Observation of substrate deformation using a 3D shape measuring device (VR-6200)

Measure the change state with a 3D shape measuring device! Visually confirm the indented shape and amount due to pressure.

We would like to introduce the "Substrate Deformation Observation" using a 3D shape measurement machine. By applying pressure to a PCB substrate, referencing the bending tests of plastics and PCB substrates, we measure the changes using a 3D shape measurement machine (VR-6200). Since the measurement results can be confirmed with a color palette and line profile, it is possible to visually verify the shape and amount of deformation caused by the applied pressure. 【Features】 ■ Measurement results can be confirmed with a color palette and line profile ■ It is possible to visually verify the shape and amount of deformation caused by the applied pressure *For more details, please download the PDF or feel free to contact us.

• Analytical Equipment and Devices
• Analysis Services

In-Situ Continuous Measurement Reliability Evaluation Testing Service

In-situ continuous measurement reliability evaluation tests involve applying stress while measuring characteristics to conduct reliability assessments. ● Accurate understanding of failure time is possible In a read-out method where samples are taken from a stress environment at a fixed time, failure can only be understood at the timing of the read-out, making it impossible to know the exact failure occurrence time. In-situ measurement allows for an accurate understanding of failure time. ● Detection of recoverable failures is possible Recoverable failures can cause significant issues in the market. In most cases, the read-out method makes it nearly impossible to detect these recoverable failures, whereas in-situ measurement enables the detection of recoverable failures, allowing for accurate judgment and assessment. ● Monitoring of stress application conditions on samples is possible The stress application status and measurement data can be confirmed in real-time.

• Testing Equipment and Devices
• Other inspection equipment and devices
• Contract Inspection

We conduct reliability evaluation tests for various electronics products, components, and materials in accordance with standard specifications such as JIS, JEDEC, and MIL.

■High Accelerated Life Test: 5 units ■Thermal Shock Test: 24 units ■Constant Temperature and Humidity Test: 22 units ■Liquid Tank Thermal Shock Test: 3 units ■High Temperature Storage Test ■Hot Oil Resistance Evaluation Test ■Insulation Resistance Continuous Monitoring Evaluation ■Continuity Resistance Continuous Monitoring Evaluation ■Electromigration Continuous Monitoring Evaluation ■Microfocus X-ray Transmission Observation ■Ultrasonic Microscope Observation ■ESD Evaluation Test ■CDM Evaluation Test ■Universal Tensile Evaluation Test ■Cross-section (Polishing) Observation Service (Evaluation before and after environmental testing is also possible) ■Solar Cell (Crystalline Silicon/Amorphous Silicon/Compound/Organic Thin Film, etc.) EL Emission Phenomenon ■Heat Generation Observation

• Testing Equipment and Devices
• Other inspection equipment and devices
• Contract Inspection

Transitional thermal measurement possible power cycle testing, with a customized luminescence/OBIRCH analysis device, where a skilled team thoroughly evaluates and analyzes power devices!

At AITES, we provide total solution services for power devices, including reliability testing, analysis, and evaluation. This includes the "Power Cycle Testing Machine," which can simultaneously conduct transient thermal measurements, as well as "failure analysis of compound semiconductors," "concentration analysis of diffusion layers," and "cross-sectional analysis of modules." We will make proposals based on specific achievements. Keywords: ■General power semiconductors (chips, module TIM materials, etc.) ■Reliability testing/evaluation ■Structural analysis (quality, competitor product RE) ■Failure analysis (identification of failure points, cause investigation, improvement proposals) 【List of Tests】 ■Power Cycle Testing ■Liquid Tank Thermal Shock Testing ■Gate Bias Testing ■Non-destructive observation of semiconductor/package delamination ■Failure analysis of power chips, etc. *For more details, please refer to the PDF materials or feel free to contact us.

• Analytical Equipment and Devices
• Analysis Services

Information on thermal expansion, thermal contraction, and glass transition temperature can be obtained in multiple measurement modes!

TMA (Thermomechanical Analysis) is a method that measures the dimensional changes of a sample while applying a constant load and varying the sample temperature. It provides information on thermal expansion, thermal contraction, glass transition temperature, and more. The temperature range is from -150 to 1000°C, with a maximum size of Φ10×25mm (compression mode, needle insertion mode) and a maximum size of 0.7mm×5mm×20mm (tensile mode) as measurable conditions. This document includes case studies of TMA analysis for semiconductor encapsulants. 【Features】 ■ Thermomechanical measurement ■ Applying a constant load to the sample while varying the sample temperature ■ Measuring the dimensional changes of the sample ■ Obtaining information on thermal expansion, thermal contraction, glass transition temperature, etc. ■ Multiple measurement modes *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis
• Contract measurement
• Contract Inspection

Applicable to change observation, with support for additional analysis! We evaluate the subject in a time series and non-destructive manner.

During reliability testing, the samples change continuously. Do you have any questions such as "At what point did the crack occur?", "How does the degradation progress?", or "How much has it changed from the initial state?" By combining this with reliability testing, we will evaluate the subject in a time-series and non-destructive manner. 【Features】 ■ Applicable for observing changes in whiskers, migration, pressure resistance, solder evaluation, chemical erosion tests, and aging products in the market ■ Environmental tests and observation frequency will be conducted according to customer requirements ■ Additional analyses such as electrical characteristics, SEM observation, elemental analysis, and cross-sectional observation are also available *For more details, please refer to the PDF document or feel free to contact us.

