We exhibited at the New Technology Creation Exchange Meeting 2025.

VGA-capable compact ToF AI smart camera.

A compact AI smart camera that integrates a high-quality image sensor and image processing. At the core of the system is the NXP Semiconductors AI processor "i.MX 8M Plus," which features up to four 1.8GHz Arm(R) Cortex(R) A53 cores, a 2.25TOPS AI accelerator for edge AI, and an embedded ISP capable of image processing with a maximum resolution of 13M (including AWB, AE, etc.). These specifications and compact size make it suitable for various applications such as drone payloads, robot integration, logistics, hand gesture recognition, and security. *i.MX 8M Plus is a registered trademark of NXP Semiconductors N.V.

• Transport and handling robots

2 million pixel compact AI smart camera

A compact AI smart camera that integrates a high-quality image sensor and image processing. At the core of the system is the NXP Semiconductors AI processor "i.MX 8M Plus," which features up to four 1.8GHz Arm(R) Cortex(R) A53 cores, a 2.25TOPS AI accelerator for edge AI, and an embedded ISP capable of image processing with a resolution of up to 13M (including AWB, AE, etc.). These specifications and compact size make it suitable for various applications such as drone payloads, robot integration, logistics, hand gesture recognition, and security. *i.MX 8M Plus is a registered trademark of NXP Semiconductors N.V.

• Transport and handling robots

8-megapixel compact AI smart camera

A compact AI smart camera that integrates a high-quality image sensor and image processing. At the core of the system is the NXP Semiconductors AI processor "i.MX 8M Plus," which features up to four 1.8GHz Arm(R) Cortex(R) A53 cores, a 2.25TOPS AI accelerator for edge AI, and an embedded ISP capable of processing images with resolutions up to 13M (including AWB, AE, etc.). These specifications and compact size make it suitable for various applications such as drone payloads, robot integration, logistics, hand gesture recognition, and security. *i.MX 8M Plus is a registered trademark of NXP Semiconductors N.V.

• Transport and handling robots

A compact AI smart camera with dual lenses capable of measuring distance and acquiring RGB information.

A compact AI smart camera that integrates a high-quality image sensor and image processing. It uses a SONY ToF sensor and an onsemi GS sensor. At the core of the system is the NXP Semiconductors AI processor "i.MX 8M Plus," which features up to four 1.8GHz Arm(R) Cortex(R) A53 cores, a 2.25TOPS AI accelerator for edge AI, and an embedded ISP capable of processing images with a resolution of up to 13M (including AWB, AE, etc.). These specifications and compact size make it suitable for various applications such as drone payloads, robot integration, logistics, hand gesture recognition, and security. *i.MX 8M Plus is a registered trademark of NXP Semiconductors N.V.

• Transport and handling robots

AI smart camera (edge AI) equipped with EVS that detects changes in brightness.

This is a compact and lightweight AI smart camera that adopts Prophesee's EVS (Event-Based Vision Sensor). The EVS captures only changes and events within the scene, achieving extremely high temporal resolution (equivalent to 10K frames) and a wide dynamic range compared to traditional frame-based image sensors, while also reducing data bandwidth. It can be utilized for applications such as spatter/drip monitoring, high-speed motion capture, and intrusion detection under harsh lighting conditions. The core of the system is the NXP Semiconductors AI processor "i.MX 8M Plus," which features up to four 1.8GHz Arm(R) Cortex(R) A53 cores, a 2.25TOPS AI accelerator for edge AI, and an embedded ISP capable of image processing at resolutions up to 13M (including AWB, AE, etc.). *Note: i.MX 8M Plus is a registered trademark of NXP Semiconductors N.V.

• High Speed Camera

A lineup of 2M, 4K, ToF, ToF+RGB, and EVS sensors! Suitable for various applications such as drones, embedded robots, logistics, and security.

The "SCM Series" is a compact smart camera that integrates high-quality image sensors and image processing. By combining the image sensor and image processing, it enables real-time processing within the camera, making it an edge AI camera. At the core of the system is the AI processor "i.MX 8M Plus" from NXP Semiconductors, which features up to four 1.8GHz Arm Cortex A53 cores, a 2.25TOPS AI accelerator for edge AI, and an embedded ISP capable of image processing with resolutions up to 13M (including AWB, AE, etc.). Due to these specifications and its compact size, it can be utilized in various applications such as drone payloads, embedded robotics, logistics, and security, where payload is a priority. 【Features】 ■ Models equipped with 2M, 4K, ToF, ToF+RGB, and EVS (Event Vision Sensor) are available. ■ Equipped with the AI processor "i.MX 8M Plus." *Note: i.MX 8M Plus is a registered trademark of NXP Semiconductors N.V.

