ADLINK Japan will exhibit at the Arm Tech Symposia Tokyo held on November 7th (Thursday)!

NXP i.MX93 series processor equipped OSM R1.1 Size L module

The OSM-IMX93 is an OSM R1.1 Size L module equipped with the NXP i.MX93 series processor featuring a dual-core Arm Cortex-A55 and M33. This module, which includes the Arm Ethos U-65 microNPU in the SoC, is designed for edge solutions that require on-device AI processing with ultra-low power consumption. The OSM-IMX93 module supports LVDS and DSI graphics output, GbE x2 (1 TSN compliant), CAN bus x2, I2S audio codec interface, and USB2 interface, and it offers a product supply for 15 years.

• Embedded Board Computers

COM-HPC Server Size E module equipped with Ampere Altra SoC

ADLINK's "COM-HPC-ALT" is the world's first 80-core COM-HPC server-type module. Based on the Ampere Altra SoC, which utilizes the Arm Neoverse N1 architecture, it features up to 80 Arm v8.2 64-bit cores running at 2.8GHz, with a TDP of just 175 watts. The COM-HPC Ampere Altra, which adopts an architecture with excellent performance per watt, is suitable for massive data processing at the edge without requiring significant initial investment or ongoing maintenance costs. The COM-HPC-ALT has been certified as compliant with the Arm SystemReady program, supporting common operating systems and subsequent software layers, ensuring a seamless user experience. When combined with the open-source EDKII project, this module supports operating systems such as CentOS, Ubuntu, and Yocto Linux.

• Embedded Board Computers

[Sample available for loan] I-Pi SMARC development kit equipped with NXP i.MX8M Plus Quad Arm Cortex-A53 processor

The I-Pi SMARC IMX8M Plus is a SMARC-based smart solution development kit equipped with the NXP i.MX8M Plus (Quad-core Arm Cortex-A53) processor and an NPU (Neural Processing Unit) capable of up to 2.3 TOPS. This product is the first in a series of highly reliable SMARC R2.1 development kits focused on machine learning, vision, advanced multimedia, and industrial IoT. Therefore, it supports dual image processors and two camera inputs, enabling an effective Vision System, while also accommodating future applications such as smart homes, building cities, and Industry 4.0.

• Embedded Board Computers

[Sample available for loan] Qualcomm Robotics RB5 platform-based I-Pi SMARC development kit

The I-Pi SMARC RB5 is a SMARC-based AIoT and robotics development kit that leverages the ADLINK LEC-RB5, powered by the Qualcomm QRB5165 SoC featuring a Qualcomm Kyro 585 octa-core CPU (8x Arm Cortex-A77) and Qualcomm AI Engine. Supporting up to six MIPI-CSI cameras and achieving 15 TOPS, the I-Pi SMARC RB5 is an ideal DevKit for implementing AI-centric robotics and drone applications in various fields such as consumer, enterprise, defense, industrial, and logistics.

• Embedded Board Computers

[Sample available for loan] MediaTek Genio 1200 platform-based I-Pi SMARC development kit

The I-Pi SMARC 1200 is a SMARC-based AI and graphics-centric solution development kit equipped with the MediaTek Genio 1200 (octa-core Arm Cortex-A78 x4 + A55 x4) processor, an advanced 5-core Arm Mali-G57 GPU for high-quality 3D graphics, and an integrated APU (AI Processor Unit) system with up to 5 TOPS. This development kit features AI processing capabilities on the device (acceleration for deep learning neural networking, computer vision, etc.), support for multiple 4K displays, and up to three MIPI camera inputs, making it an optimal solution for enabling various next-generation innovations focused on AI, such as advanced smart homes, human-machine interfaces, 4K multimedia applications, and industrial IoT.

• Industrial PCs
• Embedded Board Computers

NXP i.MX8M Plus quad-core processor-based IIoT gateway platform

The MXA-200 is a high-performance IoT gateway based on the i.MX8M Plus, featuring a quad-core processor, two isolated RS-232/422/485 serial ports, two 10/100/1000 Ethernet ports, two USB 3.0 ports, and an operating temperature range of -20 to 70°C. It also includes two M.2 slots for integrating Wi-Fi/4G/5G modules. With the MXA-200, system integrators can accurately develop applications for renewable energy, EV chargers, smart cities, and factories that require large-scale data collection, cloud-based applications, and video-related monitoring solutions.

• Industrial PCs

Ampere Altra SoC-based COM-HPC Server Size E reference development platform

The Ampere Altra developer platform, based on the Ampere Altra SoC and supported by a wide range of the Arm ecosystem using the Arm Neoverse N1 platform, delivers premium performance from cloud to edge infrastructure while maintaining an extremely low thermal envelope, low TCO, and significantly lower power consumption compared to x86 designs. It supports the open-source EDKII as a UEFI bootloader, allowing customers to simply download a pure AArch64 (arm64) ISO, such as Ubuntu, and boot the live ISO directly on the target for installation. This is the same convenience we have become accustomed to with x86/amd64 target systems. If you would like to request a sample loan, please feel free to contact us.

