Yonata Electronics Co., Ltd. Announcement of Exhibition at OPIE '26

Supports eye pattern testing of ultra-fast optical signals at 1.6T/800G/400G!

The DCA6065 is a high-performance 65 GHz sampling oscilloscope. It features a 65 GHz optical port bandwidth and offers selectable 1/2/4 channel configurations. It has a built-in TDECQ feed-forward equalizer (FFE) with a maximum of 64 taps. It supports flexible network configurations and includes a clock data recovery (CDR) system with 120 GBaud, or an independent CDR module can be added as an option. 【Key Specifications (Partial)】 ■ Optical Bandwidth: 65 GHz ■ Wavelength Range: 1250–1600 nm ■ Supported Standard Rates: 106.25/112 GBaud PAM4, 53.125/56 GBaud PAM4 ■ ADC Resolution: 14 Bit *For more details, please download the PDF or feel free to contact us.

• oscilloscope

Supports PAM4/NRZ signals and covers the 1.6TBASE/CEI-224G standard!

The B3224 is a high-performance Bit Error Rate Tester (BERT) for physical layer characteristic evaluation and consistency testing. With excellent signal quality, a wealth of features, and flexible testing modes (integrated MCB or remote head), it provides powerful performance and flexibility from research and development to manufacturing testing of high-speed serial circuit products. It supports data rates from 24.33 to 120 Gbaud. The test patterns include various PRBS, SSPRQ, JP03A/B, Square Wave, and custom-defined patterns. 【Key Specifications (Partial)】 ■ Output Signal: Differential PAM4/NRZ (AC Coupled) ■ Output Amplitude: 800 mVp-p (Differential) ■ Rise/Fall Time: < 4.5 ps ■ Input Signal: Differential PAM4/NRZ (AC Coupled) ■ Clock Mode: Built-in Clock Recovery *For more details, please download the PDF or feel free to contact us.

• Tester

Supports high-density testing with up to 64 lanes (128 differential pairs)!

The "B6064C" is a high-density, versatile solution that supports bit error rate (BER) testing for high-speed cables compliant with PCIe 6.0 and earlier standards. Equipped with automatic link training and up to 40dB of insertion loss compensation, it is ideal for research and development, verification, and manufacturing testing of high-speed PCIe cables. It enables comprehensive system-level signal integrity verification in data center interconnects, providing essential quality assurance for cable manufacturers and system integrators. 【Key Specifications (Partial)】 ■ Test Unit: 2 x 64 Pair TRx ■ Terminal: AC Coupled ■ Supported Rates: 64GT/s, 32GT/s, 16GT/s, 8GT/s, 5GT/s, 2.5GT/s ■ Protocol Compliance: PCIe 6.0/5.0/4.0/3.0/2.0 *For more details, please download the PDF or feel free to contact us.

• Testing Equipment and Devices

Compact and cost-effective single/dual channel benchtop SMU!

The "B0201 & B1201" is a high-precision benchtop SMU that can simultaneously output and measure voltage and current. It is an ideal choice for various IV measurement tasks that require high resolution and accuracy. It offers a wide voltage source (±200V) and current source (±1A DC, ±3A pulse) functionality, excellent precision, and a 6.5-digit display (minimum display resolution of 1fA/100nV). Additionally, it features an outstanding color LCD graphical user interface. 【Main Specifications (Partial)】 ■ Maximum Output Voltage: ±200V ■ Maximum Output Current: ±1A (DC), ±3A (Pulse) ■ Maximum Output Power (per channel): 20W ■ Minimum Measurement Resolution: 1fA/100nV ■ Maximum Sampling Rate: 1MS/s *For more details, please download the PDF or feel free to contact us.

• Other electronic measuring instruments

Compact and cost-effective 4-channel/8-channel desktop precision source/measurement unit!

The "B2031 & B3031" is a high-precision benchtop SMU that has the capability to output and measure voltage and current simultaneously. It can output a maximum of ±30V and ±500mA (DC/Pulse), and features an excellent color LCD graphical user interface (GUI). It also supports traditional SMU SCPI commands. Transitioning from existing test code can be done quickly and easily. 【Key Specifications (Partial)】 ■ Model: B2031 (4 channels) / B3031 (8 channels) ■ Maximum Output: Voltage ±30V, Current ±500mA (DC/Pulse) ■ Minimum Measurement Resolution: Voltage 60µV, Current 100pA ■ Maximum Sampling Rate: 500 kS/s *For more details, please download the PDF or feel free to contact us.

