I will give a presentation at the 3rd World Symposium on Materials Science and Engineering 2024 (November 5-7, Hilton Nagoya). [Hudson Institute]

Introducing devices for measuring the thermal diffusivity of sheet-like and plate-like materials, as well as thermal evaluation devices for fiber orientation distribution!

Introducing Bethel's thermal property measurement devices. The "Thermo Wave Analyzer TA33/35" is a measurement device for the thermal diffusivity of sheet and plate materials, capable of measuring the thermal diffusivity of functional materials. The "Thermal Microscope TM" has been commercialized through joint development with the National Institute of Advanced Industrial Science and Technology's Measurement Standards Division, allowing for measurements in micro-regions and thin films. Additionally, we offer the "Thermal Imaging Scope TSI," which visualizes thermal conduction paths using infrared cameras and lasers, as well as the "Fiber Orientation Evaluation System TEFOD." 【Features of the Thermo Wave Analyzer TA33/35】 ■ High freedom of sample shape ■ Dynamic range from organic films to diamonds ■ Anisotropy evaluation through measurements in horizontal and vertical directions ■ Evaluation of defects and irregularities through distribution measurements *For more details, please refer to the PDF document or feel free to contact us.

• Other measurement, recording and measuring instruments

Leave the measurement of the thermal conductivity of carbon fiber reinforced plastic (CFRP) to us.

Carbon fiber reinforced plastics (CFRP), used in electric vehicles, aircraft, satellites, and rockets, require precise knowledge of thermal conductivity. For instance, when used in electric vehicles, understanding thermal conductivity is essential for heating performance and battery thermal management. Changes in electricity consumption due to heating performance and thermal management significantly affect driving range. Similarly, when used in satellites and rockets in the harsh environment of space, it is necessary to understand thermal conductivity to ensure heat resistance performance. With Bethel, you can accurately measure the thermal conductivity of this carbon fiber reinforced plastic (CFRP).

• Thermo-fluid analysis

Even thin and small samples, as well as samples with high thermal conductivity, can be measured!

We are also able to measure the thermal conductivity of conductive diamonds. Normally, diamonds are insulators, but by doping with boron, they can be made conductive, allowing for the creation of high-performance electrodes. This enables redox reactions that are impossible with electrodes made from other materials due to a wide potential window, and they can be used in harsh environments such as strong acids and strong alkalis, offering significant advantages. Personally, I am particularly interested in their potential use in the recycling of CFRP. The measurements will be conducted using the ThermoWave Analyzer TA35. [About the Samples] The samples this time have thicknesses of 30μm and 300μm, and with a sample size of 10mm x 10mm, it can be said that measurement with ordinary thermal conductivity measurement devices is nearly impossible. Measurement is only possible with the ThermoWave Analyzer. The 30μm thick sample is matte black with a smooth surface. The 300μm thick sample is also matte black, but its surface was slightly rough. However, this level of roughness has no effect on the measurements at all.

• Thermo-fluid analysis

Are you measuring the correct thermal conductivity of the thermal pad?

A thermal pad is a type of thermal interface material used for heat dissipation in CPUs and power devices. Due to its flexibility and relatively high thermal conductivity, it effectively reduces contact thermal resistance by filling the gaps between the heat sink and the device. Do you accurately understand the thermal conductivity of thermal pads? Thermal pads have elasticity, so their contact state changes with pressure. In other words, the effective thermal conductivity varies with pressure. Additionally, many materials exhibit temperature dependence in thermal conductivity, meaning that as the temperature increases, the thermal conductivity decreases. In this instance, we measured a commercially available thermal pad with a specification of 1.5W/mK. This is a soft type referred to as a soft thermal pad. The measurement device used is our steady-state thermal conductivity measurement device, the SS-H40.

• Thermo-fluid analysis

Thank you very much for your continued support. We would like to inform you that our company will be closed for summer vacation during the following period: From Saturday, August 9, 2025, to Sunday, August 17, 2025. We will resume regular business hours starting Monday, August 18, 2025. We apologize for any inconvenience this may cause and appreciate your understanding.

Fukuda Co., Ltd. has been pursuing leak detection for 60 years and is committed to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing properties. We will propose the appropriate testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)

Features: ● Compatible with Intel Processor Core 3 and N series ● DDR5 SODIMM ×1 (up to 32GB) (sold separately) ● VGA ×1 + HDMI ×2 ● LAN ×4 (IEEE 802.3 at/af PoE compatible, total 80W) ● 9V–36V DC input (with protection circuit) ● Wide temperature range -20℃ to 60℃ ● Onboard TPM 2.0

Features: ● Equipped with Intel N series processors (N250/N150) ● Fanless design ● Ultra-thin compact chassis (30mm thick) ● Supports DDR5 memory ● Dual display output ● Dual Gigabit LAN ● Abundant M.2 expansion slots ● Equipped with TPM 2.0 * This model does not include memory, storage, or OS.

Features: ● Equipped with Intel Core Processor Series 2 ● Space-saving design of 150 × 270 × 225mm ● Supports ECC-compatible DDR5 memory ● Abundant storage configurations ● Dual 5G/4G communication expansion support ● Compatible with NVIDIA RTX PRO 4000 Blackwell SFF ● Flexible PCIe expansion ● Wide power input for industrial applications ● Operating temperature range of -20℃ to 45℃ ● Standard TPM 2.0 included * This model does not include memory, storage, or OS.