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  3. ベテル 本社・工場、東京オフィス、ハドソン研究所、ベトナム工場
  4. The first step in solving thermal issues! [For manufacturers and developers of electronic devices] Basics of thermal conductivity and measurement methods, measurement examples.
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  • Jul 02, 2024
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Jul 02, 2024

The first step in solving thermal issues! [For manufacturers and developers of electronic devices] Basics of thermal conductivity and measurement methods, measurement examples.

ベテル ベテル 本社・工場、東京オフィス、ハドソン研究所、ベトナム工場
You will learn the basics of thermal conductivity, the fundamental principles of various thermal conductivity measurement devices, measurement examples, and application cases. 【Basics】Basic knowledge of thermal conductivity measurement and the fundamental principles of thermal conductivity measurement instruments. 【Examples】Differences in measurement methods for thermal conductivity and suitable measurement methods for measurement samples. Introduction of actual measurement cases. 【Applications】Reasons why measurement results differ based on measurement principles, application measurement cases using thermal conductivity measurement technology, and examples of thermal design. <Recommended for> ■ Those who are newly responsible for thermal conductivity measurement. ■ Those considering the introduction of thermal conductivity measurement instruments. ■ Those currently struggling with thermal issues. By solving thermal problems, you can prevent "product troubles caused by heat" in advance, greatly expanding the possibilities for product development. We look forward to the participation of those struggling with thermal issues. <Instructor> Hajime Hatori (Thermo Man) Born in 1972 in Kitami City, Hokkaido. After graduating from the Faculty of Engineering at Ibaraki University, he joined Bethel Co., Ltd. Since then, he has been affiliated with Hudson Research Institute, engaging in research and development centered on thermal property measurement. Utilizing over 20 years of accumulated knowledge and experience in thermal properties, he transforms into Thermo Man and works daily to solve thermal problems. *This seminar will be held online.
Date and time Tuesday, Jul 23, 2024
01:00 PM ~ 05:00 PM
Capital
Entry fee Charge Per person: 37,400 yen (including materials, tax included)
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Betel thermal conductivity measurement device and fiber orientation evaluation system

Introducing devices for measuring the thermal diffusivity of sheet-like and plate-like materials, as well as thermal evaluation devices for fiber orientation distribution!

Introducing Bethel's thermal property measurement devices. The "Thermo Wave Analyzer TA33/35" is a measurement device for the thermal diffusivity of sheet and plate materials, capable of measuring the thermal diffusivity of functional materials. The "Thermal Microscope TM" has been commercialized through joint development with the National Institute of Advanced Industrial Science and Technology's Measurement Standards Division, allowing for measurements in micro-regions and thin films. Additionally, we offer the "Thermal Imaging Scope TSI," which visualizes thermal conduction paths using infrared cameras and lasers, as well as the "Fiber Orientation Evaluation System TEFOD." 【Features of the Thermo Wave Analyzer TA33/35】 ■ High freedom of sample shape ■ Dynamic range from organic films to diamonds ■ Anisotropy evaluation through measurements in horizontal and vertical directions ■ Evaluation of defects and irregularities through distribution measurements *For more details, please refer to the PDF document or feel free to contact us.

  • Other measurement, recording and measuring instruments

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TM3.png

Thermal Microscope/TM3 Thin Film, Micro Area Thermal Conductivity Measurement

For evaluating thermal conductivity in thin films and micro-regions such as fillers, ceramics, insulating thin films, and semiconductor thin films!

This device is an innovative thermal property measurement instrument that boasts world-class minimal resolution. It can measure the thermal properties of samples in detail at the point, line, and surface levels, accurately capturing thermal property value distributions on the micron order that were difficult to achieve with conventional devices. Furthermore, this device realizes high resolution while being a non-contact measurement tool, pioneering areas that were previously impossible with traditional technology. Equipped with the world's first technology, it can directly measure thermal conductivity under favorable conditions in addition to measuring thermal diffusivity. This device demonstrates unparalleled performance in situations requiring precise thermal property analysis in research and development. 〇 About the Measurement Principle 〇 The measurement principle of this device is based on the thermoreflectance method. This is one of the techniques for measuring the surface temperature of materials with high precision, particularly used to investigate the thermal characteristics of micro-regions and thin film materials. This method detects changes in reflectivity associated with changes in the surface temperature of the material and measures the temperature from those changes. The results obtained are expressed as the parameter known as thermal diffusivity. Thermal diffusivity is a physical quantity that indicates how much heat is absorbed when two substances are in contact. It can be mutually converted into thermal conductivity and thermal diffusivity based on specific heat and density.

  • Microscope

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Fiber Orientation Evaluation System "TEFOD"

A fiber orientation evaluation system that is easy to analyze and understand! Anyone can safely perform measurements.

