Information on the service for measuring the thermal conductivity of carbon fiber reinforced plastic (CFRP).

Leave the measurement of the thermal conductivity of carbon fiber reinforced plastic (CFRP) to us.

Carbon fiber reinforced plastics (CFRP), used in electric vehicles, aircraft, satellites, and rockets, require precise knowledge of thermal conductivity. For instance, when used in electric vehicles, understanding thermal conductivity is essential for heating performance and battery thermal management. Changes in electricity consumption due to heating performance and thermal management significantly affect driving range. Similarly, when used in satellites and rockets in the harsh environment of space, it is necessary to understand thermal conductivity to ensure heat resistance performance. With Bethel, you can accurately measure the thermal conductivity of this carbon fiber reinforced plastic (CFRP).

• Thermo-fluid analysis

Are you measuring the correct thermal conductivity of the thermal pad?

A thermal pad is a type of thermal interface material used for heat dissipation in CPUs and power devices. Due to its flexibility and relatively high thermal conductivity, it effectively reduces contact thermal resistance by filling the gaps between the heat sink and the device. Do you accurately understand the thermal conductivity of thermal pads? Thermal pads have elasticity, so their contact state changes with pressure. In other words, the effective thermal conductivity varies with pressure. Additionally, many materials exhibit temperature dependence in thermal conductivity, meaning that as the temperature increases, the thermal conductivity decreases. In this instance, we measured a commercially available thermal pad with a specification of 1.5W/mK. This is a soft type referred to as a soft thermal pad. The measurement device used is our steady-state thermal conductivity measurement device, the SS-H40.

• Thermo-fluid analysis

Non-contact measurement of thermal diffusivity using a laser. Measurement of materials with high thermal conductivity is possible.

The ThermoWave Analyzer TA3 measures thermal diffusivity using a non-contact method with a laser. It is capable of measuring materials with high thermal conductivity. Measurements can be taken without worrying about the shape. For more details, please contact us.

• Logic Analyzer

Non-contact measurement of thermal diffusivity using a laser. Measurement of resin-based materials is also possible.

The ThermoWave Analyzer TA measures thermal diffusivity using a non-contact method with a laser. Since the thermal conductivity of composite materials made of fillers and resins varies significantly with the mixing ratio, measuring thermal diffusivity is essential. Measurement of resin-based materials is also possible. Please contact us for more details.

• Logic Analyzer

Bulk, thin film, micro areas, plate-shaped, sheet-shaped, almost all materials can be accommodated. Please consult us once.

Supports various thermal conductivity measurement methods such as steady-state method, periodic heating method, and thermoreflectance method. Compatible with plate-shaped, sheet-shaped, soft samples, fibrous materials, and various shapes. Please consult us even for samples that have been rejected by other companies.

• Contract measurement

Thermal conductivity distribution measurement and the anisotropy of thermal diffusivity in each part can be evaluated.

In recent years, the miniaturization and high output of electronic devices have rapidly advanced, and as a result, thermal management (heat dissipation) has become a very important issue. Traditionally, heat dissipation has been maintained by using metals, but in recent years, it has begun to be replaced by "high thermal conductivity resins." High thermal conductivity resins are "lightweight" and have "moldability" compared to traditional metals, are "corrosion-resistant," and above all, have the advantage of being "low-cost." However, there is also the disadvantage of low thermal conductivity, and many material manufacturers are actively developing solutions to address this issue. It is expected that "high thermal conductivity resins" will become mainstream in the future. On the thermal properties blog, we introduce examples of thermal conductivity measurements of "high thermal conductivity resins." http://blog.thermal-measurement.info/archives/cat_50051425.html

• Other physicochemical equipment

Introducing devices for measuring the thermal diffusivity of sheet-like and plate-like materials, as well as thermal evaluation devices for fiber orientation distribution!

Introducing Bethel's thermal property measurement devices. The "Thermo Wave Analyzer TA33/35" is a measurement device for the thermal diffusivity of sheet and plate materials, capable of measuring the thermal diffusivity of functional materials. The "Thermal Microscope TM" has been commercialized through joint development with the National Institute of Advanced Industrial Science and Technology's Measurement Standards Division, allowing for measurements in micro-regions and thin films. Additionally, we offer the "Thermal Imaging Scope TSI," which visualizes thermal conduction paths using infrared cameras and lasers, as well as the "Fiber Orientation Evaluation System TEFOD." 【Features of the Thermo Wave Analyzer TA33/35】 ■ High freedom of sample shape ■ Dynamic range from organic films to diamonds ■ Anisotropy evaluation through measurements in horizontal and vertical directions ■ Evaluation of defects and irregularities through distribution measurements *For more details, please refer to the PDF document or feel free to contact us.

• Other measurement, recording and measuring instruments

Features: ● Compatible with Intel Processor Core 3 and N series ● DDR5 SODIMM ×1 (up to 32GB) (sold separately) ● VGA ×1 + HDMI ×2 ● LAN ×4 (IEEE 802.3 at/af PoE compatible, total 80W) ● 9V–36V DC input (with protection circuit) ● Wide temperature range -20℃ to 60℃ ● Onboard TPM 2.0

Features: ● Equipped with Intel N series processors (N250/N150) ● Fanless design ● Ultra-thin compact chassis (30mm thick) ● Supports DDR5 memory ● Dual display output ● Dual Gigabit LAN ● Abundant M.2 expansion slots ● Equipped with TPM 2.0 * This model does not include memory, storage, or OS.

Features: ● Equipped with Intel Core Processor Series 2 ● Space-saving design of 150 × 270 × 225mm ● Supports ECC-compatible DDR5 memory ● Abundant storage configurations ● Dual 5G/4G communication expansion support ● Compatible with NVIDIA RTX PRO 4000 Blackwell SFF ● Flexible PCIe expansion ● Wide power input for industrial applications ● Operating temperature range of -20℃ to 45℃ ● Standard TPM 2.0 included * This model does not include memory, storage, or OS.

Fukuda Co., Ltd., which develops, manufactures, and sells leak testing equipment to inspect airtightness and sealing performance, provides a technical document that clearly explains the methods and theories of airtight testing, titled "Technical Manual." We are offering it as a PDF file. Please take this opportunity to download and view it!

What is a leak test system specifically for small electronic components? It is a device used for leak testing small electronic components that require airtightness, such as crystal devices, ceramic oscillators, optical devices, power semiconductors, CAN devices, laser diodes, MEMS devices, SAW filters, small relays, and capacitors. Leak testing of sealed products requires two types of inspections: gross leak testing and fine leak testing. We offer fully automatic machines that can perform the entire process in one unit, as well as dedicated machines (custom-made) and convenient tabletop types for sampling inspections.