"Why is heat-dissipating silicone essential now?" has been added to AD-Chemi.
As the high integration, miniaturization, and high output of semiconductor devices rapidly advance, "thermal management" has become one of the most critical parameters that directly affects product reliability, lifespan, and safety, rather than being a secondary design issue.
With the miniaturization of transistors, current density has been increasing year by year, and in the power device sector, the widespread adoption of SiC and GaN has led to higher allowable operating temperatures, while heat generation density (W/cm²) has certainly risen. As a result, issues such as increased junction temperature, the emergence of hotspots, and stress concentration due to temperature gradients have become more serious problems than ever before. For example:
- Power modules in EVs and charging infrastructure
- High-heat chips in AI accelerators and GPUs
- High-density mounted boards in automotive ECUs
- LED modules with increasing brightness
- Industrial power supplies and inverters
Despite being in different fields, they all share the commonality that we have entered an era where "thermal design determines the performance limits of products." This is not just about lowering temperatures...
For more details, please refer to AD-Chemi.

Inquiry about this news
Contact Us OnlineMore Details & Registration
Details & Registration






