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  1. Home
  2. Resin/Plastic
  3. 積水テクノ成型 新事業開発部
  4. 2026 Yokohama Automotive Technology Exhibition Participation
SEMINAR_EVENT NEW
  • Apr 08, 2026
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Apr 08, 2026

2026 Yokohama Automotive Technology Exhibition Participation

積水テクノ成型 積水テクノ成型 新事業開発部
We will be exhibiting at the 2026 Automotive Technology Exhibition. We will showcase "Heat Dissipation and Electromagnetic Wave Shielding Resin Molding Products." If you have time, we would be delighted if you could stop by our booth. We will provide explanations while you can touch the actual products. Official website 2026 Automotive Technology Exhibition YOKOHAMA https://aee.expo-info.jsae.or.jp/ja/yokohama/
Date and time Wednesday, May 27, 2026 ~ Friday, May 29, 2026
10:00 AM ~ 05:00 PM
Capital Pacifico Yokohama Exhibition Hall 285 (inside the Sekisui Chemical booth)
Entry fee Free
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サムネイル:放熱EMC用_納品版.jpg

Contributing to Sekisui's development products [heat dissipation, EMC, and weight reduction measures]!

Developed a resin that balances heat dissipation and electromagnetic wave shielding! Achieved approximately 45% weight reduction by converting from metal to resin.

With the electrification of automobiles, the challenge is to "lighten the body and extend the driving range," and the demand for lightweight materials is significantly increasing across the industry. Sekisui Techno Molding's approach contributes to weight reduction and cost savings by converting metal to resin. In cases of the same shape, this results in approximately 45% weight reduction compared to metal. While many resin products show a significant decrease in heat dissipation and are inferior in controlling electromagnetic waves (noise) compared to metal, Sekisui Techno Molding's resin products ensure these functions. - Heat Dissipation Focused Type - ■ Heat Conductive Resin Molded Products - Reduction of product temperature rise due to heat diffusion - Weight reduction, improved design flexibility, and mass production by replacing metal products - Heat Dissipation and Electromagnetic Wave Shielding Compatible Type - ■ Heat Dissipation and Electromagnetic Wave Shielding Resin Molded Products - Reduction of product temperature rise due to heat diffusion - Electromagnetic wave shielding performance through conductivity - Weight reduction, improved design flexibility, and mass production by replacing metal products

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Lightweighting and cost reduction through the use of plastics around automotive ECUs [ECM measures].

Currently, metal housings/cases are mainstream for vehicle-mounted ECUs. By changing this to resin, weight reduction and cost savings can be achieved.

In-vehicle ECUs typically use metal cases made of aluminum or copper. While metal shielding ensures robustness and excellent EMC measures, it poses significant challenges in terms of weight and cost. With the electrification of vehicles, the imperative of "how to lighten the body and extend the driving range" is unavoidable, and the demand for lightweight solutions is high. Sekisui Techno Molding's approach enables weight reduction by converting from metal to resin (approximately 45% reduction for the same shape). It also allows for design freedom through resin molding and cost reduction via mass production. While many resin products are inferior to metals in terms of heat dissipation and electromagnetic wave (noise) control, Sekisui Techno Molding's resin products ensure these functions. ■ Thermally conductive resin molded products (focused on heat dissipation) - Reduction of product temperature rise through heat diffusion - Weight reduction, improved design freedom, and mass production by replacing metal products ■ Heat dissipation and electromagnetic wave shielding resin molded products (balancing heat dissipation and electromagnetic wave shielding) - Reduction of product temperature rise through heat diffusion - Electromagnetic wave shielding performance through conductivity - Weight reduction, improved design freedom, and mass production by replacing metal products With Sekisui Techno Molding's comprehensive system, we consistently support our customers from planning and prototype development/verification to mass production and sales to realize their ideals.

  • plastic

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emc2.png

Injection-molded resin optimal for heat dissipation and EMC measures for various EV-related automotive components.