• Testing Equipment and Devices
• Other inspection equipment and devices
• Contract Inspection

We can recreate an environment where the surface temperature of the sample is higher than the ambient temperature!

We will introduce the lamp heating test (infrared irradiation test). In the environmental test chamber, the test sample is placed, and while controlling the ambient temperature in a blown air state, up to seven infrared lamps are used to irradiate light, thereby controlling the temperature of the surface temperature sensor of the sample to be higher than the ambient temperature. For example, it can simulate the stress of being further overheated by sunlight in a car interior that has reached high temperatures during the day. 【Features】 ■ Capable of conducting infrared irradiation tests in a blown air environment within the environmental test chamber. ■ Can recreate an environment where the surface temperature of the sample is higher than the ambient temperature. *For more details, please refer to the PDF document or feel free to contact us.

• Other contract services

With this one device, you can measure various things! It can reproduce cross-sectional shapes without cutting, and it can also measure glossy surfaces!

Aites Co., Ltd. has introduced the KEYENCE manufactured one-shot 3D shape measuring device 'VR-6200'. It comes with an electric rotation unit, allowing for the reproduction of cross-sectional shapes without cutting. The HDR scanning algorithm enables measurement of glossy surfaces as well. From profile measurement to flat measurement, volume area, and comparative measurement, this single device can perform various measurements. 【Measurable Items】 ■ Profile Measurement ■ Flat Measurement ■ Volume Area ■ Line Roughness Measurement ■ Surface (Flatness) Measurement ■ Comparative Measurement *For more details, please refer to the PDF document or feel free to contact us.

• 3D measuring device

Testing service for plastic films using a universal testing machine (autograph) in a heated environment!

The "tensile test" is a test that measures the load and displacement (elongation) when a material is pulled at a constant speed, in order to determine the physical and mechanical properties of the material. By pulling the test specimen in a constant temperature chamber, it is possible to determine and understand the temperature dependence of these properties. Our company is capable of conducting material property tests under temperature-controlled environments. We can also propose conditions tailored to the materials and properties you wish to measure. Please feel free to consult with us. 【Test Equipment Specifications】 ■ Constant Temperature Chamber Temperature Range: -40 to 250℃ ■ Load Cell: 50kN, 1kN ■ Load Accuracy: ±1% of load indication value ■ Test Speed: 0.0005 to 1000 mm/min ■ Travel Distance ・Tensile Test Section: 1485 mm *For more details, please refer to the PDF document or feel free to contact us.

• Strength Testing Equipment
• Other services

We exhibited a booth at the "4th Annual Meeting of the Japanese Society for Antibody Research" held at Omiya Sonic City from December 1 (Monday) to December 3 (Wednesday). Thank you very much to everyone who visited our booth during the event. Thanks to your support, we were able to successfully conclude the meeting. If you have any questions regarding the products you viewed, please feel free to reach out to us. We will respond to inquiries received during the event in due course. We appreciate your continued support of Higuchi Shokai. ▼Exhibited Products - Various assembly parts (bags, bottles, sampling, etc.) - Depth filters (post-culture filtration)

● This is a leak testing device for small electronic components that does not use fluorinated inert liquids (PFAS-free). ● There is no longer a need for unstable visual confirmation through liquid immersion testing. It adopts a quantitative testing method that allows for stable pressure leak testing. ● It is a tabletop leak testing device specifically for gross leaks, with accuracy equal to or greater than that of liquid immersion testing. ● The detectable range is approximately 1×10⁻² Pa·m³/s to 1×10⁻⁶ Pa·m³/s (varies depending on the target product). ● It is suitable for sealed structures ranging from a few millimeters to a maximum of 80 × 70 mm. Please feel free to contact us for more information!

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Do you have any concerns or requests regarding wired bed exit sensors? × Tangling and tripping of wired cables × Cable disconnection or damage × Worry about forgetting to turn on the switch after temporarily stopping the sensor. × Want to be notified of bed exit even from a location away from the nurse call outlet. Such concerns can be resolved simply by connecting to a wireless set linked to the nurse call system! Our nurse call linked wireless set allows you to connect bed exit sensors like "Ugo-kun," "Foldable Thin Matta-kun," "Ayumi-chan," and "Just Place Pole-kun" to transmitters and receivers, reducing wiring around the bed, alleviating concerns about tripping and falling due to cables, and contributing to a tidier work environment. Furthermore, it enables the use of bed exit sensors even from locations away from the nurse call outlet, allowing for more flexible equipment placement.

The pinhole inspection for packaging engineering is fully automated, eliminating packaging defects based on certain quality standards. The judgment results and operational status can be managed via a monitor screen. - Quantitative management of quality standards for the pinhole inspection process - Ensuring the quality of the product's shelf life - Establishing evaluation criteria for the manufacturing process, achieving quantitative quality assurance - Slim and space-saving design that can be connected to existing production lines - Quick changeover for product variety switching can be handled in a short time by exchanging chambers - Fully domestically produced, allowing for rapid maintenance and troubleshooting - Example target works: pillow packaging, packaged rice (packaged cooked rice), etc. *Please consult us regarding the use of this product for pharmaceuticals.