We are currently running a special campaign with a 10% discount voucher for future use on thermal property measurements! [Bethel Hudson Institute]

Introducing devices for measuring the thermal diffusivity of sheet-like and plate-like materials, as well as thermal evaluation devices for fiber orientation distribution!

Introducing Bethel's thermal property measurement devices. The "Thermo Wave Analyzer TA33/35" is a measurement device for the thermal diffusivity of sheet and plate materials, capable of measuring the thermal diffusivity of functional materials. The "Thermal Microscope TM" has been commercialized through joint development with the National Institute of Advanced Industrial Science and Technology's Measurement Standards Division, allowing for measurements in micro-regions and thin films. Additionally, we offer the "Thermal Imaging Scope TSI," which visualizes thermal conduction paths using infrared cameras and lasers, as well as the "Fiber Orientation Evaluation System TEFOD." 【Features of the Thermo Wave Analyzer TA33/35】 ■ High freedom of sample shape ■ Dynamic range from organic films to diamonds ■ Anisotropy evaluation through measurements in horizontal and vertical directions ■ Evaluation of defects and irregularities through distribution measurements *For more details, please refer to the PDF document or feel free to contact us.

• Other measurement, recording and measuring instruments

Evaluating the electrode part of the semiconductor laser!!

■Visualizing the thermal conductivity of the insulating layer ■Evaluating the thermal conductivity of thin films ■Evaluating the thermal penetration rate in micro-regions (3μm and above)

• Microscope

Development of aluminum nitride, known for its use in heat sink materials!

■Evaluation of particles with a micro size (3μm and above) ■Evaluation of thermal conductivity of thin films ■Measurement possible at submicron order

• Microscope

Measuring the thermal diffusivity of semiconductor material 'Si wafer's thermal properties'!

The thermal diffusivity of "Si wafers," which are essential materials for semiconductors, can be measured.

• Other metal materials

Thermal evaluation of 'tantalum', an essential component for electronic products!

■Non-contact measurement using lasers ■Confirmation of anisotropy in the in-plane direction and thickness direction ■Conversion of thermal diffusivity to thermal conductivity and thermal permeability ■Absolute measurement method with easy condition setting

• Microscope

It will help in the development of thermoelectric materials!

Energy conservation is a challenge that must be addressed throughout Japan and the world in the future, and it is expected that the development of thermoelectric materials will also accelerate within this context. In fact, our company has received numerous requests for measurements of thermoelectric materials. Since the earthquake, there has been a particularly increasing trend, and if our measurement technology can contribute to the world of energy conservation, we are willing to cooperate in any way possible.

• Other metal materials

It will help in the development of high thermal conductivity materials! 【Cooling of semiconductor devices / heat sinks】

■Measurement of thermal properties of carbon nanotube (CNT) applied materials ■Surface treatment is unnecessary (in the case of carbon-based materials) ■Essential for the development of high thermal conductivity materials! ■Non-contact measurement

• Composite Materials

The anisotropy of the graphite sheet (in-plane direction and thickness direction) has become measurable!

○ Anisotropy of graphite sheets (in-plane direction and thickness direction) ○ Thermal diffusivity ○ Thermal conductivity

• Optical microscope

For evaluating thermal conductivity in thin films and micro-regions such as fillers, ceramics, insulating thin films, and semiconductor thin films!

This device is an innovative thermal property measurement instrument that boasts world-class minimal resolution. It can measure the thermal properties of samples in detail at the point, line, and surface levels, accurately capturing thermal property value distributions on the micron order that were difficult to achieve with conventional devices. Furthermore, this device realizes high resolution while being a non-contact measurement tool, pioneering areas that were previously impossible with traditional technology. Equipped with the world's first technology, it can directly measure thermal conductivity under favorable conditions in addition to measuring thermal diffusivity. This device demonstrates unparalleled performance in situations requiring precise thermal property analysis in research and development. 〇 About the Measurement Principle 〇 The measurement principle of this device is based on the thermoreflectance method. This is one of the techniques for measuring the surface temperature of materials with high precision, particularly used to investigate the thermal characteristics of micro-regions and thin film materials. This method detects changes in reflectivity associated with changes in the surface temperature of the material and measures the temperature from those changes. The results obtained are expressed as the parameter known as thermal diffusivity. Thermal diffusivity is a physical quantity that indicates how much heat is absorbed when two substances are in contact. It can be mutually converted into thermal conductivity and thermal diffusivity based on specific heat and density.

