5/15 Webinar "Changes in Joint Structures and Packaging Solutions Due to the Evolution of Semiconductors"

A comprehensive and detailed explanation of semiconductor packaging materials, from the basics to the latest technological trends!

"Latest Technological Trends in Semiconductor Packaging and Design/Evaluation Techniques for Semiconductor Encapsulants" [Features of this Book] - Comprehensive and detailed explanations from the basics of semiconductor encapsulants to the latest technological trends! - A wide range of topics including information on encapsulant raw materials such as epoxy resins and hardeners, tips for formulation design, an example of the manufacturing process, reliability evaluation, quality control, and the latest packaging trends! - Practical content based on the experiences of those with practical development experience in semiconductor encapsulants, including both failures and successes! - Introduction of the latest research and development, technological trends, and future prospects based on interviews and other sources! - An essential book for students, young researchers, development researchers, and practitioners! [Structure] Chapter 1: Semiconductor Devices Chapter 2: Semiconductor Packaging Chapter 3: Semiconductor Encapsulants Chapter 4: Evaluation of Encapsulants Chapter 5: Future of Semiconductor Encapsulants

• Other semiconductors
• Technical and Reference Books

Blueprint for the PFAS-free era! A thorough explanation of alternative materials and process optimization for each step, from ArF immersion to CMP and cleaning!

The Future of Semiconductor Manufacturing Worldwide: The Cutting Edge of PFAS-Free Strategies and Next-Generation Alternative Technologies [Features of this Book] - Transforming regulatory risks into opportunities! Presenting trends in PFAS regulations in Europe, the United States, and Asia, along with pathways for restructuring the semiconductor supply chain! - Maintaining equipment performance is key! Evaluating the practicality of PFAS-free materials in equipment components! - A weapon for chemists! What are the performance and introduction benefits of next-generation cleaning and stripping surfactants like POE and APG? - Lessons learned from "Types and Cases of Failure Challenges in PFAS-Free Strategies" to prevent critical yield declines! - An overview of PFAS-free initiatives and specific implementation plans, from piping and temperature control to cleanroom utilities! - Comparative analysis of the risks of short-chain/partially fluorinated derivatives and the characteristics of complete alternative candidates like silicone-based (PDMS) materials! - Practical strategies for engineers! Specific methods and case studies for "process condition optimization" aimed at reducing PFAS dependency! [Structure] 1. PFAS-Free Strategies and Alternative Technologies in the Semiconductor Field 2. Failures and Challenges of PFAS-Free Strategies in the Semiconductor Field 3. PFAS Alternatives in Semiconductor Manufacturing Processes 4. PFAS Alternatives in Manufacturing Equipment and Infrastructure 5. Alternative Candidate Substances and Future Prospects

• Other semiconductors
• Technical and Reference Books

A thorough explanation of semiconductor packaging from the basics to applications!

**Features of this Book** - Thorough explanations from the basics to applications of semiconductor packaging! - Detailed discussion on the noteworthy 2.5D/3D packaging and chiplet technology! - Introduction of valuable practical knowledge cultivated by the author over many years in the field! - Explanation of specific examples of defects and evaluation/analysis methods during prototyping and development! - What are the efforts towards RoHS and PFAS in response to environmental regulations? - A book that looks towards the future of semiconductor packaging! **Table of Contents** Part 1: Basics of Backend Processes, Assembly, and Design in Semiconductor Manufacturing 1. Introduction 2. Basics of Semiconductor Packaging - Evolution and Development of Packaging 3. Packaging Process (Representative Examples) 4. Technologies and Key Points of Each Manufacturing Process 5. Testing Processes and Their Key Points 6. An Example of Assembly and Implementation-Related Defects Experienced in the Past 7. Examples of Evaluation and Analysis Methods During Prototyping and Development 8. RoHS and Green Compliance 9. Future of 2.5D/3D Packaging and Chiplet Technology 10. Conclusion Part 2: Integration of Existing Chips through Chiplet Technology: Advantages, Disadvantages, and Technical Challenges Part 3: PFAS in Semiconductor Backend Processes *For a detailed table of contents, please refer to the related link URL.*

