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  3. TAKAYA Corporation
  4. We will be exhibiting a poster at the 29th Okayama Research Park Research and Exhibition Presentation.
SEMINAR_EVENT
  • Nov 21, 2024
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Nov 21, 2024

We will be exhibiting a poster at the 29th Okayama Research Park Research and Exhibition Presentation.

TAKAYA Corporation TAKAYA Corporation
The "29th Okayama Research Park Research and Exhibition Presentation" will be held with the aim of presenting and disseminating research results from companies and institutions related to the "Okayama Research Park." We will have a poster exhibition on "Latest Trends in Hybrid Testing Systems Combining JTAG Testing and Flying Probe Testers." We invite companies, universities, and institutions interested in industry-academia-government collaboration to participate freely. Poster exhibition on research seeds (Industry-Academia Collaboration Model Booth + 8 fields) 《Fields》 ○ Precision Processing and Machinery ○ Materials Technology ○ Semiconductors ○ AI, IoT, Robotics ○ Medical, Bio, Food ○ Environment, Chemistry, Energy ○ Measurement, Inspection ○ Others ■ Organized by Okayama Prefecture, Okayama Prefectural Industrial Promotion Foundation ■ Supported by Okayama University, Okayama Prefectural University, Okayama University of Science, Kibi International University, Kawasaki Medical University, Kawasaki University of Medical Welfare, Shujitsu University and Shujitsu Junior College, Notre Dame Seishin University, Tsuyama National College of Technology, China Vocational Ability Development University, IPU International Pacific University, Okayama Research Park Incubation Center (ORIC)
Date and time Tuesday, Dec 17, 2024
01:00 PM ~ 04:30 PM
Capital ■Venue Techno Support Okayama (5301 Haga, Kita Ward, Okayama City)
Entry fee Free
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第29回 岡山リサーチパーク研究・展示発表会.pdf[460185]

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スクリーンショット 2023-02-24 112144.jpg

Collaboration with boundary scan testing using a flying probe tester.

We will create new value through the mutual complementarity of ICT and BST.

In-circuit testing with a flying probe tester excels at inspecting the electrical characteristics of implemented electronic components in analog circuits. However, components that cannot be probed make electrical testing difficult, and functional testing of digital circuits is challenging. On the other hand, boundary scan testing allows for quick interconnection testing between LSI pins and on-board programming for FPGAs, but it can only test digital circuits around ICs that comply with the boundary scan standard, and it also requires specialized fixtures for connections. At Takaya Corporation, we possess technology that uses flying probes instead of fixtures to connect 4 to 5 scan-compatible pins and measuring instruments required for boundary scan testing. This allows for boundary scan testing even when the counterpart of a boundary scan-compliant IC is a non-boundary scan-compliant IC or passive components (such as connectors) by enabling the flying probe to function as a virtual boundary scan cell. With a single flying probe tester, it is possible to conduct comprehensive testing of both digital and analog circuits, thereby significantly enhancing testing efficiency compared to before.

  • Circuit Board Inspection Equipment

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IPROS4492474389424957610.jpg

Implementation Technology Journal Electronics Implementation Technology Special Feature Article Published

We have received permission to publish the feature article that was included in the only domestic magazine specializing in implementation technology, "Electronics Implementation Technology." You can view it here.

Special Feature Content ■ Latest Trends in BGA Implementation Board Inspection Hybrid Inspection of Flying Probe Testers and JTAG Testing Andor System Support Co., Ltd. / Masayuki Taniguchi Takaya Co., Ltd. / Kohei Yanagida Overview BGA (Ball Grid Array) components are now used in all types of electronic devices, from consumer products to industrial equipment, and more recently, automotive devices. However, a reliable method for inspecting boards with BGA components (hereafter referred to as BGA implementation boards) has not been established. This is because every inspection method has its advantages and disadvantages, making it impossible to conduct a complete test using only one inspection method. Therefore, inspecting BGA implementation boards has become a challenge for many companies. In this article, we will introduce the latest technological trends in hybrid inspection that combines flying probe testers and JTAG (Joint Test Action Group) boundary scan as one solution to this issue. 1. Introduction 2. Inspection and Challenges of BGA Implementation Boards 3. Possibilities of Electrical Testing 4. In-Circuit Testing 5. JTAG Boundary Scan Testing 6. Hybrid Testing 7. Conclusion

  • Circuit Board Inspection Equipment

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Related catalog(4)

Hybrid inspection system combining JTAG testing and flying probe testers.