If it is a heat-dissipating and electromagnetic wave shielding resin molded product, EMC measures essential for e-Axle and on-board chargers (OBC) can also be achieved.

The electrification of automobiles requires EMC design that is more conscious of "emissions (electromagnetic interference/EMI)" and "immunity (electromagnetic susceptibility/EMS)" because they operate at high voltage and large current compared to ICE vehicles. Additionally, the challenge of "how to reduce vehicle weight and extend driving range" has become a key issue, leading to a significant increase in the demand for lightweight solutions across the industry. Sekisui Techno Molding's approach involves lightweighting through the conversion from metal to resin, which also contributes to cost reduction. In cases of the same shape, this results in approximately 45% weight reduction compared to metal. While many resin products suffer from significantly reduced heat dissipation and inferior electromagnetic wave (noise) control compared to metal, Sekisui Techno Molding's resin products ensure these functionalities. - A type that balances heat dissipation and electromagnetic wave shielding - ■ Heat dissipation and electromagnetic wave shielding resin molded products - Reduction of product temperature rise through heat diffusion - Electromagnetic wave shielding performance through conductivity - Lightweighting, increased design freedom, and mass production by replacing metal products With Sekisui Techno Molding's comprehensive system, we consistently support our customers from product planning to prototype development/testing, and then to mass production and sales, ensuring they achieve their ideal products.

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Vehicle-mounted camera and millimeter-wave radar housings made of resin that can counter ECM measures.

Proposal for resin molded products that ensure heat dissipation and electromagnetic wave shielding performance for vehicle-mounted cameras, millimeter-wave radar, and LiDAR housings.

Recently, the technologies of "Advanced Driver Assistance Systems (ADAS)" and "Autonomous Driving (AD)" have been steadily evolving. To ensure the stable operation of key technologies and important safety components such as "onboard cameras," "LiDAR," and "millimeter-wave radar," EMC (Electromagnetic Compatibility) measures have become a significant challenge. Sekisui Techno Molding's approach enables many resin products, which are inferior to metals in terms of heat dissipation and electromagnetic wave (noise) control, to achieve weight reduction and design flexibility through resin molding while ensuring these functionalities, leading to cost reductions through mass production. ■ Heat-conductive resin molded products (focused on heat dissipation) - Reduction of product temperature rise through heat diffusion - Weight reduction, improved design flexibility, and mass production by replacing metal products ■ Heat dissipation and electromagnetic wave shielding resin molded products (balancing heat dissipation and electromagnetic wave shielding) - Reduction of product temperature rise through heat diffusion - Electromagnetic wave shielding performance through conductivity enhancement - Weight reduction, improved design flexibility, and mass production by replacing metal products With Sekisui Techno Molding's comprehensive system, we consistently support our customers from planning and prototype development/verification to mass production and sales to realize their ideals.

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Promotional video [Heat dissipation and electromagnetic wave shielding resin molded products]

The video of the heat dissipation and electromagnetic wave shielding resin molded products has been completed.

This is a PR video for Sekisui's developed products: thermal conductive resin molded products and heat dissipation/electromagnetic wave shielding resin molded products.

  • plastic

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Thermal conduction molded products

Heat dissipation performance closer to metal materials than general-purpose resins! Proposing material and product design tailored to the quality requirements of various products.

At Sekisui Techno Molding, we handle "thermal conductive molded products." These molded products excel in the balance of impact resistance, lightweight, and thermal conductivity, offering heat dissipation performance closer to that of metal materials than general-purpose resins. Grades with low volume resistivity can be applied for EMC measures. We propose material and product designs tailored to the quality requirements of various products. Please feel free to contact us when you need assistance. 【Features】 ■ Achieves high heat dissipation and high impact resistance through unique material formulation technology ■ High lightweight effect achieved by resinizing metals ■ Product designs that leverage freedom of shape ■ Molded products with an excellent balance of impact resistance, lightweight, and thermal conductivity ■ Grades with low volume resistivity can be applied for EMC measures * For more details, please refer to the PDF materials or feel free to contact us.

