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  4. Observation of substrate deformation using a 3D shape measuring device (VR-6200)
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  • Mar 17, 2025
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Mar 17, 2025

Observation of substrate deformation using a 3D shape measuring device (VR-6200)

アイテス アイテス
I would like to introduce "Observation of Substrate Deformation Using a 3D Shape Measuring Machine." By applying pressure to the PCB substrate, referencing bending tests of plastics and PCB substrates, the change in state is measured using a 3D shape measuring machine (VR-6200). Since the measurement results can be confirmed with a color palette and line profile, it is possible to visually verify the shape and amount of deformation caused by the applied pressure.
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Observation of substrate deformation using a 3D shape measuring machine (VR-6200)

Measure the change state with a 3D shape measuring device! Visually confirm the indented shape and amount due to pressure.

We would like to introduce the "Substrate Deformation Observation" using a 3D shape measurement machine. By applying pressure to a PCB substrate, referencing the bending tests of plastics and PCB substrates, we measure the changes using a 3D shape measurement machine (VR-6200). Since the measurement results can be confirmed with a color palette and line profile, it is possible to visually verify the shape and amount of deformation caused by the applied pressure. 【Features】 ■ Measurement results can be confirmed with a color palette and line profile ■ It is possible to visually verify the shape and amount of deformation caused by the applied pressure *For more details, please download the PDF or feel free to contact us.

  • Analytical Equipment and Devices
  • Analysis Services

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In-Situ Continuous Measurement Reliability Evaluation Testing Service

In-Situ Continuous Measurement Reliability Evaluation Testing Service

In-situ continuous measurement reliability evaluation tests involve applying stress while measuring characteristics to conduct reliability assessments. ● Accurate understanding of failure time is possible In a read-out method where samples are taken from a stress environment at a fixed time, failure can only be understood at the timing of the read-out, making it impossible to know the exact failure occurrence time. In-situ measurement allows for an accurate understanding of failure time. ● Detection of recoverable failures is possible Recoverable failures can cause significant issues in the market. In most cases, the read-out method makes it nearly impossible to detect these recoverable failures, whereas in-situ measurement enables the detection of recoverable failures, allowing for accurate judgment and assessment. ● Monitoring of stress application conditions on samples is possible The stress application status and measurement data can be confirmed in real-time.

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Introduction to Reliability Assurance Services

We conduct reliability evaluation tests for various electronics products, components, and materials in accordance with standard specifications such as JIS, JEDEC, and MIL.

■High Accelerated Life Test: 5 units ■Thermal Shock Test: 24 units ■Constant Temperature and Humidity Test: 22 units ■Liquid Tank Thermal Shock Test: 3 units ■High Temperature Storage Test ■Hot Oil Resistance Evaluation Test ■Insulation Resistance Continuous Monitoring Evaluation ■Continuity Resistance Continuous Monitoring Evaluation ■Electromigration Continuous Monitoring Evaluation ■Microfocus X-ray Transmission Observation ■Ultrasonic Microscope Observation ■ESD Evaluation Test ■CDM Evaluation Test ■Universal Tensile Evaluation Test ■Cross-section (Polishing) Observation Service (Evaluation before and after environmental testing is also possible) ■Solar Cell (Crystalline Silicon/Amorphous Silicon/Compound/Organic Thin Film, etc.) EL Emission Phenomenon ■Heat Generation Observation

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We provide comprehensive support for reliability testing, analysis, and evaluation of electronic components!

Transitional thermal measurement possible power cycle testing, with a customized luminescence/OBIRCH analysis device, where a skilled team thoroughly evaluates and analyzes power devices!

At AITES, we provide total solution services for power devices, including reliability testing, analysis, and evaluation. This includes the "Power Cycle Testing Machine," which can simultaneously conduct transient thermal measurements, as well as "failure analysis of compound semiconductors," "concentration analysis of diffusion layers," and "cross-sectional analysis of modules." We will make proposals based on specific achievements. Keywords: ■General power semiconductors (chips, module TIM materials, etc.) ■Reliability testing/evaluation ■Structural analysis (quality, competitor product RE) ■Failure analysis (identification of failure points, cause investigation, improvement proposals) 【List of Tests】 ■Power Cycle Testing ■Liquid Tank Thermal Shock Testing ■Gate Bias Testing ■Non-destructive observation of semiconductor/package delamination ■Failure analysis of power chips, etc. *For more details, please refer to the PDF materials or feel free to contact us.

  • Analytical Equipment and Devices
  • Analysis Services

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TMA (Thermomechanical Analysis)

Information on thermal expansion, thermal contraction, and glass transition temperature can be obtained in multiple measurement modes!

TMA (Thermomechanical Analysis) is a method that measures the dimensional changes of a sample while applying a constant load and varying the sample temperature. It provides information on thermal expansion, thermal contraction, glass transition temperature, and more. The temperature range is from -150 to 1000°C, with a maximum size of Φ10×25mm (compression mode, needle insertion mode) and a maximum size of 0.7mm×5mm×20mm (tensile mode) as measurable conditions. This document includes case studies of TMA analysis for semiconductor encapsulants. 【Features】 ■ Thermomechanical measurement ■ Applying a constant load to the sample while varying the sample temperature ■ Measuring the dimensional changes of the sample ■ Obtaining information on thermal expansion, thermal contraction, glass transition temperature, etc. ■ Multiple measurement modes *For more details, please refer to the PDF document or feel free to contact us.

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Observation of time-dependent changes associated with reliability testing.

Applicable to change observation, with support for additional analysis! We evaluate the subject in a time series and non-destructive manner.