Hybrid inspection system combining JTAG testing and flying probe testers.

TECHNICAL
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Latest Trends in Hybrid Testing Systems Combining JTAG Testing and Flying Probe Testers

Latest Trends in Hybrid Testing Systems Combining JTAG Testing and Flying Probe Testers

TECHNICAL
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Flying Probe Tester APT-2400F

Flying Probe Tester APT-2400F

PRODUCT
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Industrial Equipment Division Product Introduction

Industrial Equipment Division Product Introduction

TECHNICAL
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We will exhibit at P-MEC Japan 2025, the Pharmaceutical Ingredients and Equipment Exhibition.

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We will be exhibiting at the "P-MEC Japan 2025 Pharmaceutical Ingredients and Equipment Exhibition" held at Tokyo Big Sight. During the event, we will showcase various products. We invite all relevant parties to come and visit us. 【Suppliers】 ・LAUDA

Mar 21, 2026

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25th SMART ENERGY WEEK [Spring]

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Thank you very much for visiting our booth this time. Thanks to you, we had the opportunity to introduce our products and technologies to many customers, making it a very meaningful time. If you have any questions regarding the exhibition content or if you would like to discuss specific considerations or estimates, please feel free to contact us. We will be happy to provide proposals tailored to your needs.

Mar 20, 2026

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[Seminar] AI Robotics Policy and the Challenges of Two Companies

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[Lecture Topics] 1. About AI Robotics Tomoya Yokoyama, Section Chief, Robot Policy Office, Industrial Machinery Division, Ministry of Economy, Trade and Industry *The content of the lecture may change. 2. Development of Remote-Controlled Robots Aiming for a Realistic Operating Experience ~Visual and auditory transmission through ultra-low latency, high presence, and high immersion~ Hiroshi Inagaki, Senior Manager, Collaborative Robotics Group, R-Frontier Department, Future Creation Center, Toyota Motor Corporation 3. The Impact of Japanese-Made Humanoids Yasuke Ono, President, Donut Robotics Inc.

Mar 20, 2026

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[Seminar] Value Creation Strategy through Inclusive Design

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[Speaker] Inclusive Design Designer Yoko Nakao [Key Lecture Content] Products are not selling, differentiation is difficult, and regulations are changing. As product development and facility management reach a significant turning point, inclusive design, which involves engaging people who have previously been excluded from the development process to collaboratively think of solutions, is gaining attention as a method for creating new value. Additionally, practicing inclusive design is expected to enhance not only customer engagement but also employee engagement. In this seminar, based on 20 years of experience leading universal design and inclusive design with diverse characteristics both inside and outside a comprehensive electronics manufacturer, I will specifically explain how to practice inclusive design to create new value. [Lecture Items] 1. Inclusive Design as a New Growth Engine 2. Increasing the Resolution of Diversity 3. Inclusive Design Process 4. Side Effects - Ripple Effects on Talent Development and Recruitment 5. Conclusion 6. Q&A / Business Card Exchange

Mar 20, 2026

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[Seminar] Ministry of Internal Affairs and Communications: Latest Trends in Broadcasting Administration and Future Outlook

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[Lecture Topics] 1. Future Directions of Broadcasting Policy Reiko Kondo, Director-General for Policy Coordination, Ministry of Internal Affairs and Communications 2. The Nature of Broadcasting Systems in the Broadcasting Era Noriaki Saeki, Director of Broadcasting Policy Division, Ministry of Internal Affairs and Communications 3. Latest Trends in Broadcasting Technology Tomoki Nemoto, Director of Broadcasting Technology Division, Ministry of Internal Affairs and Communications 4. Policy Trends Related to Broadcasting Operations and Future Outlook Toshiyuki Sakairi, Director of Broadcasting Operations Division, Ministry of Internal Affairs and Communications 5. Latest Trends in Maintaining and Strengthening Broadcasting Infrastructure and Facility Development Policy Yukari Iimura, Director of Broadcasting Facility Development Promotion Division, Ministry of Internal Affairs and Communications 6. Latest Trends in Broadcasting and Distribution Content Promotion Policy Hiroki Yoshida, Director of Information and Communication Works Promotion Division, Ministry of Internal Affairs and Communications

Mar 20, 2026

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