"I will provide a thorough explanation about ITO (transparent conductive film)!" has been added to the technical trend keywords.

Standard stock items include anti-reflective films, bandpass filters (BPF filters), and infrared cut filters (IR cut filters), among others.

We will start selling some optical thin film products (optical filter products) and patterned processing products as "standard stock items." We have responded to such requests! ◆ It's difficult to bear the cost of a whole batch when only a few pieces are needed for experiments... ◆ I want to see product development and performance tests quickly, so I need a few pieces at different levels... ◆ I just want to try it out for now... We often hear such voices through inquiries from our website. Even if custom-made filters are ultimately needed, I believe it is very difficult to define complete filter performance from the beginning.

• mirror
• Distance measuring device
• Sensors

It is a high light-transmitting ITO coating that combines an ITO film (transparent conductive film) with a dielectric multilayer anti-reflective film. It prevents condensation while allowing high transmission.

- Achieving both excellent transparency characteristics and static electricity prevention functions with ITO. We can apply anti-reflective coating that is most suitable for the wavelength range according to your desired specifications. Furthermore, we can also coat metals such as aluminum or nickel on top of the ITO film with good adhesion, making it suitable for sensors that require electrodes on the glass surface. Are you facing any of these issues? - Can you coat a film that allows both light and electricity to pass through simultaneously? - Is it possible to apply anti-reflective functionality? - Can pattern processing be done after coating with ITO? - Is it possible to focus on resistance value in the coating?

• Other optical parts
• Surveillance Cameras
• Sensors

This is a "comb-shaped electrode chip" made by thin-film pattern processing of various metals. We handle everything from electrode configuration to thin-film processing and chip processing in a consistent system.

Are you troubled by such issues? - It’s difficult to manage delivery times when ordering thin film processing and pattern processing separately. - I haven’t put it into a drawing, but could you provide some consultation? - I want to achieve fine wiring, but I would like advice on the deposition materials. - Can you accept orders for pattern processing alone? - Can you accommodate a line and space (L/S) of 10μm? ■ Microfabrication Technology We realize fine patterning through photolithography, etching, and metal masks. Depending on customer requirements, we select the best processing methods and resists. However, it is necessary to align conditions such as deposition materials, substrates, film thickness, and thin film stacking configurations. Please consult us regarding sub-micron or nanometer level patterns. ■ Small-scale prototyping is also possible. In manufacturing, the cycle of hypothesis and verification is an essential process. No matter how advanced simulation technology becomes, verification cannot be omitted. Therefore, at Adachi New Industry, we are happy to undertake prototyping for characteristic verification. Please contact us first.

• Circuit board design and manufacturing
• Other physicochemical equipment
• Analytical Equipment and Devices

Features: ● Equipped with Intel Core Ultra 9 285H/7 255H/5 225H ● DDR5 SODIMM x 2 (up to 128G) (sold separately) ● VGA Switch DDI x 1, LVDS colay eDP x 1, DDI x 2 ● USB 2.0 x 8, USB 3.2 Gen 2 x 4 ● PCIe [x1] x 4, PCIe [x4] x 1, PEG [x8] + [x4] + [x4] ● 2.5GbE x 1 ● COMe Type6 standard, 95mm x 95mm size ● Operating temperature -20~70℃ ● Sold separately ECB-920A: Development carrier board COM-MTHC6-FAN01: CPU fan COM-MTHC6-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Processor: Qualcomm QCS6490 with Arm Cortex-A78 ×4 + Cortex-A55 ×4 (Octa-core) up to 2.7GHz ● LPDDR5 onboard memory (up to 8GB) ● Display: MIPI-DSI (4 lanes) ×1, DisplayPort ×1 ● USB 2.0 ×4 (one port supports OTG), Gigabit Ethernet ×2

In civil engineering sites during extreme heat, the surface temperature of the ground plates and the heat reflection significantly affect the working environment. In particular, steel plates tend to retain heat when exposed to sunlight, posing challenges for workers' heatstroke prevention and safety management. Hyper CLT ground plates are civil engineering materials utilizing wood CLT. As wooden ground plates, they can be used for temporary roads, access routes, heavy machinery work yards, material storage areas, and pedestrian pathways, making them a versatile alternative to steel plates in various civil engineering sites. In actual sites, there are cases where the surface temperature differs by about 20 degrees compared to steel plates, making them effective as a solution for heat prevention and reflection suppression. The 5×10 plate weighs approximately 230 kg, and the 5×20 plate weighs about 460 kg, making them lightweight and easy to handle even with small machinery, which helps reduce the burden of transportation, installation, and removal. They are materials that easily promote noise reduction, CO2 fixation, and environmental consideration unique to wood. Registered as a Ministry of Land, Infrastructure, Transport and Tourism NETIS technology "TH-250021-A," they can also be utilized for creative ideas and safety measures in public works. They are recommended for companies looking to reassess the summer site environment. We also accept inquiries for consultations and requests for materials tailored to site conditions. We can propose solutions for temporary plans during summer for both public and private civil engineering projects. Please feel free to consult with us.

Metal cracks are one of the concerns in equipment maintenance operations. Conventional welding methods for repairs often change the base material around the crack due to heat, leading to residual stress and deformation, which constantly carries the risk of "crack recurrence" and "secondary damage." Hinode Waterworks Co., Ltd.'s "Mechanical Stitching Method" is a new technique that allows for the repair of metal cracks without applying heat. By using special bolts and reinforcement plates, the crack is physically removed without affecting the base material at all. Repairs can be made even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. For more details, please contact us or download the catalog.