About the curing temperature of epoxy resin free from hazardous substances.

We conducted measurements to reconfirm the temperature at which heat is generated during hardening!

We conducted measurements to reconfirm the temperature of heat generation during curing, following the change to a non-toxic epoxy resin. When using a large amount of resin, we apply heat prevention treatment for resin embedding. Without this treatment, the temperature can rise to 138°C during curing. However, with the heat prevention treatment applied, we were able to keep the heat generation during curing to within 30°C, even with a large amount of resin. 【Measurement Results】 ■ Without heat prevention treatment for a large amount of resin (large container) - Heat generation reached up to 138°C during curing. ■ With heat prevention treatment for a large amount of resin (large container) - Heat generation during curing was kept within 30°C. *For more details, please download the PDF or feel free to contact us.

• Other measurement, recording and measuring instruments

By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, it is important to observe not only the shape but also the metal structure.

• Contract Analysis
• Contract measurement
• Other contract services

We undertake contract processing and manufacturing of cross-sections of various parts and materials.

At Aites, we undertake contract processing of cross-sections of various components and materials, including electronic components, mounted circuit boards, semiconductors, compound semiconductors, power devices, films, resin molded products, solar panels, and LCD glass. We also conduct observation and analysis of the produced cross-sections, providing contract analysis for defect analysis and quality evaluation. 【Service List】 ■Mechanical polishing ■CP processing ■Microtome ■FIB processing ■Analysis of semiconductor diffusion layers, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices
• Analysis Services

We will introduce the pre-treatment for cross-sectional observation using devices for sample cutting, such as band saws!

We would like to introduce the sample preparation (sample cutting and resin embedding) for cross-sectional observation conducted by Aites Co., Ltd. We use cutting equipment suitable for cutting large substrates and thick components, such as the band saw "HOZAN K-100" and the IsoMet "Buehler Low Speed Saw." With the "HOZAN K-100," samples up to approximately X150mm, Y230mm, and Z70mm in size can be cut. Additionally, after cutting, the samples are embedded in epoxy resin or similar materials, but it is also possible to embed in resin before cutting. 【Product Lineup】 ■ Band Saw ■ IsoMet ■ Multifunctional Diamond Wire Saw *For more details, please refer to the PDF document or feel free to contact us.

• others

Each part is carefully polished by hand, using an efficient process without waste!

Our company specializes in "cross-section polishing of implemented components and electronic parts." To quickly provide suitable cross-section samples for the observation of various components, we carefully polish each part by hand, using an efficient process without waste. Please feel free to contact us for more information. 【Features】 ■ Quickly providing suitable cross-section samples for the observation of various components ■ Carefully polishing each part by hand, using an efficient process without waste *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Surface treatment contract service
• Other contract services

Even with larger-sized implementation boards, resin embedding is possible without cutting before embedding! We will introduce cases with and without heat generation prevention treatment.

Epoxy resin is transparent, has a low shrinkage rate, and is often used for making cross-sections. However, since it is a thermosetting resin, it generates heat during the curing process. The temperature of heat generation varies depending on the amount used and the mixing ratio of the main agent and hardener. When embedding large samples such as printed circuit boards and touch panels, the epoxy resin can generate enough heat to deform the sample substrate. Therefore, we investigated how much heat is actually generated during curing. For more details, please refer to the PDF download below. 【Overview】 ■ Temperature profile acquisition - Without heat prevention treatment for a large amount of resin (large container) ■ Temperature profile acquisition - With heat prevention treatment for a large amount of resin (large container) ■ Resin embedding is possible even for larger printed circuit boards without cutting before embedding. *For more details, please refer to the PDF document or feel free to contact us.

• Analysis Services
• Other contract services

Calculating the crack rate of ball joints and implementing it according to customer specifications!

After the solder durability test on the circuit board, if cracks occur in the solder joints, the crack rate will be calculated to confirm whether the cracks are within the allowable standards. The evaluation standards after the solder durability test can be individually defined based on the product environmental specifications, so most customers have their own standards. The measurement methods vary according to the shape of the components, but when you make a request, we will carry out the tests according to your specifications. 【Service Contents】 ■ Solder joints of BGA - Calculation of crack rate for ball joints ■ Solder joints of chip resistors - Calculation of crack rate for both ends of square and rectangular terminals ■ Solder joints of coil components - Calculation of crack rate for ribbon leads and QFP leads *For more details, please refer to the PDF document or feel free to contact us.

