Web Seminar on "Latest Trends in Semiconductor Packaging and Semiconductor Encapsulation Materials" on April 17

A comprehensive and detailed explanation of semiconductor packaging materials, from the basics to the latest technological trends!

"Latest Technological Trends in Semiconductor Packaging and Design/Evaluation Techniques for Semiconductor Encapsulants" [Features of this Book] - Comprehensive and detailed explanations from the basics of semiconductor encapsulants to the latest technological trends! - A wide range of topics including information on encapsulant raw materials such as epoxy resins and hardeners, tips for formulation design, an example of the manufacturing process, reliability evaluation, quality control, and the latest packaging trends! - Practical content based on the experiences of those with practical development experience in semiconductor encapsulants, including both failures and successes! - Introduction of the latest research and development, technological trends, and future prospects based on interviews and other sources! - An essential book for students, young researchers, development researchers, and practitioners! [Structure] Chapter 1: Semiconductor Devices Chapter 2: Semiconductor Packaging Chapter 3: Semiconductor Encapsulants Chapter 4: Evaluation of Encapsulants Chapter 5: Future of Semiconductor Encapsulants

• Other semiconductors
• Technical and Reference Books

Blueprint for the PFAS-free era! A thorough explanation of alternative materials and process optimization for each step, from ArF immersion to CMP and cleaning!

The Future of Semiconductor Manufacturing Worldwide: The Cutting Edge of PFAS-Free Strategies and Next-Generation Alternative Technologies [Features of this Book] - Transforming regulatory risks into opportunities! Presenting trends in PFAS regulations in Europe, the United States, and Asia, along with pathways for restructuring the semiconductor supply chain! - Maintaining equipment performance is key! Evaluating the practicality of PFAS-free materials in equipment components! - A weapon for chemists! What are the performance and introduction benefits of next-generation cleaning and stripping surfactants like POE and APG? - Lessons learned from "Types and Cases of Failure Challenges in PFAS-Free Strategies" to prevent critical yield declines! - An overview of PFAS-free initiatives and specific implementation plans, from piping and temperature control to cleanroom utilities! - Comparative analysis of the risks of short-chain/partially fluorinated derivatives and the characteristics of complete alternative candidates like silicone-based (PDMS) materials! - Practical strategies for engineers! Specific methods and case studies for "process condition optimization" aimed at reducing PFAS dependency! [Structure] 1. PFAS-Free Strategies and Alternative Technologies in the Semiconductor Field 2. Failures and Challenges of PFAS-Free Strategies in the Semiconductor Field 3. PFAS Alternatives in Semiconductor Manufacturing Processes 4. PFAS Alternatives in Manufacturing Equipment and Infrastructure 5. Alternative Candidate Substances and Future Prospects

• Other semiconductors
• Technical and Reference Books

A thorough explanation of semiconductor packaging from the basics to applications!

**Features of this Book** - Thorough explanations from the basics to applications of semiconductor packaging! - Detailed discussion on the noteworthy 2.5D/3D packaging and chiplet technology! - Introduction of valuable practical knowledge cultivated by the author over many years in the field! - Explanation of specific examples of defects and evaluation/analysis methods during prototyping and development! - What are the efforts towards RoHS and PFAS in response to environmental regulations? - A book that looks towards the future of semiconductor packaging! **Table of Contents** Part 1: Basics of Backend Processes, Assembly, and Design in Semiconductor Manufacturing 1. Introduction 2. Basics of Semiconductor Packaging - Evolution and Development of Packaging 3. Packaging Process (Representative Examples) 4. Technologies and Key Points of Each Manufacturing Process 5. Testing Processes and Their Key Points 6. An Example of Assembly and Implementation-Related Defects Experienced in the Past 7. Examples of Evaluation and Analysis Methods During Prototyping and Development 8. RoHS and Green Compliance 9. Future of 2.5D/3D Packaging and Chiplet Technology 10. Conclusion Part 2: Integration of Existing Chips through Chiplet Technology: Advantages, Disadvantages, and Technical Challenges Part 3: PFAS in Semiconductor Backend Processes *For a detailed table of contents, please refer to the related link URL.*

• Other semiconductors
• Technical and Reference Books
• others

Analyze industry and market trends in semiconductors, focusing on chiplet technology, advanced packaging technology, chiplet packaging technologies, materials, and equipment configuration!

