! It can be used safely as it is free from adhesive materials and siloxanes. 【Features】 - The soft gel material protects IC chips and other components from vibrations and shocks during transport, preventing damage. - The materials/separators are non-silicone, so there is no influence from siloxanes. - A self-adhesive gel is used on the loading surface, ensuring no adhesive transfer to the components since no adhesive materials are used. - Being domestically produced allows for short delivery times. ⇒ While overseas products may take several months from order to delivery, we can deliver immediately because it is made in Japan. - Supports small lot sizes. ⇒ Available for sale in quantities of 10 or more. - No vacuum device is needed during pickup. - Anti-static processing.

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"Gel Base" to prevent damage inside the transport case for precision parts.

Solve problems such as electronic device failures due to siloxane and impacts during transportation with the non-silicone case "Gel Base"!

When transporting precision parts, do you have any of these concerns? - The product was damaged due to impact during transport... - Electronic components failed due to siloxane emitted from silicone cases... - Static electricity affected the parts... The transport case 'Gelbase' developed by Exile protects products from shaking and impact during transport with its soft urethane gel sheet and the gel's self-adhesiveness. Additionally, because it is non-silicone, there is no risk of siloxane, which can cause failures during transport, and it is also treated to prevent static electricity, contributing to a reduction in defective products during transport. You can choose the sheet shape, size, color, and height according to your application. ★ Currently offering samples ★ If you are interested, please check the materials or contact us through our website. 【Features】 ■ Non-silicone ■ No adhesive transfer to parts ■ Stackable trays and cases ■ Can be picked up without a vacuum device due to surface irregularities

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"Just grip it!" Tip remover to clean dirt from fingertips during work.

Are you troubled by dirt on your fingertips while working? Simply grip to remove fine dust from the gloves. Can be reused by washing with water!

Tip remover is a fingertip adhesive gel designed to remove dirt and grease from gloves. It allows you to remove foreign substances attached to gloves without interrupting your workflow. Its hollow structure makes it easy to grip and conforms well to your fingers. By gently rubbing it with your palm under running water, dirt is removed, and the adhesive power is restored. ★Using a dedicated cleaner also allows for disinfection★ 【Important Points of Tip Remover】 ■ Easy-to-grip structure that effectively catches fine dust on fingertips! Made from soft gel material. Its hollow structure adheres closely to the fingertips. ■ No silicone or plasticizers used in the materials. ■ No adhesive materials used! It utilizes the gel's self-adhesive properties to remove dirt. It does not transfer glue to gloves and does not become sticky. It can be installed in any preferred location such as desks, walls, or ceilings according to your needs, and can also be removed. (Note: Installation may not be possible depending on the material of the surface.) ■ Wash with water to remove dirt! Can be washed completely! When it gets dirty, washing it with water restores its adhesive properties, allowing for repeated use. Using a dedicated cleaner also enables disinfection. *For more details, please download and view the catalog.

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Related catalog(6)

Precision Parts Storage and Transport Case "Gelbase" Leaflet

Precision Parts Storage and Transport Case "Gelbase" Leaflet

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Foreign Object Collection Adhesive Pen "Gel Cleaner Pen" Leaflet

Foreign Object Collection Adhesive Pen "Gel Cleaner Pen" Leaflet

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Leaflet for the "Gel Base Sheet" for temporary fixation of precision devices.

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Vacuum Type Precision Parts Storage and Transport Case 'Gelbase V Type' Leaflet

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Hold parts with the power of gel! Precision parts transport case 'Gel Base'

Hold parts with the power of gel! Precision parts transport case 'Gel Base'

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Finger Adhesive Gel 'Tip Remover' Leaflet

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Future Research Group on People and Organizations

Future Research Group on People and Organizations to Enhance Management Skills in the AI Era | For Executives and Next-Generation Leaders

  • NEW
  • SEMINAR_EVENT

An era where AI provides "answers." Is there someone in your company who can "ask questions" themselves? Simply introducing AI will not change a company. When people grow, organizations change. The "Future Research Group on People and Organizations" is a series of four practical workshops aimed at business owners, successors, executives, department heads, and next-generation leaders, focusing on the management skills necessary to "nurture people and drive organizations" in the coming era. Rather than passively "listening" to lectures, participants will bring their own management challenges and emphasize self-questioning through dialogue with experienced business leaders and fellow participants. Throughout the four sessions, we aim for participants to take home the following "four values": - A measure for judgment - An external sounding board - Their own management challenges - Their own reform concepts **Target Audience** Business owners / successors / executives / department heads / next-generation leaders **Locations** East Japan: Tokyo Transportation Hall (Yurakucho) West Japan: AP Osaka Station Front **Capacity** Limited to 10 companies and 20 participants from each region *Participation of two people from one company is recommended. **Participation Fee** 200,000 yen per company / 120,000 yen per person *For all four sessions Please join us for an opportunity to think about and discuss your company's challenges regarding management and human resource development in the AI era, and to connect these discussions to reform concepts.