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Related catalog(2)

Electromagnetic wave shielded molded products

Electromagnetic wave shielded molded products

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Thermal conduction molded products

Thermal conduction molded products

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積水テクノ成型
Resin/Plastic
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multi EA 5100 Elemental Analyzer

Web Seminar: Analytical Instrument Course - Basic Edition [Held on May 16] Sulfur, Nitrogen, Chlorine Analyzers, and TOC Analyzers

  • NEW
  • SEMINAR_EVENT

We are pleased to announce the upcoming webinar "Analytical Instruments Course - Basic Edition." This course is designed for anyone who will be involved in analytical work starting this spring, as well as those who wish to revisit the principles of analytical methods. This time, we will explain sulfur, nitrogen, and chlorine analysis instruments, as well as total organic carbon analysis instruments. If you are interested, please register for participation through the details and registration button. Start times: 14:00 - Nitrogen, Sulfur, and Chlorine Analysis Instruments 15:00 - Total Organic Carbon Analysis Instruments

Apr 10, 2026

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Web Seminar: Analytical Instrument Course - Basic Edition [Held on May 23] Microwave Sample Decomposition Device, Atomic Absorption, ICP Emission

  • NEW
  • SEMINAR_EVENT

We are pleased to announce the upcoming webinar "Analytical Instrument Course - Basics Edition." This course is designed for anyone who will be involved in analytical work starting this spring, as well as those who wish to revisit the principles of analytical methods. We believe that everyone will find the content satisfying. If you are interested, please register for participation using the application button. This time, the program will be held as follows: 1:00 PM - Microwave Sample Digestion System 2:00 PM - Atomic Absorption Spectrophotometer 3:00 PM - ICP Emission Spectrometer

Apr 10, 2026

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[Notice of Exhibition Participation by Fukuda Co., Ltd.] 2025 YOKOHAMA Automotive Technology Exhibition

[Notice of Exhibition Participation by Fukuda Co., Ltd.] 2025 YOKOHAMA Automotive Technology Exhibition

  • NEW
  • SEMINAR_EVENT

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely invite you to visit us during this busy time. 【 Exhibition Name 】 Automotive Technology Exhibition 2025 YOKOHAMA https://aee.expo-info.jsae.or.jp/ja/yokohama/ (An "online exhibition" will also be held during and around the event period) 【 Dates 】 May 21 (Wednesday) - 23 (Friday), 2024 10:00 AM - 6:00 PM *On the final day, 9:00 AM - 4:00 PM (Online exhibition: May 14 (Wednesday) - June 4 (Wednesday)) 【 Venue 】 Pacifico Yokohama (1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa Prefecture) Our booth number: "Concourse 505"

Apr 10, 2026

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[Notice of Exhibition Participation by Fukuda Co., Ltd.] 27th Interphex Week Tokyo

  • NEW
  • SEMINAR_EVENT

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to attend this event. 【 Exhibition Name 】 27th INTERPHEX Week Tokyo https://www.interphex.jp/tokyo/ja-jp.html 【 Dates 】 July 9 (Wednesday) - 11 (Friday), 2025 10:00 AM - 5:00 PM 【 Venue 】 Tokyo Big Sight (3-11-1 Ariake, Koto-ku, Tokyo 135-0063)

Apr 10, 2026

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Yocto Project Super Practical Online Course

Yocto Project Official Practical Course (LFD461-JP) June Announcement

  • NEW
  • SEMINAR_EVENT

The next official Yocto Project practical course (LFD461-JP) is scheduled to be held over three days from June 9 (Tuesday) to June 11 (Thursday), 2026. This practical course integrates the knowledge and know-how gained from Yocto-related development, support, and seminars conducted by Lino. We encourage companies that want to learn Yocto or utilize it more effectively to consider participating.

Apr 10, 2026

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