【Features of this Book】 - Characteristics required for glass substrates for semiconductor packages and trends in the development of glass interposers! - Advantages and disadvantages of backside power supply technologies from the three major semiconductor manufacturers, their business strategies, and mass production timelines? - Business strategies of foundries, EMS, fabless companies, OSAT, and semiconductor manufacturing equipment-related companies! - Characteristics and applications of 2D and 3D implementations using chiplets for heterogeneous integration! - Material properties required for 2.5D and 3D packages! Including redistribution layers, encapsulants, underfills, etc.! - Types of manufacturing processes for FOWLP/PLP, related companies, and requirements for package component mounting! - Intensifying global competition for HBM market share and the business opportunities for Japanese companies that accompany it! - Performance and technology trends required for underfills, market forecasts, and company-specific shares explored! - Design and quality requirement levels to accommodate chipletization in the manufacturing of copper-plated wiring! 【Table of Contents Structure】 Part I: Introduction to Chiplets Part II: Advanced Packaging Technologies Part III: Technologies, Materials, and Equipment for Chiplet Packaging *For a detailed table of contents, please refer to the related link URL.

• Other semiconductors
• Semiconductor inspection/test equipment
• Other semiconductor manufacturing equipment

Dear Sir or Madam, We hope this message finds you well and that your company continues to prosper. FUKUDA will be exhibiting at the AUTOMOTIVE ENGINEERING EXPOSITION 2026 YOKOHAMA. At this exhibition, we will be showcasing testing equipment such as Air Leak Tester for EV and Equipment Mounted Type Hydrogen Leak Detector. We sincerely hope you will take this opportunity to visit us. Yours sincerely, [Official Site] https://aee.expo-info.jsae.or.jp/en/yokohama/ [DATES] Wednesday, May 27, through Friday, May 29, 2026 10:00 a.m. - 5:00 p.m. [VENUE] PACIFICO Yokohama, Exhibition Hall, Booth No. ２７４ ※Online Exposition Website：Tuesday, May 19, through Tuesday, June 9, 2026

In this seminar, we will explain how to visualize business processes organized with BPMS using Tableau, focusing on the establishment of business improvements, the unification of processes across departments, and methods for organizing operations before utilizing AI. While DX promotion and AI utilization are advancing, we are seeing an increase in consultations regarding the challenge of "inability to sustain improvements" due to issues such as: - Business flows differing by department - Improvement activities being dependent on individuals - Time-consuming approval and confirmation processes In this seminar, we will visualize the entire process from production preparation to shipment and introduce methods to quantitatively evaluate and measure "how much productivity has improved (such as lead time reduction, cost reduction, and increased operational rates)" through improvement measures. This is a must-see for those aiming for "overall optimization of the factory" and "resolution of supply chain stagnation." This content is an archived broadcast of the co-hosted webinar with "Salesforce Tableau," which was held last July and received positive feedback. Participants who respond to the survey after viewing will receive an excerpt of the presentation materials as a gift. [For registration and details, click here] https://www.earthlink.co.jp/seminar/10757/

We are utilizing Abby for the presentation paper. We will hold an online seminar featuring a presentation by Professor Ryusuke Niwa from the Center for Survival Dynamics Research at Tsukuba University, focusing on physiological genetics. The seminar will introduce examples of overcoming technical challenges in the analysis of bioactive proteins in small insects, such as fruit flies and their parasitoid wasps, through the implementation of simple Western techniques. Related papers on the lecture content: * Sandwich ELISA using newly generated monoclonal antibodies quantifies circulating neuropeptide F in Drosophila melanogaster * Parasitoid wasp venoms degrade Drosophila imaginal discs for successful parasitism

Takaya Corporation will participate in the "Ibara Work Experience Festival 2026" organized by Ibara City and the Ibara City Board of Education. This event aims to deepen the understanding of diverse jobs and industries in the region among a wide range of generations, especially children. At our booth, we are planning hands-on content that allows participants to experience the charm of manufacturing and the fun of technology. The activities are designed for families to enjoy together, so please be sure to stop by the Takaya Corporation booth.

We will be exhibiting at "TECHNO×FRONTIER 2026," which will be held at Tokyo Big Sight from July 15 (Wednesday) to July 17 (Friday). Our company will be exhibiting as the Resin Processing Division and New Business Development Office at the booth of Maruzen Pharmaceutical Industry Co., Ltd. Please come and see our products and technologies at the venue. We sincerely look forward to your visit. ■ Exhibition Name TECHNO×FRONTIER 2026 (39th EMC and Noise Control Technology Exhibition) ■ Dates July 15 (Wednesday) to July 17 (Friday), 2026 ■ Venue Tokyo Big Sight, West Hall 1 to West Hall 3 ■ Exhibition Location Inside the booth of Maruzen Pharmaceutical Industry Co., Ltd. ■ Exhibited Products - Electromagnetic Shielding Coating (Y-Shield) - Resin Coating (Chrome, Dark, Satin, Satin Dark)