• Microscope

Bulk, thin film, micro areas, plate-shaped, sheet-shaped, almost all materials can be accommodated. Please consult us once.

Supports various thermal conductivity measurement methods such as steady-state method, periodic heating method, and thermoreflectance method. Compatible with plate-shaped, sheet-shaped, soft samples, fibrous materials, and various shapes. Please consult us even for samples that have been rejected by other companies.

• Contract measurement

Non-contact measurement of thermal diffusivity using a laser. Measurement of resin-based materials is also possible.

The ThermoWave Analyzer TA measures thermal diffusivity using a non-contact method with a laser. Since the thermal conductivity of composite materials made of fillers and resins varies significantly with the mixing ratio, measuring thermal diffusivity is essential. Measurement of resin-based materials is also possible. Please contact us for more details.

• Logic Analyzer

Non-contact measurement of thermal diffusivity using a laser. Measurement of materials with high thermal conductivity is possible.

The ThermoWave Analyzer TA3 measures thermal diffusivity using a non-contact method with a laser. It is capable of measuring materials with high thermal conductivity. Measurements can be taken without worrying about the shape. For more details, please contact us.

• Logic Analyzer

For measuring the thermal properties of thin films and micro-regions. It is possible to measure the thermal conductivity distribution of polycrystalline SiC.

The Thermal Microscope TM3 deposits a metal thin film on the sample and periodically heats it using a heating laser. It is capable of measuring the thermal conductivity distribution of polycrystalline SiC (ceramics). Please contact us for more details.

• Microscope

For measuring thermal properties of thin films and micro-regions. Micro-sized particles can also be measured freely.

The Thermal Microscope TM3 deposits a metal thin film on the sample and periodically heats it using a heating laser. It can now measure tiny particles that were previously difficult to analyze. For more details, please contact us.

• Microscope

For measuring thermal properties of thin films and micro-regions. Evaluation of heat-resistant coatings for structural components is possible.

The Thermal Microscope TM3 deposits a metal thin film on the sample and periodically heats it using a heating laser. It allows for the evaluation of heat-resistant coatings for structural components. For more details, please contact us.

• Microscope

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

● The production time for casting prototypes can be shortened! Since model production is not required, the time needed to create prototypes, which previously took about a month, can be significantly reduced. ● Model costs can be reduced! By directly producing sand molds from 3D data, there is no need for model production costs. If changes to the model are necessary, they can be addressed by modifying the 3D data. ● Similar products with different shapes and dimensions can be prototyped simultaneously! With one molding process, different products with similar shapes or varying dimensions can be molded at the same time. This allows for the verification of multiple types in a short period.

Are you struggling to explain "safety" to the client using just drawings? - The risks in blind spots are difficult to convey to the client through drawings alone. - Safety measures often become a target for cost reduction, making it hard to communicate their necessity. - There is a concern that the client might say, "It's more dangerous than I thought," after completion. Risks that are visible to design professionals are not easily understood intuitively by clients who are outside the field. This document is not just a simple explanation of sensor functions; it is a guide to visually explain "why sensors are necessary in that location." It can be used directly as explanatory material for the client. Here are three key points for utilizing this document: 1. Visualization of Risks Blind spots during vehicle departure and contact risks within the site are illustrated clearly. 2. Clarification of Selection Criteria A comparison table outlines the differences between complex sensor types such as infrared, ultrasonic, and loop coils. 3. Diagram of System Configuration It illustrates not just the sensors alone, but how they combine with components like rotating lights and control panels, providing practical assistance for electrical equipment design. Please make use of this to prevent "rework after completion" and "accident risks."

In facilities operating nurse call systems, we have made the bed exit sensor wireless, allowing it to notify in conjunction with the nurse call system. By simply connecting the mat sensor "Foldable Thin Matt-kun," the body movement call "Ugo-kun," and the wheelchair body movement call "Ayumi-chan" to the transmitter HB-RS, you can make the bed exit sensor wireless. The infrared sensor "Just Place Pole-kun" has the transmitter HB-RS built-in. This helps prevent accidents caused by falls, slips, or wandering, contributing to the efficiency of medical operations. 【Features】 ○ Wireless conversion by simply connecting existing sensors to the transmitter HB-WSK. ○ The bed exit sensor notifies wirelessly in conjunction with the nurse call system. ○ Up to 5 transmitters can be registered with a single receiver. ○ The communication distance between the transmitter and receiver is approximately 10 meters. ◎ For more details, please contact us or download the catalog.