• Embedded Board Computers

About ROAD: The "Roundtable on the Purpose of Autonomous Driving (ROAD)" conference series has evolved into a unique platform for interdis-ciplinary dialogue and international collaboration in the field of autonomous driving and autonomous mobility. Established in 2016, ROAD has brought together researchers, industry leaders, and public sector stakeholders from six countries across three continents. Based on this background, the upcoming ROAD 2026 will focus on "safety” and "driving AI”—the final pieces of the autonomous driving puzzle—to advance discussions on establishing the foundational framework for ensuring safety quality and obtaining regular-tory approval for autonomous driving. We also intend to discuss the international commonalities and differences regarding the social value brought about by ADS vehicles in terms of automation, intelligent driving, and mobility. We have established a total of five compelling themes for the Round Workshops, consisting of two topics related to “The Last Piece” and three topics related to the social value of ADS, as shown below. 1) Round Workshop 1 - Horizons of E2E Driving AI → Can AI Understand the Driving Environment Like Humans? 2) Round Workshop 2 - Beyond the Unknown: Safety Cases for ADS → Can Safety Ever Be Proven? 3) Round Workshop 3 - Envisioning Smart City Mobility → Can Smart City Mobility Bridge the Mobility Divide? 4) Round Workshop 4 - Logistics Enhancement Through Autonomous Tracking → Will Logistics Become Human-Free? 5) Round Workshop 5 - The Evolution of CASE: SDV/AIDV → Will Automakers Become AI Companies? We hope you’ll all join us!

[Speaker] Masashi Sugita, President and CEO of LEX Style Co., Ltd. [Key Lecture Content] The power consumption of AI servers used in data centers has significantly increased, making traditional air cooling insufficient for operation. This lecture will organize the requirements for introducing a liquid cooling system into air-cooled data centers and explain the implementation method using free cooling with specific design details. When handling high-density AI servers, energy efficiency is required, and the widely used energy efficiency indicator, as well as the Ministry of Economy, Trade and Industry's Resource and Energy Agency's PUE regulation of "1.3 or below," will be explained along with practical operational insights. [Lecture Items] 1. Heat dissipation methods for high-density, high-heat AI servers 2. Basics and importance of PUE/pPUE 3. PUE regulation of "1.3 or below" by the Ministry of Economy, Trade and Industry's Resource and Energy Agency 4. AI server implementation and requirements for new data centers 5. Summary and future outlook 6. Q&A / Business card exchange

[Key Lecture Content] 1. Promotion of SAF Introduction Yasushi Yamashita, Director, Carbon Neutral Promotion Office, Aviation Bureau, Ministry of Land, Infrastructure, Transport and Tourism 1. Importance of SAF in the decarbonization of the aviation sector 2. Initiatives to promote the introduction of SAF 3. Q&A / Business card exchange 2. Japan Airlines' Challenge Towards Net Zero CO2 Emissions by 2050 Kazuki Hirotani, Group Leader, GX Planning Group, Sustainability Promotion Department, Japan Airlines Co., Ltd. 1. Introduction of our five initiatives for CO2 emission reduction 2. Initiatives for reducing fuel consumption (introduction of fuel-efficient aircraft, operational improvements) 3. Initiatives for fuel transition (sustainable aviation fuel SAF) 4. Initiatives for reductions outside the value chain (carbon credits, new removal technologies) 5. Initiatives to deepen collaboration with society 6. Q&A / Business card exchange

[Instructor] Yuichiro Kabushiki, Partner Lawyer at TMI Comprehensive Law Office [Key Lecture Content] With the spread of AI, there is growing attention on the civil liability of developers, providers, and users of AI. The Ministry of Economy, Trade and Industry will publish "Guidelines on the Interpretation and Application of Civil Liability in AI Utilization" in April 2026, and the Ministry of Justice will also establish an expert meeting to examine civil liability related to unauthorized use of images and voices generated by AI in the same month. As the full enforcement of the AI Promotion Act and the revision of AI guidelines are underway, it is necessary to design and operate governance based on the potential responsibilities that may arise retrospectively. In this seminar, based on the guidelines from the Ministry of Economy, Trade and Industry and drawing on litigation practice experience as a judge and lawyer, we will organize the basic framework for assessing civil liability and explain fundamental methods for designing and operating governance based on risk analysis. Furthermore, we will examine the framework for civil liability and the design and operation of governance using hypothetical cases that are likely to pose practical issues.

In this seminar, we will welcome Mr. Satoru Hayami from Waseda University, who will explain the latest trends in AI utilization in manufacturing, as well as the evolution of technologies such as agent-based AI and physical AI, and the opportunities and key points for practical application in the manufacturing industry. Furthermore, Mr. Tsubasa Shibata, representative of Next Opt, will introduce processes aimed at practical implementation, incorporating actual case studies from manufacturing sites. We hope you will envision the "potential for AI utilization in your company" and take home hints that will lead to improvements in your operations starting tomorrow. We look forward to your participation.