Added 'Metallization and Patterning Technology for Diamond Substrates' as a technical trend keyword.

Diamond is the ultimate semiconductor material, expected to be applied in next-generation power devices, high-frequency devices, and quantum sensors, due to its unparalleled properties such as exceptional thermal conductivity, high dielectric breakdown strength, and wide bandgap. However, to realize these devices, it is essential to have "metallization" technology to form electrodes and wiring on diamond substrates, as well as "patterning" technology to process them into fine circuit patterns. Because diamond is a chemically extremely stable and hard material, there are unique challenges in adhering metal films to its surface and performing precise processing.
1. Characteristics of diamond substrates and the importance of metallization
2. Metallization process
3. Patterning process
4. Technical challenges and future prospects
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