During reliability testing, the samples change continuously. Do you have any questions such as "At what point did the crack occur?", "How does the degradation progress?", or "How much has it changed from the initial state?" By combining this with reliability testing, we will evaluate the subject in a time-series and non-destructive manner. 【Features】 ■ Applicable for observing changes in whiskers, migration, pressure resistance, solder evaluation, chemical erosion tests, and aging products in the market ■ Environmental tests and observation frequency will be conducted according to customer requirements ■ Additional analyses such as electrical characteristics, SEM observation, elemental analysis, and cross-sectional observation are also available *For more details, please refer to the PDF document or feel free to contact us.

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Lamp heating test (infrared irradiation test)

We can recreate an environment where the surface temperature of the sample is higher than the ambient temperature!

We will introduce the lamp heating test (infrared irradiation test). In the environmental test chamber, the test sample is placed, and while controlling the ambient temperature in a blown air state, up to seven infrared lamps are used to irradiate light, thereby controlling the temperature of the surface temperature sensor of the sample to be higher than the ambient temperature. For example, it can simulate the stress of being further overheated by sunlight in a car interior that has reached high temperatures during the day. 【Features】 ■ Capable of conducting infrared irradiation tests in a blown air environment within the environmental test chamber. ■ Can recreate an environment where the surface temperature of the sample is higher than the ambient temperature. *For more details, please refer to the PDF document or feel free to contact us.

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One-shot 3D shape measuring device "VR-6200"

With this one device, you can measure various things! It can reproduce cross-sectional shapes without cutting, and it can also measure glossy surfaces!

Aites Co., Ltd. has introduced the KEYENCE manufactured one-shot 3D shape measuring device 'VR-6200'. It comes with an electric rotation unit, allowing for the reproduction of cross-sectional shapes without cutting. The HDR scanning algorithm enables measurement of glossy surfaces as well. From profile measurement to flat measurement, volume area, and comparative measurement, this single device can perform various measurements. 【Measurable Items】 ■ Profile Measurement ■ Flat Measurement ■ Volume Area ■ Line Roughness Measurement ■ Surface (Flatness) Measurement ■ Comparative Measurement *For more details, please refer to the PDF document or feel free to contact us.

  • 3D measuring device

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Tensile test

Testing service for plastic films using a universal testing machine (autograph) in a heated environment!

The "tensile test" is a test that measures the load and displacement (elongation) when a material is pulled at a constant speed, in order to determine the physical and mechanical properties of the material. By pulling the test specimen in a constant temperature chamber, it is possible to determine and understand the temperature dependence of these properties. Our company is capable of conducting material property tests under temperature-controlled environments. We can also propose conditions tailored to the materials and properties you wish to measure. Please feel free to consult with us. 【Test Equipment Specifications】 ■ Constant Temperature Chamber Temperature Range: -40 to 250℃ ■ Load Cell: 50kN, 1kN ■ Load Accuracy: ±1% of load indication value ■ Test Speed: 0.0005 to 1000 mm/min ■ Travel Distance ・Tensile Test Section: 1485 mm *For more details, please refer to the PDF document or feel free to contact us.

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Related catalog(8)

Observation of substrate deformation using a 3D shape measuring machine (VR-6200)

Observation of substrate deformation using a 3D shape measuring machine (VR-6200)

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In-Situ Continuous Measurement Reliability Evaluation Testing Service

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Electronic Components and Semiconductors
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Fukuda's leak test, leak inspection, leak detection, leak test, integrity test.

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  • PRODUCT

Fukuda Co., Ltd. has been pursuing leak detection for 60 years and is committed to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing properties. We will propose the appropriate testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)

Jan 23, 2026

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[Opening on January 6, 2026] New service launched to search for exhibits nationwide.

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We have launched a "Display Item Search Page" that allows you to search for unit houses currently on display at exhibition halls nationwide, which was made available on January 6, 2026. There are over 800 items listed on the website. You can filter by area, price range, size, purpose, product type, color, and more. You can also check exterior and interior photos, prices, facilities, and drawings/specifications online. If you're interested in a display item, you can directly inquire, make a reservation to visit, or consult via LINE. This is a convenient service that allows you to efficiently progress from comparison to detailed consideration. Please take a look!

Jan 23, 2026

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Publication of a paper in Oxford Open Materials Science

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A co-authored paper by Shin Otsuki from the Data Science Department and another author has been published in Oxford Open Materials Science. 【Paper Summary】 Title: The Exploration of Enhanced Methods in Data Science and Applications in Materials Science Authors: Raymond Wu, Shin Otsuki

Jan 23, 2026

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[New Product] Announcement of the High Brightness LED Lighting Box LLBLM-A Series

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  • PRODUCT

"With high-precision dimming settings of 256/1000 gradations, you can achieve your desired results." The new 1-channel dedicated model LLBLM-A maximizes the performance of high-brightness LEDs. It offers high light stability through constant current control and flexibly accommodates a wide range of inspection and lighting applications with three types of interfaces: parallel, RS232C, and LAN. In addition to intuitive operation via the front panel, it supports high-precision dimming with 256/1000 gradations (256 gradations in parallel mode). The available emission colors are G (green) and B (blue). This new model balances stable light output with ease of use. For more details, please feel free to contact us.

Jan 23, 2026

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All participants chant for safety.

The Winter Safety Conference for the 7th year of Reiwa was held.

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Last month, we held a winter safety conference organized by our company. We have compiled the details and atmosphere of the day, as well as information on winter labor accidents, into a PDF. We would appreciate it if you could take a moment to read it.

Jan 23, 2026

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