Comb-shaped electrode processing (custom-made pattern chips will be created).

Adachi New Industry Co., Ltd. will exhibit at the "Monozukuri World / Mechanical Elements Technology Exhibition" held at Intex Osaka, from the booth of the "Higashi-Osaka City (Monozukuri One-Stop Consultation Desk)" operated by the Higashi-Osaka City Hall. This exhibition has been made possible with significant cooperation from the Higashi-Osaka City Hall and is part of an initiative to widely promote the technological capabilities of local companies. At the exhibition booth, we will introduce these technologies along with actual samples and application examples, providing specific explanations on how we can contribute to product development and problem-solving. Additionally, through collaboration with the "Monozukuri Support" initiatives promoted by Higashi-Osaka City, we will further disseminate our technological capabilities as a local company. 29th Monozukuri World (Mechanical Elements Technology Exhibition) [Osaka] ■ Venue: Intex Osaka ■ Dates: October 7 (Wednesday) to 9 (Friday), 2026, 10:00 AM to 5:00 PM ■ Booth: Hall 6, Booth Number: 48-16 *Advance registration is required for attendance. ■ Our exhibition content: 1) Optical thin film products: Bandpass filters, mirrors, anti-reflective coatings, etc. 2) Fine pattern processing products: Comb-shaped electrodes, LID

The rapid spread of generative AI and the expansion of cloud services have placed data centers around the world in the midst of unprecedented levels of capital investment and technological innovation. The volume of data that needs to be processed continues to increase exponentially, and along with this, the heat generation, power consumption, and demands on communication bandwidth per server rack are becoming increasingly severe each year. Traditional electrical wiring for signal transmission faces physical barriers such as signal degradation and increased power consumption as transmission distances grow, leading to a rapid rise in expectations for technologies that utilize "light" as a solution. Optical communication, optical interconnects, optical sensing, and high-efficiency heat dissipation and shielding structures—many of these foundational technologies supporting data centers are deeply connected to optical thin films and the associated fine patterning processing technologies. Chapter 1: Three Technical Challenges Faced by Data Centers Chapter 2: Optical Thin Films Supporting Optical Communication and Optical Interconnects Chapter 3: Contributions of Fine Patterning Processing to High-Density Implementation Chapter 4: The Potential of Optical Thin Films in Surrounding Technologies such as Heat Dissipation and EMI Shielding Conclusion: Technologies Supporting Next-Generation Data Centers Together For more details, please visit our website.

Japan is one of the world's leading earthquake-prone countries, living in close proximity to various natural disasters such as earthquakes, heavy rains, landslides, and volcanic activity. In the immediate aftermath of a disaster, the initial response and the search and rescue operations for victims require urgent decision-making, and the performance of the equipment and sensing technologies that support these decisions greatly influences the number of lives that can be saved. At Adachi New Industry Co., Ltd., we have cultivated specialized technologies in optical thin films and patterning processing over many years. After organizing the technical requirements needed in disaster prevention and rescue scenarios, we will explain how optical thin films can address these challenges, along with specific application scenes. Finally, we will propose the form of "co-creation" that we aim for. We hope this will provide new hints for engineers and technicians involved in the development of disaster prevention technology, rescue robotics, and sensing devices. Chapter 1: Technical Challenges Faced in Disaster Prevention and Rescue Sites Chapter 2: Technical Elements Where Optical Thin Films Can Contribute Chapter 3: Examination of Specific Application Scenes Chapter 4: Advancement Through Combination with Patterning Processing Conclusion: Proposal for Co-Creation For more details, please refer to our company website.

In the semiconductor and FPD manufacturing process, photomasks are an essential "original plate" for transferring circuit patterns. In recent years, with the increasing precision and diversification of exposure equipment, there has been a growing demand not only for the performance of photomasks themselves but also for value-added proposals through their combination with surrounding optical technologies. One such integration is with "anti-reflective coatings (AR coatings)." This document will explain the significance and technical challenges of combining photomasks with anti-reflective coatings, as well as the potential for co-creation proposals unique to Adachi New Industry, which specializes in optical thin films and patterning processes, divided into four chapters. Chapter 1: The challenge of "reflection" in photomasks Chapter 2: Compatibility issues between general anti-reflective coatings and photomasks Chapter 3: An approach from the perspective of low-temperature processes Chapter 4: Photomask × Anti-reflective coating - The form of co-creation proposals Summary For more details, please visit our company website.