• Other electronic measuring instruments

High-performance wafer-level test system compatible with wafers from 8 inches to 12 inches!

The "SWT5100" is a high-performance wafer-level test system designed for automated testing of silicon photonics wafers. It offers a fully automated testing process from wafer loading to optical alignment. Equipped with a chuck capable of temperature control from 25°C to 150°C, it supports optical, DC, and RF testing. It accommodates both GC and EC coupling and can be flexibly configured from single fibers to fiber arrays. 【Main Specifications (Partial)】 ■ Supported Wafer Size: 8 to 12 inches ■ Supported Wafer Thickness: 200 to 2000 um ■ Chuck Temperature Range: 25°C to 150°C ■ Supported Tests: Optical, DC, RF ■ Coupling Method: Grating coupling and edge coupling *For more details, please download the PDF or feel free to contact us.

• Tester

Achieved over 50% higher throughput compared to conventional serial testers by adopting Per-Pin architecture!

The "PPT8200" is a high-performance parallel parametric test system designed with a "Per-Pin" architecture to optimize test efficiency. Equipped with SMUs and PGUs for each pin, it achieves over 50% higher throughput compared to traditional serial testers. The advanced software environment simplifies the development of test programs. It accelerates mass production launches, supports array testing, and provides a solution that balances high reliability and cost efficiency. 【Key Specifications (Partial)】 ■ Architecture: Per-Pin Architecture ■ Number of Pins: 48 Pins ■ Configuration: Per-Pin SMU, Per-Pin PGU ■ Voltage Range: ±200V ■ Current Range: ±1A ■ Throughput: >50% improvement compared to serial testers *For more details, please download the PDF or feel free to contact us.

• Tester

Features: ● Equipped with Intel Core Ultra 9 285H/7 255H/5 225H ● DDR5 SODIMM x 2 (up to 128G) (sold separately) ● VGA Switch DDI x 1, LVDS colay eDP x 1, DDI x 2 ● USB 2.0 x 8, USB 3.2 Gen 2 x 4 ● PCIe [x1] x 4, PCIe [x4] x 1, PEG [x8] + [x4] + [x4] ● 2.5GbE x 1 ● COMe Type6 standard, 95mm x 95mm size ● Operating temperature -20~70℃ ● Sold separately ECB-920A: Development carrier board COM-MTHC6-FAN01: CPU fan COM-MTHC6-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Processor: Qualcomm QCS6490 with Arm Cortex-A78 ×4 + Cortex-A55 ×4 (Octa-core) up to 2.7GHz ● LPDDR5 onboard memory (up to 8GB) ● Display: MIPI-DSI (4 lanes) ×1, DisplayPort ×1 ● USB 2.0 ×4 (one port supports OTG), Gigabit Ethernet ×2

In civil engineering sites during extreme heat, the surface temperature of the ground plates and the heat reflection significantly affect the working environment. In particular, steel plates tend to retain heat when exposed to sunlight, posing challenges for workers' heatstroke prevention and safety management. Hyper CLT ground plates are civil engineering materials utilizing wood CLT. As wooden ground plates, they can be used for temporary roads, access routes, heavy machinery work yards, material storage areas, and pedestrian pathways, making them a versatile alternative to steel plates in various civil engineering sites. In actual sites, there are cases where the surface temperature differs by about 20 degrees compared to steel plates, making them effective as a solution for heat prevention and reflection suppression. The 5×10 plate weighs approximately 230 kg, and the 5×20 plate weighs about 460 kg, making them lightweight and easy to handle even with small machinery, which helps reduce the burden of transportation, installation, and removal. They are materials that easily promote noise reduction, CO2 fixation, and environmental consideration unique to wood. Registered as a Ministry of Land, Infrastructure, Transport and Tourism NETIS technology "TH-250021-A," they can also be utilized for creative ideas and safety measures in public works. They are recommended for companies looking to reassess the summer site environment. We also accept inquiries for consultations and requests for materials tailored to site conditions. We can propose solutions for temporary plans during summer for both public and private civil engineering projects. Please feel free to consult with us.

Metal cracks are one of the concerns in equipment maintenance operations. Conventional welding methods for repairs often change the base material around the crack due to heat, leading to residual stress and deformation, which constantly carries the risk of "crack recurrence" and "secondary damage." Hinode Waterworks Co., Ltd.'s "Mechanical Stitching Method" is a new technique that allows for the repair of metal cracks without applying heat. By using special bolts and reinforcement plates, the crack is physically removed without affecting the base material at all. Repairs can be made even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. For more details, please contact us or download the catalog.