We will exhibit at "SEMICON Japan 2025."

Excellent adhesive performance even on thin films, achieving both high adhesive strength and workability. Replacement from glue to the film contribute to improve efficiency of manufacturing

The conventional liquid type adhesive has high adhesion strength and high heat resistance, however, its workability is an issue in comparison with adhesive tape. TOMOEGAWA's adhesive film contributes to improving workability while maintaining high adhesive strength and heat resistance, by molding to sheet form with thermo-setting adhesive by our own developed process. Can be customized according to the customer's request (adhesive strength, adhesive thickness, curing condition, etc.) Example: Short time curing type (At 180°C for 6 minutes, a peel strength of 10N/cm is achieved for aluminum and stainless steel.） [Features] - Available in thin films (Min.5μm), contributing to low-profile and low thermal resistance of parts. *Please contact us for thickness of less than 5 μm. - Replacement from glue to the film contributing to reduce the use of solvent in manufacturing site - Sheet type provides eliminating the need for care against overflow and coating amount control, which are required for liquid type adhesive. - Can be stored at room temperature [Application] - Passive parts (chip resistor, etc.) - Automotive parts - Circuit substrate materials such as FPC and FFC - Various equipment parts and jigs

• Other polymer materials

Combines the heat resistance and electromagnetic shielding of stainless steel with the flexibility and processability of paper

A sheet made entirely of stainless steel fibers, produced using advanced papermaking technology. We offer functional sheets that combine stainless steel’s heat resistance and electromagnetic shielding with the flexibility and processability of paper. [Features] 1. Heat resistance, corrosion resistance, and chemical resistance - Superior heat and chemical resistance of stainless steel for harsh environments such as automotive and outdoor applications 2. Electrical resistance control - Electrical resistance controlled through basis weight and thickness adjustment - Sheet heater functionality through conductivity - Uniform surface heating capability 3. Electromagnetic shielding - Lightweight, thin, and flexible electromagnetic shielding material leveraging stainless steel properties 4. Flexibility like paper - Durable sheet maintaining performance in bent configurations 5. Customized shape processing - Easy workability with scissors - Shape processing such as bending and forming - Various coating surface treatment

• Non-ferrous metals
• stainless
• Other metal materials

Planar heater that use Stainless Fiber Sheet. It conforms closely to the part to be heated, so efficient heat transfer is possible.

[Features] - Planar heater that use Stainless Fiber Sheet - Efficient heat transfer because of close-fitting of heater and object to be heated due to high flexibility - Able to fit closely to complex shape such as piping, and is able to be wrapped around the object to be heated - Quick heating and cooling due to the porous structure - Uniform heat generation due to unique metal fiber sheet [Application] - Various equipment - Devices that use heater (curve surfaces, narrow region) etc. This product is designed and customized optimally to meet client's requirements. Please share your requirements with us.

• stainless

High-heat resistance tape can be used up to 350 °C. It is suitable for temporary fixing of electronic parts manufacturing process.

iCas F-TR has unique characteristics to increase adhesion temporary by heating then to reduce adhesion strength by continuing heating. Therefore, even under high-temperature environments, the tape adheres firmly to the substrate and can be easily removed after the process has been completed without leaving any adhesive residue. In addition, since additional process such as heating or UV irradiation is not required when peeling off the tape, it is also possible to improve work efficiency. The tape is suitable for temporary fixing applications in manufacturing process of electronic parts, etc. [Features] - Capable to adhere to various materials at room temperature (Ex. copper, gold, alumina, silicon, etc). - Compatible with reflow process and dry/wet process such as plasma flux cleaning. - Able to be peeled off at room temperature after heat treatment process (thermal peeling is possible). - Possesses superior chemical resistance against various chemicals such as toluene, THF, IPA, etc. - Designed as PFAS-Free formulation. [Application] - Components carrier tape in the manufacturing process. - Temporary fixing to backside of substrates such as silicon, glass, alumina for FO-WLP. - Masking use under high temperature environment (plating, soldering, thermal spraying, etc.) - Preventing mold resin bleed of lead frame package.

• Other polymer materials
• Other consumables

Zaltrius Japan will be exhibiting at the 98th Annual Meeting of the Japanese Society for Tissue Culture. ◼ Date: August 27 (Thursday) - 28 (Friday), 2026 ◼ Location: 2-8-35 Tai-machi, Nagaoka City, Niigata Prefecture, Hotel New Otani Nagaoka, Venue for the 98th Annual Meeting of the Japanese Society for Tissue Culture ◼ Booth: No. 11 ◼ Exhibited Products: Polyplus High-Efficiency Transfection Reagents NexaGel 3D Cell Culture Matrix Research Growth Factors and Cytokines Basic Cell Culture Media and Reagents Picus 2 Electronic Pipette We have a selection of products recommended for those considering improving research reproducibility and establishing 3D culture environments. Please come and see the actual products and applications at the venue. We look forward to your visit!