• Other semiconductors
• Technical and Reference Books
• others

Dear Sir or Madam, We hope this message finds you well and that your company continues to prosper. FUKUDA will be exhibiting at the AUTOMOTIVE ENGINEERING EXPOSITION 2026 YOKOHAMA. At this exhibition, we will be showcasing testing equipment such as Air Leak Tester for EV and Equipment Mounted Type Hydrogen Leak Detector. We sincerely hope you will take this opportunity to visit us. Yours sincerely, [Official Site] https://aee.expo-info.jsae.or.jp/en/yokohama/ [DATES] Wednesday, May 27, through Friday, May 29, 2026 10:00 a.m. - 5:00 p.m. [VENUE] PACIFICO Yokohama, Exhibition Hall, Booth No. ２７４ ※Online Exposition Website：Tuesday, May 19, through Tuesday, June 9, 2026

Dear Sir or Madam, We hope this message finds you well and that your company continues to prosper. FUKUDA will be exhibiting at the 28th INTERPHEX Week Tokyo. At the exhibition, we will be showcasing 100% inspection equipment compliant with Container Closure Integrity Testing (CCIT) standards, as well as sampling inspection machines. We sincerely invite you to visit our booth at this opportunity and would greatly appreciate your attendance despite your busy schedule. Yours sincerely, [Dates] May 20 (Wed) - 22 (Fri), 2026 10:00-17:00 (JST) [Venue] Makuhari Messe, Japan 8 Hall Booth No. 41 - 36

[Speaker] Toshiyuki Hirano, Evangelist, Smart Industry Promotion Office, Smart World Business Department, NTT Docomo Business Inc. [Key Lecture Content] The "Data Space" concept, originating in Europe, is driving significant transformations in the supply chains of the manufacturing industry. In this lecture, we will analyze leading examples such as Catena-X and Manufacturing-X from a neutral perspective, redefining compliance with regulations like carbon footprint and digital product passports (DPP) not merely as costs but as competitive strategies. Furthermore, we will consider the perspective of economic security in light of unstable geopolitical risks and explore the innovative impact that generative AI may have on inter-company data collaboration in the future. We will present directions on how Japanese companies can accurately understand domestic and international trends and autonomously advance practical data collaboration.

Kou AlphaX Co., Ltd. will be exhibiting at "Wireless Japan x Wireless Technology Park 2026," held at Tokyo Big Sight, West Hall 3 and 4. At our booth, we will showcase our original products, including the "Outdoor Power Supply Box ALPHIoT POWER" and the "Outdoor Power Supply Box with Power Line Switching Function ALPHIoT POWER CHANGER," which can be used as backup for solar power generation, as well as "SaFT lithium batteries." Additionally, a seminar by SaFT will be held. 【Exhibition Seminar】 - Date: May 29, 2026 (Friday) 13:25 - 13:45 - Venue: Seminar Room A - Seminar Title: What is a True "Wireless" Device? - The Role of Lithium Primary Batteries in Contributing to the Differentiation of IoT Devices - Speaker Profile: Takahiro Fujii, Saft Japan Co., Ltd. (Kou AlphaX Co., Ltd.) We look forward to your visit.

Tokyo System House Co., Ltd. (hereinafter referred to as "our company"), a system integrator, will exhibit at "FOOMA JAPAN 2026," which will be held from June 2 (Tuesday) to June 5 (Friday), 2026. At our booth (WA-06-02), we will primarily introduce the quality information management system "TOREPAS" for food manufacturers and the raw material specification document retrieval management service "TOREPAS BANK+." We will also showcase business automation solutions utilizing the RPA tool "Robopat AI." Attendees will have the opportunity to experience the usability and features through actual demonstrations, as well as confirm specific usage scenarios in their operations on the spot. Additionally, individual explanations and Q&A sessions with our representatives will help attendees gain a clearer understanding of the operational image post-implementation. Furthermore, we plan to introduce the latest examples of automation solutions using the RPA tool "Robopat AI," which strongly supports the promotion of DX and operational efficiency in food companies, along with our new service currently in development, the "Raw Material Label Text and Layout AI Check Service," and "TOREPAS on DAP," which combines the quality information management system with RPA solutions.