It is a unique device that evaluates the direction of fibers using heat flow. The 'TEFOD' is a fiber orientation evaluation system that can grasp the fiber state (orientation, relative comparison of quantity, variability) within a sample by utilizing heat flow. By observing heat flow, it allows for macro evaluation rather than micro evaluation. Evaluating the overall fiber orientation enables broader analysis. The measurement time is very quick at 1 minute (for one measurement point), and since it can be evaluated non-destructively, different evaluations can be performed on the same sample. The sample is spot-heated with a laser, and the heat transfer is observed using an infrared camera. By analyzing the observed infrared images, the thermal diffusivity can be quantified. Additionally, this product does not use X-rays, allowing anyone to perform measurements safely. 〇 About the Measurement Principle 〇 It is a type of periodic heating method called fiber orientation identification method. Spot periodic heating is performed, and the heat diffused in the plane direction is observed with an infrared camera at 360°. The thermal images obtained by the infrared camera are analyzed and quantified into thermal diffusivity. By converting it into a polar coordinate graph, the fiber orientation angle can be intuitively visualized.

  • Evaluation Board

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Related catalog(3)

Thermal diffusivity and thermal conductivity measurement device ThermoWave Analyzer / TA

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Steady-State Thermal Conductivity Measurement Device / SS-H40

Steady-State Thermal Conductivity Measurement Device / SS-H40

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Fiber Orientation Evaluation System / TEFOD

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[Seminar] New Defense Business Created by AI and Automation

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[Lecturers] Daisuke Tateno, Partner, Arthur D. Little Japan K.K. Akihiro Nagayama, Principal [Key Lecture Content] Drones, AI, software, satellites, and electronic warfare are fundamentally changing the way wars are fought, and the defense industry is currently transitioning from a heavy and traditional model to one centered around AI, software, data, and unmanned systems. In the United States, emerging companies like Palantir and Anduril, which are software-driven, are challenging existing defense firms. In Japan, structural changes are beginning with the Defense Capability Development Plan, the Defense Industry Base Strengthening Act, and the entry of startups. This seminar will discuss the changes in the global security environment and industrial structure, the strategies of advanced players both domestically and internationally, and the areas where Japanese companies can succeed, including dual-use, collaboration with software companies, M&A and alliances, and talent strategies. We will consider how to view change not as a threat but as a growth opportunity, and how to construct a new Japanese defense industry from a management perspective.

Aug 21, 2026

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[Seminar] The Shock of the US-China AI Frontier Model

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[Speaker] Kazuki Miyamoto, Representative/Analyst, VentureClef, USA [Key Lecture Content] The frontier model in the United States is evolving at an unexpected speed. AI agents based on the frontier model have completely transformed business forms in companies. Chinese companies are developing large-scale open source projects, and their performance is approaching that of the U.S. model. Meanwhile, U.S. companies have begun developing open source, leading to a direct confrontation between the U.S. and China. The seminar will examine the frontier models of both countries and explain the latest technologies and important trends. It will organize points on how Japanese companies should perceive the U.S.-China AI development competition from technological and business perspectives. It will also consider strategies for companies to succeed in the AI era, including the differentiation between the U.S. and Chinese models, as well as the advantages and challenges of open source versus closed source. [Lecture Items] <1> Frontier Model (USA) <2> Frontier Model (China) <3> Technology Trends and AI Strategies for Japanese Companies <4> Q&A

Aug 21, 2026

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[Seminar] Huawei's AI Strategy

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[Speaker] Chief Expert Ji Hui, Future Creation Center, Nomura Research Institute, Inc. [Key Lecture Content] *We plan to update with the latest information based on field research as necessary.* At the World Artificial Intelligence Conference held in Shanghai in July 2026, Huawei unveiled its next-generation computing infrastructure products based on its proprietary AI chips, attracting significant attention. Amid ongoing U.S. export restrictions on advanced semiconductors, Huawei demonstrated its approach to overcoming the performance limits of standalone chips through "systems engineering," showcasing its commitment to leading the development of an autonomous AI ecosystem in China, encompassing computing infrastructure, cloud, OS, and AI models. Based on the latest field research results, this lecture will explain the latest trends in Huawei's AI strategy (computing infrastructure, AI models: AI social implementation, AI ecosystem, etc.) in the context of the overall landscape of China's AI industry. [Lecture Topics] 1. Current State of China's AI Industry 2. Progress in Domestic Production of Infrastructure 3. Huawei's Full-Stack AI Ecosystem 4. Future Prospects 5. Q&A

Aug 21, 2026

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[Seminar] Overview of the Revised Personal Information Protection Law and Practical Responses

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Aug 21, 2026

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Webinar "Everyone's Been Waiting! Introducing the New Products of ODU-MAC Silver-Line"

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The ODU-MAC Silver-Line industrial automatic disconnect connector is widely adopted in various applications such as production equipment and medical devices, not only in the EU market but also in Japan. In this webinar, we will provide a detailed explanation of new products, including the P4+ frame with an increased floating width, the EBP module that accommodates fiber core misalignment, and the thermocouple module. We will also introduce improvements to the ODU-MAC/DOCK series catalog, which has become easier to use and select products from. We will explain everything clearly, making it accessible for both those who are already using the ODU-MAC/DOCK series and those who are interested but have not used it before, so please join us. ------------ Date: September 3, 2026 (Thursday) 14:00 - 14:35 Venue: Online (A URL for the venue will be sent via email after registration) Speakers: Masaru Kimura, Sales Manager, ODU Japan Co., Ltd. Miho Kato, Sales Department, Chemex ONE Co., Ltd. ------------

Aug 21, 2026

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