We will be exhibiting a poster at the 29th Okayama Research Park Research and Exhibition Presentation.

We will create new value through the mutual complementarity of ICT and BST.

In-circuit testing with a flying probe tester excels at inspecting the electrical characteristics of implemented electronic components in analog circuits. However, components that cannot be probed make electrical testing difficult, and functional testing of digital circuits is challenging. On the other hand, boundary scan testing allows for quick interconnection testing between LSI pins and on-board programming for FPGAs, but it can only test digital circuits around ICs that comply with the boundary scan standard, and it also requires specialized fixtures for connections. At Takaya Corporation, we possess technology that uses flying probes instead of fixtures to connect 4 to 5 scan-compatible pins and measuring instruments required for boundary scan testing. This allows for boundary scan testing even when the counterpart of a boundary scan-compliant IC is a non-boundary scan-compliant IC or passive components (such as connectors) by enabling the flying probe to function as a virtual boundary scan cell. With a single flying probe tester, it is possible to conduct comprehensive testing of both digital and analog circuits, thereby significantly enhancing testing efficiency compared to before.

• Circuit Board Inspection Equipment

We have received permission to publish the feature article that was included in the only domestic magazine specializing in implementation technology, "Electronics Implementation Technology." You can view it here.

Special Feature Content ■ Latest Trends in BGA Implementation Board Inspection Hybrid Inspection of Flying Probe Testers and JTAG Testing Andor System Support Co., Ltd. / Masayuki Taniguchi Takaya Co., Ltd. / Kohei Yanagida Overview BGA (Ball Grid Array) components are now used in all types of electronic devices, from consumer products to industrial equipment, and more recently, automotive devices. However, a reliable method for inspecting boards with BGA components (hereafter referred to as BGA implementation boards) has not been established. This is because every inspection method has its advantages and disadvantages, making it impossible to conduct a complete test using only one inspection method. Therefore, inspecting BGA implementation boards has become a challenge for many companies. In this article, we will introduce the latest technological trends in hybrid inspection that combines flying probe testers and JTAG (Joint Test Action Group) boundary scan as one solution to this issue. 1. Introduction 2. Inspection and Challenges of BGA Implementation Boards 3. Possibilities of Electrical Testing 4. In-Circuit Testing 5. JTAG Boundary Scan Testing 6. Hybrid Testing 7. Conclusion

• Circuit Board Inspection Equipment

Are you feeling that there are "not enough people" and that "work stops due to back-and-forth for confirmation" during equipment installation and leveling work for large devices? In workplaces facing a labor shortage, improving the efficiency of the leveling process has become a significant challenge. At the 3rd Tama Future Industrial Fair, we will showcase Any Design's leveling-related products that address these issues. The wireless and digital precision level "LevelMan" shares measurement values in real-time to a tablet. You can confirm the same values from a distance, allowing for simultaneous decision-making by multiple people. Furthermore, the fully automated leveling adjustment system "AdjustMan," centered around LevelMan, has been developed as a result of joint research with the Tokyo Metropolitan Industrial Technology Research Institute, and its practicality has been recognized with awards. At the venue, you can actually see how measurement sharing via wireless and apps works. Experience "leveling that doesn't stop even with a labor shortage" at our booth. ---- Date: January 30, 2026 (Friday) 10:00 AM - 5:00 PM January 31, 2026 (Saturday) 10:00 AM - 4:00 PM Venue: Tokyo Tama Future Messe Booth: Any Design (Booth No. 20) Admission: Free (Pre-registration required)

We will be holding the second webinar on aluminum foil, which received great acclaim last time. This is an opportunity to deepen your knowledge about aluminum foil, so please join us. 【Webinar Details】 Content: Introduction to the Manufacturing Methods and Functional Aluminum Foils vol.2 Date: February 20 (Friday) Time: 15:00 - 16:00 Participation Fee: Free How to Participate: A Zoom viewing URL will be sent to those who register by the day before. Capacity: 100 people 【Recommended for the Following Individuals】 - Those who have challenges related to metal foils or resin films - Those interested in joint research with foil manufacturers or new business development - Those interested in functional aluminum foils with high smoothness, high corrosion resistance, high strength, and luxurious designs ▼ Register here (Microsoft Forms) https://forms.cloud.microsoft/r/UA5g4N2fGU (dummy) ▼ If you have any further questions, please contact us at the email address below. foil-marketing@toyal.co.jp

Iida Manufacturing will exhibit at "Technical Show Yokohama 2026," which will be held at Pacifico Yokohama from February 4 (Wednesday) to February 6 (Friday), 2026. Booth Number: Yokohama Manufacturing Zone (Booth No. A-01 e-2) This exhibition is one of the largest industrial technology and product trade fairs in the Tokyo metropolitan area. This year, it will be held as a hybrid exhibition combining both physical and online displays. ▼ WEB Exhibition Page https://www.tech-yokohama.jp/2026/exhibitor/?detail=101260 We will showcase our processed products, including our patented technologies such as "PTFE and Metal Joining," "Resin Bearings," "PEK Gears," and "PEEK Gears." We look forward to your visit.

JSOL Corporation supports the construction of a robust integration platform that connects SAP Cloud ERP Private (RISE with SAP) with surrounding systems. In this webinar, we will introduce how to achieve complex integrations simply by utilizing ASTERIA Warp, which enables rapid and flexible data integration without coding. Furthermore, by combining it with a high availability configuration using LifeKeeper, we ensure reliability that keeps business operations running even during failures. With our expertise in SAP integration and extensive track record, we will explain best practices that reduce operational burdens and accelerate business speed, along with concrete examples. Please take home tips to optimize your company's SAP integration platform from this webinar.

Mettler Toledo will hold an online seminar titled "Taking Pipetting to the Next Stage." In this webinar, we will explain techniques and tips for selecting the appropriate pipette and using it effectively, based on Good Pipetting Practice, which is essential for pipetting operations. By learning the proper selection and usage of pipettes, which are widely used in experiments in biology and life sciences, you will be able to perform pipetting operations with greater accuracy.