We will be exhibiting a poster at the 29th Okayama Research Park Research and Exhibition Presentation.

We will create new value through the mutual complementarity of ICT and BST.

In-circuit testing with a flying probe tester excels at inspecting the electrical characteristics of implemented electronic components in analog circuits. However, components that cannot be probed make electrical testing difficult, and functional testing of digital circuits is challenging. On the other hand, boundary scan testing allows for quick interconnection testing between LSI pins and on-board programming for FPGAs, but it can only test digital circuits around ICs that comply with the boundary scan standard, and it also requires specialized fixtures for connections. At Takaya Corporation, we possess technology that uses flying probes instead of fixtures to connect 4 to 5 scan-compatible pins and measuring instruments required for boundary scan testing. This allows for boundary scan testing even when the counterpart of a boundary scan-compliant IC is a non-boundary scan-compliant IC or passive components (such as connectors) by enabling the flying probe to function as a virtual boundary scan cell. With a single flying probe tester, it is possible to conduct comprehensive testing of both digital and analog circuits, thereby significantly enhancing testing efficiency compared to before.

• Circuit Board Inspection Equipment

We have received permission to publish the feature article that was included in the only domestic magazine specializing in implementation technology, "Electronics Implementation Technology." You can view it here.

Special Feature Content ■ Latest Trends in BGA Implementation Board Inspection Hybrid Inspection of Flying Probe Testers and JTAG Testing Andor System Support Co., Ltd. / Masayuki Taniguchi Takaya Co., Ltd. / Kohei Yanagida Overview BGA (Ball Grid Array) components are now used in all types of electronic devices, from consumer products to industrial equipment, and more recently, automotive devices. However, a reliable method for inspecting boards with BGA components (hereafter referred to as BGA implementation boards) has not been established. This is because every inspection method has its advantages and disadvantages, making it impossible to conduct a complete test using only one inspection method. Therefore, inspecting BGA implementation boards has become a challenge for many companies. In this article, we will introduce the latest technological trends in hybrid inspection that combines flying probe testers and JTAG (Joint Test Action Group) boundary scan as one solution to this issue. 1. Introduction 2. Inspection and Challenges of BGA Implementation Boards 3. Possibilities of Electrical Testing 4. In-Circuit Testing 5. JTAG Boundary Scan Testing 6. Hybrid Testing 7. Conclusion

• Circuit Board Inspection Equipment

We will be exhibiting at the "P-MEC Japan 2025 Pharmaceutical Ingredients and Equipment Exhibition" held at Tokyo Big Sight. During the event, we will showcase various products. We invite all relevant parties to come and visit us. 【Suppliers】 ・LAUDA

Seiko Co., Ltd. will be exhibiting at the "11th Monozukuri World Nagoya" held at Port Messe Nagoya. This exhibition features approximately 630 companies showcasing advanced technologies that contribute to shortening development and manufacturing periods, promoting DX and IT, reducing costs, and enhancing energy efficiency and automation in factories, including IT and DX products, parts, equipment, devices, and measurement products. We plan to display the actual cabinet for equipment management, "SMART BEE," so please be sure to visit us. 【Model Numbers】 ■ Vending Machine Type Tool Management Cabinet Smart Bee X, Smart Bee S, Cute Bee, Smart Bee Pro ■ Locker Shelf Type Tool and Consumables Management Cabinet T Series: T57, T100, T108 TW Series (with electronic scale): TW45, TW68, Hyper S, Hive

We will be exhibiting at "Japan DX Week Spring 2026," which will be held at Tokyo Big Sight from April 8 (Wednesday) to April 10 (Friday). At the Marble booth, we plan to showcase how AI can improve work efficiency and lead to business automation in on-site operations. Additionally, we will provide an opportunity to experience a demonstration utilizing the latest technology, AR. Furthermore, for our manufacturing industry customers, we will present proposals under the theme "Utilizing Drawings to Drive DX," promoting the digitalization of design and quality areas, and introducing packaged products and custom services aimed at enhancing productivity in the manufacturing sector.

Core systems are the foundational support for corporate management, and their importance is increasingly heightened in the DX era, where data becomes a source of competitive advantage. To respond swiftly and flexibly to the rapidly changing business environment, a transformation in the nature of systems is required. We will introduce a method to realize a highly flexible and scalable business system that promotes operational efficiency and data utilization through the combination of kintone and ASTERIA Warp, using examples and demonstrations.

The widespread adoption of generative AI is rapidly evolving from traditional "conversational AI" to "autonomous execution AI (AI agents)." The AI agents that have recently garnered attention are not limited to merely generating responses; they can incorporate an autonomous processing flow of "planning → task decomposition → execution → evaluation," serving as new partners that can substitute and expand users' business operations. In this seminar, we will clearly introduce the following topics, incorporating examples of the AI solution "AIdea Suite AGENT +plus" and the data integration tool "ASTERIA Warp": - Why "AI agents" are becoming essential for corporate competitiveness now - The mechanisms of AI agents and specific use cases - Methods for establishing business efficiency, creating new value, and gaining a competitive edge - Specific steps for implementing AI agents - Data integration and its methods, which are essential for utilizing AI *This is a re-broadcast of the seminar held on October 30, 2025 (Thursday).