We will be exhibiting at the Image Sensing Exhibition 2025!!

AI smart camera (edge AI) equipped with EVS that detects changes in brightness.

This is a compact and lightweight AI smart camera that adopts Prophesee's EVS (Event-Based Vision Sensor). The EVS captures only changes and events within the scene, achieving extremely high temporal resolution (equivalent to 10K frames) and a wide dynamic range compared to traditional frame-based image sensors, while also reducing data bandwidth. It can be utilized for applications such as spatter/drip monitoring, high-speed motion capture, and intrusion detection under harsh lighting conditions. The core of the system is the NXP Semiconductors AI processor "i.MX 8M Plus," which features up to four 1.8GHz Arm(R) Cortex(R) A53 cores, a 2.25TOPS AI accelerator for edge AI, and an embedded ISP capable of image processing at resolutions up to 13M (including AWB, AE, etc.). *Note: i.MX 8M Plus is a registered trademark of NXP Semiconductors N.V.

• High Speed Camera

USB3.2 10Gbps 8 Megapixel Color Output Model

This is a camera series that is the first from a Japanese manufacturer to adopt a USB 10Gbps interface. - Achieves a maximum transfer speed of 10Gbps - Allows image transmission, camera control, and power supply through a single USB cable - Thoroughly designed for low power consumption, achieving a compact product size - Equipped with our proprietary Clairvu ISP, capable of outputting high-resolution and high-quality color images without consuming external resources such as a PC.

• Color camera

2 million pixel compact AI smart camera

A compact AI smart camera that integrates a high-quality image sensor and image processing. At the core of the system is the NXP Semiconductors AI processor "i.MX 8M Plus," which features up to four 1.8GHz Arm(R) Cortex(R) A53 cores, a 2.25TOPS AI accelerator for edge AI, and an embedded ISP capable of image processing with a resolution of up to 13M (including AWB, AE, etc.). These specifications and compact size make it suitable for various applications such as drone payloads, robot integration, logistics, hand gesture recognition, and security. *i.MX 8M Plus is a registered trademark of NXP Semiconductors N.V.

• Transport and handling robots

VGA-capable compact ToF AI smart camera.

A compact AI smart camera that integrates a high-quality image sensor and image processing. At the core of the system is the NXP Semiconductors AI processor "i.MX 8M Plus," which features up to four 1.8GHz Arm(R) Cortex(R) A53 cores, a 2.25TOPS AI accelerator for edge AI, and an embedded ISP capable of image processing with a maximum resolution of 13M (including AWB, AE, etc.). These specifications and compact size make it suitable for various applications such as drone payloads, robot integration, logistics, hand gesture recognition, and security. *i.MX 8M Plus is a registered trademark of NXP Semiconductors N.V.

• Transport and handling robots

USB3.2 5Gbps 3 million pixels high-speed imaging model

This is a camera series that adopts a USB 5Gbps interface. - Image transmission, camera control, and power supply are possible with a single USB cable. - Thoroughly designed for low power consumption, achieving a small product size. - Offers both monochrome and color models in the lineup.

• Monochrome camera

We will be exhibiting at the "12th Conference of the Advanced Power Semiconductor Subcommittee" held at the Toyama International Conference Center. We will be introducing our latest analysis technology services, so please stop by! We sincerely look forward to your visit.

We will explain the thermal design of power ICs (LDO / DCDC) under the title "Thermal Design of Power ICs (LDO / DCDC)," which is crucial when designing power blocks. The explanation will cover fundamental concepts as well as delve into topics such as PCB layout and design. This webinar is recommended for those currently involved in PCB design and product development. ● Target Audience - Individuals involved in the design, technology, manufacturing, and quality control of various electrical products and power blocks - Those facing challenges or issues related to power ICs that they wish to resolve ● Title Thermal Design of Power ICs (LDO / DCDC) ● Agenda 1. Impact of IC Heat Generation - Definition of Thermal Resistance, etc. 2. Thermal Design of LDO and DCDC - How to Determine Tj 3. Losses, Heat Generation, and Thermal Shutdown of LDO 4. Losses in DCDC 5. Case Studies 6. PCB Design 7. Thermal Design Support 8. Q&A We look forward to your participation.

[Speaker] Yukio Sakaguchi, Representative, Clean Energy Research Institute [Lecture Topics] Part 1: Policy and Market Trends 　(1) Turning Point in Federal Policy 　(2) Shift to State Leadership 　(3) Changes in Power Market Structure 　(4) Transmission Constraints and Storage Demand Part 2: Technological Systems and Industrial Structure 　(1) From Lithium-Ion to Long-Duration Storage 　(2) Modularization and Scalability of BESS 　(3) Supply Chain Restructuring 　(4) Safety and Reliability Challenges Part 3: Business Models and Investment Strategies 　(1) Revenue Structure of Utility-Scale BESS 　(2) New Trends in Corporate PPAs and Distributed Storage 　(3) Structure of Private Capital Entry 　(4) Opportunities for Japanese Companies to Enter Part 4: Q&A / Business Card Exchange *The program may change based on the latest situation.

[Speaker] Shunsuke Suzuki, President and CEO, Management Techniques Co., Ltd. [Lecture Topics] 1. Introduction - Learning from the History of Success and Failure 2. How to Create a Project Concept Note - The Journey from Idea to Realization 3. Planning for Achievement - The Process from Planning to Execution 4. Selecting Engaging Talent - Defining Capability Requirements and Analyzing Talent Portfolios 5. Communication for Persuasion and Promotion 6. Exercises in Thinking Techniques using "Unique Brain Lab®": Mastering sharpened thinking by questioning "Why?" and extracting the essence.

■Date and Time: October 29, 2025 (Wednesday) 15:00-16:00 ■Format: Zoom Webinar ■Cost: Free (Pre-registration required) ■Speaker Information: Molex LLC Japan, Wataru Awazu ■Content: In this webinar, we will introduce high-efficiency, high-current connection solutions for data centers, communication infrastructure, and industrial equipment, along with Molex's latest connector products and case studies. We will clearly explain the features of high reliability, high efficiency, and compact design that meet the demands for high performance and energy savings in equipment. *Please feel free to join via the <Related Links>.