We will be exhibiting at the Image Sensing Exhibition 2025!!

AI smart camera (edge AI) equipped with EVS that detects changes in brightness.

This is a compact and lightweight AI smart camera that adopts Prophesee's EVS (Event-Based Vision Sensor). The EVS captures only changes and events within the scene, achieving extremely high temporal resolution (equivalent to 10K frames) and a wide dynamic range compared to traditional frame-based image sensors, while also reducing data bandwidth. It can be utilized for applications such as spatter/drip monitoring, high-speed motion capture, and intrusion detection under harsh lighting conditions. The core of the system is the NXP Semiconductors AI processor "i.MX 8M Plus," which features up to four 1.8GHz Arm(R) Cortex(R) A53 cores, a 2.25TOPS AI accelerator for edge AI, and an embedded ISP capable of image processing at resolutions up to 13M (including AWB, AE, etc.). *Note: i.MX 8M Plus is a registered trademark of NXP Semiconductors N.V.

• High Speed Camera

USB3.2 10Gbps 8 Megapixel Color Output Model

This is a camera series that is the first from a Japanese manufacturer to adopt a USB 10Gbps interface. - Achieves a maximum transfer speed of 10Gbps - Allows image transmission, camera control, and power supply through a single USB cable - Thoroughly designed for low power consumption, achieving a compact product size - Equipped with our proprietary Clairvu ISP, capable of outputting high-resolution and high-quality color images without consuming external resources such as a PC.

• Color camera

2 million pixel compact AI smart camera

A compact AI smart camera that integrates a high-quality image sensor and image processing. At the core of the system is the NXP Semiconductors AI processor "i.MX 8M Plus," which features up to four 1.8GHz Arm(R) Cortex(R) A53 cores, a 2.25TOPS AI accelerator for edge AI, and an embedded ISP capable of image processing with a resolution of up to 13M (including AWB, AE, etc.). These specifications and compact size make it suitable for various applications such as drone payloads, robot integration, logistics, hand gesture recognition, and security. *i.MX 8M Plus is a registered trademark of NXP Semiconductors N.V.

• Transport and handling robots

VGA-capable compact ToF AI smart camera.

A compact AI smart camera that integrates a high-quality image sensor and image processing. At the core of the system is the NXP Semiconductors AI processor "i.MX 8M Plus," which features up to four 1.8GHz Arm(R) Cortex(R) A53 cores, a 2.25TOPS AI accelerator for edge AI, and an embedded ISP capable of image processing with a maximum resolution of 13M (including AWB, AE, etc.). These specifications and compact size make it suitable for various applications such as drone payloads, robot integration, logistics, hand gesture recognition, and security. *i.MX 8M Plus is a registered trademark of NXP Semiconductors N.V.

• Transport and handling robots

USB3.2 5Gbps 3 million pixels high-speed imaging model

This is a camera series that adopts a USB 5Gbps interface. - Image transmission, camera control, and power supply are possible with a single USB cable. - Thoroughly designed for low power consumption, achieving a small product size. - Offers both monochrome and color models in the lineup.

• Monochrome camera

Nitto Kohki will hold the "2024 Attack Fair in Ichihara" at the "Yume Hall" for two days from December 11 (Wednesday) to December 12 (Thursday), 2024. The Attack Fair is an exhibition where you can actually "see, touch, and operate" Nitto Kohki's products. Additionally, there will be wonderful souvenirs for visitors and many fun activities prepared. We look forward to welcoming everyone!

Nitto Kohki will hold the "2025 Attack Fair in Kurume" at the "Local Production Kurume General Exhibition Hall" for two days from February 13 (Thursday) to February 14 (Friday), 2025. The Attack Fair is an exhibition where you can actually "see, touch, and operate" Nitto Kohki's products. Additionally, there will be wonderful commemorative gifts for visitors and many fun activities prepared. We look forward to welcoming everyone!

**Seminar Overview** The construction industry faces many challenges, including a shortage of personnel, regulations on maximum working hours, and the need for efficiency improvements. Additionally, the transmission of skills due to an aging workforce has become a significant issue, with a high turnover rate among younger employees who are supposed to carry on these skills. In this seminar, we will discuss the causes of turnover based on case studies and explain key points on how to reduce turnover rates by advancing IT integration.

**Seminar Overview** "Generative AI," which is gaining attention as a method for improving business efficiency and utilizing internal digital transformation (DX), can be influenced by the literacy of the employees using it, potentially increasing the burden of work instead. In this seminar, we will discuss the current challenges of generative AI while providing examples of how it can be used to enhance business efficiency. We will also explain how to utilize generative AI in a way that achieves efficiency without being dependent on the user's skills. We hope this will serve as a reference for considering the use of generative AI.

**Seminar Overview** The reality that young members leave their jobs due to miscommunication with their superiors occurs in every industry. This is also true in the construction industry. The long-standing issues of labor shortages, regulations on working hours, and the challenges of passing on skills due to an aging workforce are significant problems. However, the misalignment in communication with young employees, who are supposed to be receiving this knowledge, may actually worsen the situation. In this seminar, we will discuss the causes of communication gaps as seen through case studies, and talk about methods for skill transfer, knowledge accumulation, and smooth internal communication using IT tools.