• Contract measurement

Mechanical grinding allows for a wide range of processing and observation! We will propose appropriate processing and observation methods or combinations.

We will introduce sample processing using mechanical polishing and mechanical polishing combined with ion milling treatment. Mechanical polishing is a common and long-established method for creating cross-sections, allowing for a wide range of cross-sectional production. Additionally, by combining it with ion milling treatment, it is possible to create observation surfaces comparable to those produced by CP processing. At Aites, we propose appropriate processing and observation methods or combinations based on our accumulated know-how. Please feel free to contact us for consultations or inquiries. 【Features】 ■ Mechanical polishing allows for extensive processing and observation. ■ By repeating mechanical polishing and imaging, three-dimensional observation is possible. ■ Observation at any desired location can be performed based on the constructed 3D image. ■ After mechanical polishing, depending on the sample, observation comparable to that of CP processed samples is possible. *For more details, please refer to the PDF materials or feel free to contact us.

• Analysis Services
• Other contract services

In civil engineering sites such as mountainous areas and construction sites, it may be necessary to use wooden boards on slopes or inclined access roads. Hyper CLT boards are civil engineering materials utilizing wood CLT, which can be laid not only on flat ground but also on sloped terrain. They can be used for temporary roads, access routes, heavy machinery entry paths, and measures against muddy conditions, creating a driving environment that takes advantage of the unique surface characteristics of wood. The 5×10 board weighs approximately 230 kg, and the 5×20 board weighs about 460 kg, making them lightweight and easy to install and remove even with small machinery, which is a notable feature for maneuverability in narrow sites. This wooden board is registered as a technology under the Ministry of Land, Infrastructure, Transport and Tourism's NETIS system as "TH-250021-A," and can also be utilized for safety measures and innovative ideas in public works.

Metal cracks are one of the concerns in equipment maintenance operations. Repairs using conventional welding methods can alter the base material around the crack due to heat, leading to residual stress and deformation, which always carries the risk of "crack recurrence" or "secondary damage." Hinode Waterworks Equipment Co., Ltd.'s "Mechanical Stitching Method" is a new technique that allows for the repair of metal cracks without applying heat. By using special bolts and reinforcement plates, the crack is physically removed without affecting the base material with heat. Repairs can be performed even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. For more details, please contact us or download the catalog.

● The production time for cast prototypes can be shortened! Since model making is not required, the production time for prototypes, which previously took about a month, can be significantly reduced. ● Model costs can be reduced! By directly producing sand molds from 3D data, there is no need for model production costs. If changes to the model are necessary, they can be addressed by modifying the 3D data. ● Similar products with different shapes and dimensions can be prototyped simultaneously! Different products, such as similar shapes or varying dimensions, can be molded at the same time in one molding process. This allows for the verification of multiple types in a short period.

● To determine the sealing and waterproofing of sealed products based on pressure changes, it is not necessary to conduct tests that involve spraying water on the product or immersing it in water. ● Once the product is placed in a dedicated fixture within the inspection device, waterproofing can be quantitatively confirmed through automatic measurement. ● The target product size is W 300 × D 210 × H 100 mm or smaller. ● The target products include automotive cameras, smartphones, ECUs, small motors, and other packaging containers, and are effective for any products that require confirmation of sealing, waterproofing, and airtightness. ● For product specifications and details, please contact us.

The inspection targets of the "MSX-7003 series" are relatively large electronic devices. 【Inspection Targets】 - LED - Optical devices - High-frequency devices - Power semiconductors - IR sensors - Gyro sensors - Angular velocity sensors - Electrolytic capacitors, etc. The transport system is designed based on "pallet to pallet" to accommodate various types of work. The following three processes are performed automatically by the airtight inspection device: - Helium bombarding - Gross leak test - Fine leak test For packaged products smaller than 10 mm on each side, the work is set up using pallets or trays, followed by helium bombarding ↓ Then transported to the leak test process through high-speed handling ↓ Going through a continuous process from the gross leak test to the fine leak test ↓ And finally, discharged onto a pallet through high-speed handling. It also supports inline operations (the height of the pass line is 940 mm). Please watch the YouTube video from the link below.