• Color camera

USB3.2 5Gbps 3 million pixels high-speed imaging model

This is a camera series that adopts a USB 5Gbps interface. - Image transmission, camera control, and power supply are possible with a single USB cable. - Thoroughly designed for low power consumption, achieving a small product size. - Offers both monochrome and color models in the lineup.

• Monochrome camera

We would like to express our congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will be showcasing a number of products, including our new product, the Packaging Container Air Leak Test (Pin Hole Inspection) Device | MSQ-2003 series. We sincerely apologize for the inconvenience during your busy schedule, but we would like to cordially invite you to attend this event. 【 Trade Show Name 】 【 Dates 】 【 Venue/Booth Number 】

We will showcase our new product "BLFF," a palletizing foam gripper that weighs only 1.9 kg and measures 350mm×250mm, ideal for bulk picking. We will also introduce various products that cater to different work applications, including durable suction cups and solutions for bag handling. Additionally, we are implementing energy-saving proposals by replacing ejectors to reduce compressed air consumption, which has become a challenge in many industries. If you have any issues with adhesion or transport, please feel free to consult with us at the venue. ■ Lightweight Foam Gripper for Collaborative Robots "CVGC Series" Despite weighing only 1.9 kg, this gripper has a theoretical lifting force of 100 kg, maximizing the payload capacity of collaborative robots. ■ Gripper for Films This gripper is designed to transport thin films gently, minimizing marks left on the surface. By utilizing 3D printing, we can accommodate highly flexible shape designs tailored to specific workpieces and applications. ■ Energy Saving Comparison Panel "Why does a single ejector consume less compressed air compared to a multi-stage ejector?" You can actually verify the differences in compressed air consumption through a comparative display using a flow meter and actual equipment.

We will be exhibiting at Smart Factory JAPAN, held at Tokyo Big Sight from November 18 (Wednesday) to November 20 (Friday), 2026. We will introduce the 'Dr. Process Navi Series', 'Dr. Mold Cloud', and AI solutions that integrate with both products! <Introducing the latest solutions that innovate productivity in manufacturing sites!> ● 'Dr. Process Navi' Series ● 'Dr. Mold Cloud' ● 'AI Solutions' For more details, please check the related products. ■■ Smart Factory JAPAN 2026 Overview ■■ Dates: November 18 (Wednesday), 19 (Thursday), 20 (Friday), 2026 Opening Hours: 10:00 AM - 5:00 PM Venue: Tokyo Big Sight, East Hall 1-3 Our Booth Number: F-20 Registration: Nikkan Kogyo Shimbun 6 Exhibition Joint Site When visiting, please register in advance from your My Page and bring a printed admission ticket. Business meeting requests are also possible, so please make use of this opportunity.

We will be exhibiting at the Monozukuri World Fukuoka Design and Manufacturing Solutions Exhibition, held at Marine Messe Fukuoka from December 2 (Wednesday) to December 4 (Friday), 2026. We will introduce the 'Dr. Process Navi Series', 'Dr. Mold Cloud', and AI solutions that help improve efficiency and reform in manufacturing sites! <Introducing the latest solutions that innovate productivity in manufacturing sites!> ● 'Dr. Process Navi' Series ● 'Dr. Mold Cloud' ● 'AI Solutions' For more details, please check the related products. ■■ Overview of the 4th Monozukuri World Fukuoka Design and Manufacturing Solutions Exhibition ■■ Dates: December 4 (Wednesday), 5 (Thursday), 6 (Friday), 2026 Opening hours: 10:00 AM to 5:00 PM Venue: Marine Messe Fukuoka Our booth number: 14-18 When visiting, please register in advance through the dedicated page and bring your printed visitor badge.

[Lecture Topics] 1. Trends and Business Opportunities in Japan's Expanding Energy Storage Industry Koichiro Danno, Principal and Head of Social and Policy Design Unit, Research and Consulting Division, Japan Research Institute, Inc. 1. Background Necessitating Energy Storage Business 2. Behind the Meter (BTM) Business and In Front of the Meter (IFM) Business 3. Trends in Japan's Energy Policy Related to Energy Storage 4. Current Revenue Models in Japan 5. Verification of Profitability in Energy Storage Business 6. Summary 7. Q&A 2. Expansion of Grid-Scale Energy Storage Business in Europe and Japan and Future Prospects Takayuki Ogawa, Executive Officer, Deputy Head of Business Strategy Division, Japan Kogyo Energy Solutions, Inc. and Executive Director, Nippon Koei Energy Europe B.V. 1. Overview of the Company and Introduction to Energy Business 2. Efforts in Energy Storage Business in Europe 3. Efforts in Energy Storage Business in Japan 4. Role and Importance of Aggregators 5. Challenges and Future Prospects of Grid-Scale Energy Storage Business 6. Summary 7. Q&A