Notice of Participation in SEMICON JAPAN 2024

Shorten cycle time! A versatile and easy-to-use optical interference measuring instrument designed for convenience.

The "NCG" is a thickness measurement device using optical interference technology. It calculates and measures the thickness of layers through the interference caused by the reflection of light waves at the joint surface of the workpiece. It is designed to manage the thickness of different materials such as glass, plastic, and silicon wafers. This product can be connected to various machines, allowing for high-precision and high-speed management of component thickness, and can be used in dry or wet environments within the specified limits of the specifications, either on the machine or inside the machine. 【Features】 ■ Guarantees processing accuracy within the desired tolerance ■ Reduces cycle time ■ Control for maintaining stable production under controlled conditions ■ Compensation for mechanical variations ■ History of measurement results *For more details, please refer to the PDF document or feel free to contact us.

• Other measurement, recording and measuring instruments
• Optical Measuring Instruments

Realizing non-contact thickness measurement of various materials that transmit white light.

The P3CF is a measurement system that combines traditional contact probes with a non-contact probe using confocal technology (hybrid measurement). It can directly measure the distance of various materials and the thickness of transparent materials in white light. The thickness of thin and delicate materials (such as ceramics, semiconductor wafers, and epoxy resin mold compounds for packaging) requires precise measurement in the finishing process, but it is challenging to measure with contact methods. The P3CF, which employs confocal technology, measures the thickness non-contact by determining the distance from the reference plane to the work surface. *For more details, please refer to the PDF document or feel free to contact us.*

• Sensors
• Wafer
• Other measurement, recording and measuring instruments

Achieving reduced cycle time in chip manufacturing and high quality! Sensors for blade monitoring during wafer cutting.

"VBI" monitors the blade during wafer cutting, ensuring high reliability and reducing waste. By measuring blade wear and shape in real-time, it achieves scrap reduction without stopping production. The interface unit connects two sensors. It is possible to perform the same function with both or to execute two different functions. *For more details, please refer to the PDF document or feel free to contact us.*

• Sensors
• Wafer
• Other measurement, recording and measuring instruments

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

We will showcase our new product "BLFF," a palletizing foam gripper that weighs only 1.9 kg and measures 350mm×250mm, ideal for bulk picking. We will also introduce various products that cater to different work applications, including durable suction cups and solutions for bag handling. Additionally, we are implementing energy-saving proposals by replacing ejectors to reduce compressed air consumption, which has become a challenge in many industries. If you have any issues with adhesion or transport, please feel free to consult with us at the venue. ■ Lightweight Foam Gripper for Collaborative Robots "CVGC Series" Despite weighing only 1.9 kg, this gripper has a theoretical lifting force of 100 kg, maximizing the payload capacity of collaborative robots. ■ Gripper for Films This gripper is designed to transport thin films gently, minimizing marks left on the surface. By utilizing 3D printing, we can accommodate highly flexible shape designs tailored to specific workpieces and applications. ■ Energy Saving Comparison Panel "Why does a single ejector consume less compressed air compared to a multi-stage ejector?" You can actually verify the differences in compressed air consumption through a comparative display using a flow meter and actual equipment.

We will be exhibiting at Smart Factory JAPAN, held at Tokyo Big Sight from November 18 (Wednesday) to November 20 (Friday), 2026. We will introduce the 'Dr. Process Navi Series', 'Dr. Mold Cloud', and AI solutions that integrate with both products! <Introducing the latest solutions that innovate productivity in manufacturing sites!> ● 'Dr. Process Navi' Series ● 'Dr. Mold Cloud' ● 'AI Solutions' For more details, please check the related products. ■■ Smart Factory JAPAN 2026 Overview ■■ Dates: November 18 (Wednesday), 19 (Thursday), 20 (Friday), 2026 Opening Hours: 10:00 AM - 5:00 PM Venue: Tokyo Big Sight, East Hall 1-3 Our Booth Number: F-20 Registration: Nikkan Kogyo Shimbun 6 Exhibition Joint Site When visiting, please register in advance from your My Page and bring a printed admission ticket. Business meeting requests are also possible, so please make use of this opportunity.

We will be exhibiting at the Monozukuri World Fukuoka Design and Manufacturing Solutions Exhibition, held at Marine Messe Fukuoka from December 2 (Wednesday) to December 4 (Friday), 2026. We will introduce the 'Dr. Process Navi Series', 'Dr. Mold Cloud', and AI solutions that help improve efficiency and reform in manufacturing sites! <Introducing the latest solutions that innovate productivity in manufacturing sites!> ● 'Dr. Process Navi' Series ● 'Dr. Mold Cloud' ● 'AI Solutions' For more details, please check the related products. ■■ Overview of the 4th Monozukuri World Fukuoka Design and Manufacturing Solutions Exhibition ■■ Dates: December 4 (Wednesday), 5 (Thursday), 6 (Friday), 2026 Opening hours: 10:00 AM to 5:00 PM Venue: Marine Messe Fukuoka Our booth number: 14-18 When visiting, please register in advance through the dedicated page and bring your printed visitor badge.

Announcement of participation in the "12th Robot and Aerospace Festival Fukushima 2026 / 5th Drone Summit." 【Date and Time】 　November 27, 2026 (Wednesday) 10:00 AM - 5:00 PM Business Exhibition 　November 28, 2026 (Thursday) 10:00 AM - 4:00 PM General Exhibition 【Venue】 　Big Palette Fukushima (52 Minami 2-chome, Koriyama City, Fukushima Prefecture) 【Exhibits】 　Cardboard Insulated Box 　Craft Cooler Cube