We will be exhibiting a poster at the 29th Okayama Research Park Research and Exhibition Presentation.

We will create new value through the mutual complementarity of ICT and BST.

In-circuit testing with a flying probe tester excels at inspecting the electrical characteristics of implemented electronic components in analog circuits. However, components that cannot be probed make electrical testing difficult, and functional testing of digital circuits is challenging. On the other hand, boundary scan testing allows for quick interconnection testing between LSI pins and on-board programming for FPGAs, but it can only test digital circuits around ICs that comply with the boundary scan standard, and it also requires specialized fixtures for connections. At Takaya Corporation, we possess technology that uses flying probes instead of fixtures to connect 4 to 5 scan-compatible pins and measuring instruments required for boundary scan testing. This allows for boundary scan testing even when the counterpart of a boundary scan-compliant IC is a non-boundary scan-compliant IC or passive components (such as connectors) by enabling the flying probe to function as a virtual boundary scan cell. With a single flying probe tester, it is possible to conduct comprehensive testing of both digital and analog circuits, thereby significantly enhancing testing efficiency compared to before.

• Circuit Board Inspection Equipment

We have received permission to publish the feature article that was included in the only domestic magazine specializing in implementation technology, "Electronics Implementation Technology." You can view it here.

Special Feature Content ■ Latest Trends in BGA Implementation Board Inspection Hybrid Inspection of Flying Probe Testers and JTAG Testing Andor System Support Co., Ltd. / Masayuki Taniguchi Takaya Co., Ltd. / Kohei Yanagida Overview BGA (Ball Grid Array) components are now used in all types of electronic devices, from consumer products to industrial equipment, and more recently, automotive devices. However, a reliable method for inspecting boards with BGA components (hereafter referred to as BGA implementation boards) has not been established. This is because every inspection method has its advantages and disadvantages, making it impossible to conduct a complete test using only one inspection method. Therefore, inspecting BGA implementation boards has become a challenge for many companies. In this article, we will introduce the latest technological trends in hybrid inspection that combines flying probe testers and JTAG (Joint Test Action Group) boundary scan as one solution to this issue. 1. Introduction 2. Inspection and Challenges of BGA Implementation Boards 3. Possibilities of Electrical Testing 4. In-Circuit Testing 5. JTAG Boundary Scan Testing 6. Hybrid Testing 7. Conclusion

• Circuit Board Inspection Equipment

"gPROMS Formulated Products Crystallization Workshop" Target Audience: • For those interested in crystallization modeling with gPROMS Overview ・Date: July 1 (Wednesday) 13:00–17:30 ・Format: Virtual classroom via remote Teams ・Language: Japanese *The text will be in English only. Details will be provided after registration. ・Machine: Exercises will be conducted on a virtual machine using gPROMS. Internet access and a personal laptop are required. Further details will be provided to registered participants later. ・Cost: Free *Registration may be declined for competitors or those using free email addresses.

Seminar Points ■ Key Points of the Course Issues and responses related to quality are important challenges in business. However, the methods and effectiveness of quality responses can vary greatly depending on the situation and approach. In this seminar, we will explain the fundamental concepts and methods of quality response, incorporating specific examples and tools. Additionally, we will discuss how to leverage digital transformation (DX) to enhance quality response capabilities, as well as the development of skills and systems for organizations and individuals. 【Overview】 - Fundamental concepts and methods of quality response - Analysis of problems and methods for solving them in quality response - Importance of communication and skills in quality response - How to utilize digital transformation (DX) in quality response - Development of skills and systems for organizations and individuals to enhance quality response capabilities ■ Main Target Audience Individuals who have just joined the quality assurance department Those who need to address quality issues Managers who want to promote improvement (Kaizen) Business owners who want to improve their company's quality response ■ Expected Outcomes Foundation of quality response Quality management methods Frameworks necessary for quality response

We regularly conduct training and workshops on our products. The schedule for May to July is as follows: May 29 (Monday) Introduction to ProcessBuilder May 30 (Tuesday) Custom Modeling with gPROMS June 26 (Monday) Introduction to gCRYSTAL July 31 (Monday) Introduction to ProcessBuilder We hope you will join us.

In the manufacturing industry, while a lot of quality and process data has been accumulated, there are still many cases where its value is not fully utilized. In this seminar, two companies will introduce examples of using JMP to engage in data analysis and improvement activities. 【Presentation Overview】 1. "Unraveling the 'Personality' of Batteries!" Utilizing "Raw Data" for "Proactive Quality" Hasegawa Kaoru and Shimada Kohei from Energy With Co., Ltd. 2. Why Can't We Find the Root Cause of Defects? ~Data-Driven Improvement Practiced with JMP~ Tsuji Ikumi from Atfields Technology Co., Ltd. 【Target Audience】 - Individuals involved in quality control, quality assurance, production technology, and manufacturing technology in the manufacturing industry. - Those who want to utilize quality data and process data to work on quality and process improvements. - Anyone interested in data analysis and quality/process improvement using JMP (both JMP users and non-users are welcome). ▼Details & Registration https://www.jmp.com/ja/events/seminars/non-series/2026/09-18-manufacturing

In the automotive and aerospace industries, there is an urgent and critical challenge to improve fuel efficiency, leading to active development of materials and component manufacturing technologies aimed at further weight reduction. Uchida Co., Ltd., which boasts high technical capabilities in the molding and processing of CFRP (carbon fiber reinforced plastic) with excellent characteristics such as lightweight, high strength, high rigidity, corrosion resistance, and heat resistance, has introduced the first CFRP-compatible large pellet 3D printer "Heron AM" from Caracol, aiming for innovation for the future and energetically working on circular component shaping and manufacturing. In this seminar, COO Junpei Ochiai will practically explain, using videos, the motivation for the introduction, CFRP molding and component shaping technologies, reduction of personnel involved in the molding manufacturing process, examples of achieving low costs through re-resourcing of molds after use, comparisons with conventional methods and case studies, efforts to reduce carbon dioxide through material circulation, initiatives for a circular economy, and commissioned shaping services.