Sep 16, 2026

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You can do this too! RPA "WinActor" - Thoroughly Overcoming! Branching & Repetition [Includes 20 Basic and Advanced Problems] -

  • NEW
  • SEMINAR_EVENT

Understanding "branching" and "looping" makes WinActor even more enjoyable! We will provide clear explanations from the basics to practical applications. ☆ Date ☆ Ongoing until November 30, 2026 (Monday)   https://www.nttd-bb.com/event/smn20261130.html?utm_source=ipros&utm_medium=other&utm_campaign=20260915_sales ☆ Venue ☆ Online seminar, free of charge ☆ Seminar Content ☆  Understanding "branching" and "looping" makes WinActor even more enjoyable!  "Branching" and "looping" greatly expand the possibilities of scenario creation.  These are essential functions for using WinActor, but many people may feel apprehensive about them.  This seminar will provide clear explanations from the basics to advanced applications.  You will also acquire practical thinking skills through 20 basic and advanced problems. Say goodbye to your apprehension about branching and looping today! Why not challenge yourself with problems and level up your scenario creation skills?

Sep 16, 2026

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[Free Webinar - Technical Verification] Explanation of Printing Accuracy in Screen Printing with Verification Data | 40μm Fine Patterns, RtoR Printing, FHE Multilayer Printing

  • NEW
  • SEMINAR_EVENT

◆Event Overview Date: September 30, 2026 (Wednesday) - October 1, 2026 (Thursday) 14:00 - 14:30 Format: Recorded distribution (Zoom) Duration: Approximately 30 minutes ◆Do you have any of these concerns? Not sure how to verify the printing process Want to test if our materials and pastes are suitable for printing Want to verify if fine wiring patterns can be formed Difficult to introduce printing equipment for prototyping ◆Topics for the Day Verification of fine patterns at the 40µm level using RtoR screen printing Technical verification combining screen plates, pastes, and printing conditions Verification of multilayer printing and alignment with FHE in mind Considerations for reproducibility and mass production of continuous printing Support for prototyping and verification to achieve wiring printing ◆Recommended for Those interested in screen printing and fine pattern formation Those involved in the development of printed electronics and FHE Engineers and researchers related to electronic components and semiconductors Those considering product development from prototyping to mass production ★How to Apply★ Pre-registration (free) is required. Click the "Details & Application Button" below!

Sep 16, 2026

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6th Oshi Katsu EXPO Autumn

Notice of Participation in the 6th Oshi Katsu EXPO Autumn

  • NEW
  • SEMINAR_EVENT

Daitō Shikō Co., Ltd. will be exhibiting at the "6th Oshi Katsu EXPO Autumn" held at Tokyo Big Sight from Wednesday, October 7th. At the exhibition venue, we plan to showcase a variety of original goods, primarily focusing on foil stamping printing. If you are looking for SP tools, promotional items, or novelties, please be sure to visit our booth.

Sep 16, 2026

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Notice of Participation in MWE 2026 (2026 Microwave Workshops and Exhibition) from November 25 (Wednesday) to November 27 (Friday), 2026.

  • NEW
  • SEMINAR_EVENT

Sakura Tech Co., Ltd. will be exhibiting at the "Microwave Exhibition 2026" at Pacifico Yokohama during MWE 2026. In addition to products from numerous microwave-related companies, some sessions of the microwave workshop (such as introductory courses) will be held. By discussing various aspects from the theory to applications of microwaves, participants will deepen their understanding of the latest technologies and gather valuable information useful for manufacturing. Additionally, we will hold a seminar on the applications of wide-area and small millimeter-wave radar at the workshop, so we invite everyone to attend. ■ Title: Development of a Small, High-Resolution 3D Millimeter-Wave FMCW Radar - 512 Virtual Array - ■ Date and Time: November 27 (Friday) 09:30-11:30 ■ Venue: Room 6 (Annex Hall F206)

Sep 16, 2026

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