We have introduced a dicing machine at the Higashi-Osaka factory.

We have introduced the latest dicing cutting machine at the Higashi-Osaka factory of Adachi New Industry Co., Ltd. With this new equipment, Adachi New Industry Co., Ltd. can now achieve in-house processing from the design of optical thin films and metal pattern processing to film formation, etching, lift-off pattern processing, and chip creation, all in a consistent manner. We will strive to meet your expectations by aiming for even higher quality, precision, and stable supply.
■Specifications
Maximum work size: φ8 inches (up to 141×141mm)
Minimum cut size: 3×3 mm
*We will achieve processing of even smaller sizes in the future.
■Processable substrates
- Optical glass substrates (B270, D263, blue plate, quartz, etc.)
- Silicon wafers
*We also plan to gradually increase the types of processable substrates in the future.

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