We are pleased to announce a co-hosted seminar with Live Consulting Co., Ltd. "Practical Seminar on Microsoft Copilot for Executives and Managers in the Manufacturing Industry" "The new AI tools are no longer needed." This seminar will allow you to experience Microsoft Copilot, which can be used directly within your usual Word, Excel, and Teams, through a demonstration of the actual operation screen. The answers are already within your existing Microsoft 365. You can use AI directly in Word, Excel, and Teams without the need for additional tool selection or new investments, all within the security framework of M365. We will explain the basics to practical applications of Copilot in 90 minutes, specifically for executives and managers in the manufacturing industry. We sincerely look forward to your participation. [Recommended for the following individuals] - Executives and managers in the manufacturing industry who have not yet mastered generative AI/Copilot - Those considering AI implementation but are stalled due to tool selection, security, or promotion systems - Individuals who prefer to see the "actual screen" rather than just "reading" about it - Those who are unable to use ChatGPT in their company due to security concerns.

We will hold a webinar focused on analytical challenges in the research, development, and quality control of biopharmaceuticals, particularly antibody-drug conjugates (ADCs). We are pleased to invite Professor Yuji Ito from Kagoshima University, who will give a lecture on the latest analytical strategies and practical insights in biopharmaceutical research, including ADCs. Target Audience: - Researchers, developers, and CMC personnel from pharmaceutical companies, CDMOs, and CROs - Those considering advanced analytical methods for ADCs and antibody drugs - Individuals facing challenges in improving separation performance, reproducibility, or analytical efficiency - Those considering the implementation of MAM and workflow development Lecture 1 [Special Lecture]: Next-Generation Drug Discovery Using DDS with Tissue-Translocating Antibodies - AccumBody Platform and Antibody Conjugate Technology - Professor Yuji Ito, Graduate School of Science and Engineering, Kagoshima University Lecture 2: Latest LC Column Technology to Solve Challenges in ADC and Antibody Analysis Lecture 3: MAM Practice - An Integrated Workflow from Research and Development to Quality Evaluation * This webinar is a restructured version of the content from the on-site seminar held in July 2026.

Fujikogyo Co., Ltd. will exhibit at the "5th Smart Factory EXPO Autumn" held at Makuhari Messe from September 9 (Wednesday) to September 11 (Friday), 2026. On the day, we will showcase the latest FA and robotics products that achieve automation, efficiency, and labor-saving in the field. [Main Exhibited Products] ◇ Collaborative Robot Palletizing System (Elite Robot Co.) A compact design that is mobile and integrated. It enables seamless loading and easy operation via a tablet. ◇ Autonomous Mobile Robot for Pallet Transport (FEXA Co.) A small and agile AMR. It supports fully automated transportation through shutter and elevator coordination and the use of load sensors. ◇ Automatic Sealing Machine for Packing Tape (EXTEND Co.) Compliant with decarbonization and environmental considerations. It can be used with only power, without the need for air, allowing for use without constraints of location or utilities. We will propose solutions that help solve your challenges. Please visit our booth (Hall 2 / A13-36). *Advance registration (free) is required for attendance.

The organization will hold a seminar titled "EMC Performance of In-Vehicle Devices as Considered by Automobile Manufacturers" on September 16, 2026 (Wednesday), featuring lecturers from Toyota Motor Corporation, Hino Motors, Ltd., and Daihatsu Motor Co., Ltd. In addition to presentations from the three companies, a leading expert on in-vehicle device EMC from our organization will introduce the latest topics. Furthermore, after the seminar, a technical exchange meeting will be held, allowing participants, lecturers, and our organization's technical staff to exchange information. In recent years, the acceleration of autonomous driving, connectivity, and electrification technologies has been aimed at achieving carbon neutrality and evolving mobility. Within this context, it is anticipated that the demands for EMC in electric vehicles (xEV) and fuel cell vehicles (FCV), particularly regarding the electrification of powertrains and EV components, will be stronger than ever. In this seminar, we will invite EMC experts from automobile manufacturers to explain the latest trends in standards regarding the "EMC performance required for in-vehicle devices" to suppliers. We encourage you to take advantage of this opportunity.