Effective for heat dissipation measures of small devices like smartphones! 【Betel's thermal conductivity measurement device】

Thermal conductivity distribution measurement and the anisotropy of thermal diffusivity in each part can be evaluated.

In recent years, the miniaturization and high output of electronic devices have rapidly advanced, and as a result, thermal management (heat dissipation) has become a very important issue. Traditionally, heat dissipation has been maintained by using metals, but in recent years, it has begun to be replaced by "high thermal conductivity resins." High thermal conductivity resins are "lightweight" and have "moldability" compared to traditional metals, are "corrosion-resistant," and above all, have the advantage of being "low-cost." However, there is also the disadvantage of low thermal conductivity, and many material manufacturers are actively developing solutions to address this issue. It is expected that "high thermal conductivity resins" will become mainstream in the future. On the thermal properties blog, we introduce examples of thermal conductivity measurements of "high thermal conductivity resins." http://blog.thermal-measurement.info/archives/cat_50051425.html

• Other physicochemical equipment

Bulk, thin film, micro areas, plate-shaped, sheet-shaped, almost all materials can be accommodated. Please consult us once.

Supports various thermal conductivity measurement methods such as steady-state method, periodic heating method, and thermoreflectance method. Compatible with plate-shaped, sheet-shaped, soft samples, fibrous materials, and various shapes. Please consult us even for samples that have been rejected by other companies.

• Contract measurement

Non-contact measurement of thermal diffusivity using a laser. Measurement of resin-based materials is also possible.

The ThermoWave Analyzer TA measures thermal diffusivity using a non-contact method with a laser. Since the thermal conductivity of composite materials made of fillers and resins varies significantly with the mixing ratio, measuring thermal diffusivity is essential. Measurement of resin-based materials is also possible. Please contact us for more details.

• Logic Analyzer

Non-contact measurement of thermal diffusivity using a laser. Measurement of materials with high thermal conductivity is possible.

The ThermoWave Analyzer TA3 measures thermal diffusivity using a non-contact method with a laser. It is capable of measuring materials with high thermal conductivity. Measurements can be taken without worrying about the shape. For more details, please contact us.

• Logic Analyzer

Quickly resolve your questions about heat! A heat professional will visit you at your desired date and location.

The target audience includes professionals in thermal properties as well as students! We will clearly explain case studies, tips, and measurement methods related to thermal property measurements.

• Laser microscope

Understanding the mechanism of heat transfer and effectively dissipating heat is important! Here we introduce various methods for measuring thermal properties.

Due to factors such as "miniaturization = fanless design" and "widespread use of power devices = increased heat generation," thermal issues have become important. Thermal conductivity measurement can be broadly classified into two categories: "steady-state method" and "transient method." The steady-state method provides direct thermal conductivity values and requires relatively large samples. The transient method can measure thermal diffusivity and thermal effusivity, and it is possible to measure with relatively small samples. We provide further detailed explanations, so please take a look at the PDF download below. 【Characteristics of the "Steady-State Method" and "Transient Method"】 ■ Steady-State Method - Direct thermal conductivity can be obtained - Requires relatively large samples ■ Transient Method - Can measure thermal diffusivity and thermal effusivity - Can measure with relatively small samples - Requires specific heat capacity and density *For more details, please refer to the PDF document or feel free to contact us.

• Other measurement, recording and measuring instruments

Introducing devices for measuring the thermal diffusivity of sheet-like and plate-like materials, as well as thermal evaluation devices for fiber orientation distribution!

Introducing Bethel's thermal property measurement devices. The "Thermo Wave Analyzer TA33/35" is a measurement device for the thermal diffusivity of sheet and plate materials, capable of measuring the thermal diffusivity of functional materials. The "Thermal Microscope TM" has been commercialized through joint development with the National Institute of Advanced Industrial Science and Technology's Measurement Standards Division, allowing for measurements in micro-regions and thin films. Additionally, we offer the "Thermal Imaging Scope TSI," which visualizes thermal conduction paths using infrared cameras and lasers, as well as the "Fiber Orientation Evaluation System TEFOD." 【Features of the Thermo Wave Analyzer TA33/35】 ■ High freedom of sample shape ■ Dynamic range from organic films to diamonds ■ Anisotropy evaluation through measurements in horizontal and vertical directions ■ Evaluation of defects and irregularities through distribution measurements *For more details, please refer to the PDF document or feel free to contact us.

• Other measurement, recording and measuring instruments

Measuring the thermal diffusivity of semiconductor material 'Si wafer's thermal properties'!

The thermal diffusivity of "Si wafers," which are essential materials for semiconductors, can be measured.

• Other metal materials

Thank you very much for your continued support. We would like to inform you that our company will be closed for summer vacation during the following period: From Saturday, August 9, 2025, to Sunday, August 17, 2025. We will resume regular business hours starting Monday, August 18, 2025. We apologize for any inconvenience this may cause and appreciate your understanding.

Fukuda Co., Ltd. has been pursuing leak detection for 60 years and is committed to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing properties. We will propose the appropriate testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)

Features: ● Compatible with Intel Processor Core 3 and N series ● DDR5 SODIMM ×1 (up to 32GB) (sold separately) ● VGA ×1 + HDMI ×2 ● LAN ×4 (IEEE 802.3 at/af PoE compatible, total 80W) ● 9V–36V DC input (with protection circuit) ● Wide temperature range -20℃ to 60℃ ● Onboard TPM 2.0

Features: ● Equipped with Intel N series processors (N250/N150) ● Fanless design ● Ultra-thin compact chassis (30mm thick) ● Supports DDR5 memory ● Dual display output ● Dual Gigabit LAN ● Abundant M.2 expansion slots ● Equipped with TPM 2.0 * This model does not include memory, storage, or OS.

Features: ● Equipped with Intel Core Processor Series 2 ● Space-saving design of 150 × 270 × 225mm ● Supports ECC-compatible DDR5 memory ● Abundant storage configurations ● Dual 5G/4G communication expansion support ● Compatible with NVIDIA RTX PRO 4000 Blackwell SFF ● Flexible PCIe expansion ● Wide power input for industrial applications ● Operating temperature range of -20℃ to 45℃ ● Standard TPM 2.0 included * This model does not include memory, storage, or OS.